The Effect of Heating Rate on the Porogen Behavior and Pore Sizes in the Methylsilsesquioxane/Porogen hybrid Low-k Films

2008 ◽  
Author(s):  
Jihperng Leu ◽  
Yu-Han Chen
Keyword(s):  
Heating Rate ◽  
Pore Sizes ◽  
Low K

Electron Probe Analysis of Vertebrate Smooth Muscle: Distribution of Ca and Ci

1976 ◽  
Vol 34 ◽  
pp. 334-335 ◽  
Author(s):  
Avril V. Somlyo ◽  
H. Shuman ◽  
A.P. Somlyo
Keyword(s):  
Smooth Muscle ◽  
Electron Probe ◽  
Preliminary Report ◽  
Cell Damage ◽  
Electron Probe Analysis ◽  
Perinuclear Space ◽  
Probe Analysis ◽  
High K ◽  
Low K ◽  
Initial Results

This is a preliminary report of electron probe analysis of rabbit portal-anterior mesenteric vein (PAMV) smooth muscle cryosectioned without fixation or cryoprotection. The instrumentation and method of electron probe quantitation used (1) and our initial results with cardiac (2) and skeletal (3) muscle have been presented elsewhere.In preparations depolarized with high K (K2SO4) solution, significant calcium peaks were detected over the sarcoplasmic reticulum (Fig 1 and 2) and the continuous perinuclear space. In some of the fibers there were also significant (up to 200 mM/kg dry wt) calcium peaks over the mitochondria. However, in smooth muscle that was not depolarized, high mitochondrial Ca was found in fibers that also contained elevated Na and low K (Fig 3). Therefore, the possibility that these Ca-loaded mitochondria are indicative of cell damage remains to be ruled out.

A TEM study of the influence of microstructure on the superplastic behavior of a U-5.8 wt.% Nb alloy

1986 ◽  
Vol 44 ◽  
pp. 568-569
Author(s):  
G. Mackiewicz Ludtka
Keyword(s):  
Grain Size ◽  
Heating Rate ◽  
Phase Field ◽  
Single Phase ◽  
Superplastic Behavior ◽  
Two Phase ◽  
Single Phase Field

Historically, metals exhibit superplasticity only while forming in a two-phase field because a two-phase microstructure helps ensure a fine, stable grain size. In the U-5.8 Nb alloy, superplastici ty exists for up to 2 h in the single phase field (γ1) at 670°C. This is above the equilibrium monotectoid temperature of 647°C. Utilizing dilatometry, the superplastic (SP) U-5.8 Nb alloy requires superheating to 658°C to initiate the α+γ2 → γ1 transformation at a heating rate of 1.5°C/s. Hence, the U-5.8 Nb alloy exhibits an anomolous superplastic behavior.

Optimization of the time the chromatograph thermostats exit to a given temperature

2020 ◽  
pp. 40-45
Author(s):  
Nadezhda O. Vzduleva ◽  
Valery B. Gitlin
Keyword(s):  
Heating Rate ◽  
Entire Range ◽  
Gas Chromatograph ◽  
Heating And Cooling ◽  
Operating Temperatures ◽  
The Stability

The problems of ensuring the stability of the temperature of the chromatographic experiment carried out using a serial gas chromatograph LGH-3000 are considered. Limiting the permissible heating rate of the chromatograph thermostats does not allow a quick transition to the new conditions of the chromatographic experiment in accordance with the requirements of the technical conditions. The processes of heating and cooling the thermostat are analyzed. It is shown that the ratio of the duration of the interval equal to the sum of the durations of the heating and cooling intervals to the duration of the heating interval is inversely proportional to the temperature of the chromatographic experiment. Based on this situation, an empirical algorithm is proposed for heating the thermostat to a given temperature, which made it possible to reduce the time it takes to reach a given temperature in the entire range of operating temperatures.

Deposition of Wave-shaped Layered Low-k Dielectric a-C:F Films by C8F18 Plasma CVD

2010 ◽  
Vol 130 (4) ◽  
pp. 319-324
Author(s):  
Kouichiro Mizuno ◽  
Hirotake Sugawara ◽  
Akihiro Murayama
Keyword(s):  
Plasma Cvd ◽  
Low K

Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects

2003 ◽  
Vol 766 ◽  
Author(s):  
Ahila Krishnamoorthy ◽  
N.Y. Huang ◽  
Shu-Yunn Chong
Keyword(s):  
Dielectric Layer ◽  
Dielectric Breakdown ◽  
Copper Ions ◽  
Dielectric Strength ◽  
Time Dependent ◽  
Breakdown Field ◽  
Field Range ◽  
Time Dependent Dielectric Breakdown ◽  
Voltage Ramp ◽  
Low K

AbstractBlack DiamondTM. (BD) is one of the primary candidates for use in copper-low k integration. Although BD is SiO2 based, it is vastly different from oxide in terms of dielectric strength and reliability. One of the main reliability concerns is the drift of copper ions under electric field to the surrounding dielectric layer and this is evaluated by voltage ramp (V-ramp) and time dependent dielectric breakdown (TDDB). Metal 1 and Metal 2 intralevel comb structures with different metal widths and spaces were chosen for dielectric breakdown studies. Breakdown field of individual test structures were obtained from V-ramp tests in the temperature range of 30 to 150°C. TDDB was performed in the field range 0.5 – 2 MV/cm. From the leakage between combs at the same level (either metal 1 or metal 2) Cu drift through SiC/BD or SiN/BD interface was characterized. It was found that Cu/barrier and barrier/low k interfaces functioned as easy paths for copper drift thereby shorting the lines. Cu/SiC was found to provide a better interface than Cu/SiN.

Influence of the Heating Rate on the Activation of Coal and Lignite Oxidation by Copper Nitrate

2020 ◽  
Vol 63 (8) ◽  
pp. 357-362
Author(s):  
K. B. Larionov ◽  
I. V. Mishakov ◽  
A. V. Zenkov ◽  
K. V. Slyusarskiy ◽  
A. A. Gromov
Keyword(s):  
Heating Rate ◽  
Copper Nitrate

Influence of heating rate and degree of oxidation on the ignition temperature

2018 ◽  
Vol 4 ◽  
pp. 25-35
Author(s):  
D.V. Miroshnichenko ◽  
V.Yu. Kramarenko ◽  
I.V. Shulga ◽  
Yu.S. Kaftan ◽  
N.A Desna ◽  
...  
Keyword(s):  
Heating Rate ◽  
Ignition Temperature ◽  
Degree Of Oxidation

Effect of heating rate inα+γdual-phase field on lamellar microstructure and creep resistance of a TiAl alloy

2005 ◽  
Vol 96 (6) ◽  
pp. 584-588
Author(s):  
Kouichi Maruyama ◽  
Jun Matsuda ◽  
Hanliang Zhu
Keyword(s):  
Heating Rate ◽  
Phase Field ◽  
Creep Resistance ◽  
Tial Alloy ◽  
Lamellar Microstructure
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