Shallow Contact Formation of Gadolinium Silicide

1983 ◽  
Vol 25 ◽  
Author(s):  
I. C. Cheng ◽  
S. S. Lau ◽  
R. D. Thompson ◽  
K. N. Tu

ABSTRACTGadolinium silicide with its attractive features of low formation temperature of about 350°C and low Schottky barrier height on n-type single-crystal silicon substrates (ϕnB1∼O.4ev,ϕpB ∼ 0.7ev) was chosen for studying the feasibility of forming shallow uniform contacts. Samples with various compositions prepared by both bilayer evaporation with a configuration of Si(α)/Gd/Si(xtl) and coevaporation with a Si−Gd /Si(xtl)structure were used for studying the contact formation as a function of composition and heat treatment. We found that shallow contact formation can be achieved provided that the following conditions are met: (a) for bilayer evaporation, the atomic ratio of Si(α)/Gd ≥ 2 should be maintained, (b) for coevaporation, the Si to Gd atomic ratio between 1.7 and 2.0 is desired. The bilayer deposition scheme appears to be a more convenient technique to use in practice.

JOM ◽  
2013 ◽  
Vol 65 (4) ◽  
pp. 567-573 ◽  
Author(s):  
Jiapeng Xu ◽  
Daniel Erickson ◽  
Sudesna Roy ◽  
Vinod Sarin

2019 ◽  
Vol 89 (7) ◽  
pp. 1086
Author(s):  
М.В. Кузьмин ◽  
М.А. Митцев

Adsorption of carbon monoxide (CO) molecules on ytterbium nanofilms with the thickness of 16 – 200 monolayers (6.1 – 76 nm) has been studied. The films are grown on single-crystal silicon substrates with the (111) surface orientation. It is shown that before the adsorption of CO molecules, ytterbium is divalent with the electronic configuration of [Xe]4f146s2. Upon the adsorption of gas molecules, a layer of trivalent ytterbium (the electronic configuration is [Xe]4f135d16s2), which is adjacent to the film surface, is formed. Evaluations of the thickness of the layer modified by adsorbed CO molecules are performed. Such evaluations have given rise to the values within 9 – 22 monolayers (3.4 – 8.4 nm).


1985 ◽  
Vol 54 ◽  
Author(s):  
E. Bauser ◽  
D. KÄss ◽  
M. Warth ◽  
H. P. Strunk

ABSTRACTSingle-crystal silicon layers and doping multilayers have been grown by liquid phase qpitaxy on silicon substrates. The substrates were either partially masked by SiO2, with via holes of various shapes and sizes, or patterned with SiO2 stripes, or profiled with grooves and ridges. The via holes and grooves were just refilled, or they acted as seeding areas for lateral overgrowth of the oxidized wafer up to 100μm. The silicon layers, interfaces and heterointerfaces were free of defects. With appropriate growth conditions the surfaces and interfaces of the epitaxial Si were outstandingly planar.


2019 ◽  
Vol 5 (1) ◽  
pp. 13-19
Author(s):  
Victor E. Asadchikov ◽  
Irina G. Dyachkova ◽  
Denis A. Zolotov ◽  
Yuri S. Krivonosov ◽  
Vladimir T. Bublik ◽  
...  

The quality and structural perfection of single crystal silicon have been studied using double-crystal X-ray diffraction after hydrogen ion implantation and thermal annealing used in a number of semiconductor technologies. The fundamental difference of this approach is the possibility to rapidly obtain reliable experimental results which were confirmed using X-ray topography. Data have been presented for the condition of the damaged layer in n-type silicon single crystals (r = 100 W × cm) having the (111) orientation and a thickness of 2 mm after proton implantation at energies E = 200, 300 and 100 + 200 + 300 keV and dose D = 2 × 1016 cm-2 and subsequent heat treatment in the T = 100–900 °C range. Using the method of integral characteristics we have revealed a nonmonotonic dependence of the integral characteristics of the damaged layer, i.e., the mean effective thickness Leff and the mean relative deformation Da/a, on the annealing temperature, the maximum deformation being observed for ~300 °C. The results have allowed us to make a general assessment of the damaged layer condition after heat treatment.


1994 ◽  
Vol 356 ◽  
Author(s):  
S. D. McAdams ◽  
T. Y. Tsui ◽  
W. C. Oliver ◽  
G. M. Pharr

AbstractScratch testing has long been used to assess the adhesion of a film to its substrate. As film thicknesses have decreased, the need for greater precision and sensitivity in the scratch testing apparatus has increased. To this end, a nanoindenter was modified to make finely controlled, low-load scratches. Scratches at various loads and two orientations of a Berkovich scratching diamond were made in films of 100 nm of gold and 200 nm of copper, each on single crystal silicon. For each film type, samples with no interlayer, with an SiO2 interlayer, and with a TiW on SiO2 interlayer were tested. The scratch morphology was found to vary in a regular way with load, diamond orientation and interlayer material.


1981 ◽  
Vol 4 ◽  
Author(s):  
M. Lerme ◽  
T. Ternisien D'ouville ◽  
Duy-Phach Vu ◽  
A. Perio ◽  
G.A. Rozgonyi ◽  
...  

ABSTRACTExplosive crystallisation induced by an electron beam and by a CW Ar+ laser operating in fast scanning mode is observed for the first time on amorphized silicon layers created by implantation on either polycrystalline films deposited on Si02 or single crystal silicon substrates. The grain structure in the explosive crescents is studied by preferential chemical etching in conjunction with Nomarski optical microscopy, SEM and TEM. The results are similar to the so-called solid-phase explosive crystallization previously observed in a-Si films deposited on glass substrates.


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