Effects of plasma power on the properties of low-k polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor

2000 ◽  
Vol 15 (1) ◽  
pp. 228-230 ◽  
Author(s):  
Jongryang Joo ◽  
Yong Chun Quan ◽  
Donggeun Jung
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Applied Field ◽  
Chemical Vapor ◽  
Relative Dielectric Constant ◽  
Organic Thin Films ◽  
Plasma Power ◽  
Low K

Effects of plasma power on the properties of polymerlike organic thin films deposited by plasma-enhanced chemical vapor deposition using the toluene precursor were studied. As the plasma power was increased from 5 to 60 W, the relative dielectric constant increased from 2.53 to 2.85. The film deposited at higher plasma power showed higher thermal stability. The film deposited at 60 W was stable up to 400 °C. All the films were insulating under applied field ≤1 MV/cm.

Study of porogen removal by atomic hydrogen generated by hot wire chemical vapor deposition for the fabrication of advanced low-k thin films

2015 ◽  
Vol 575 ◽  
pp. 103-106 ◽  
Author(s):  
S. Godavarthi ◽  
C. Wang ◽  
P. Verdonck ◽  
Y. Matsumoto ◽  
I. Koudriavtsev ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Atomic Hydrogen ◽  
Chemical Vapor ◽  
Hot Wire ◽  
Low K

Fabrication of Diazocine-Based Photochromic Organic Thin Films via Initiated Chemical Vapor Deposition

2020 ◽  
Vol 53 (4) ◽  
pp. 1164-1170
Author(s):  
Maximilian H. Burk ◽  
Stefan Schröder ◽  
Widukind Moormann ◽  
Daniel Langbehn ◽  
Thomas Strunskus ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Organic Thin Films ◽  
Initiated Chemical Vapor Deposition
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