A New Local Electronic Stopping Model for the Monte Carlo Simulation of Arsenic Ion Implantation into (100) Single-Crystal Silicon

1995 ◽  
Vol 389 ◽  
Author(s):  
S.-H. Yang ◽  
S. Morris ◽  
S. Tian ◽  
K. Parab ◽  
A. F. Tasch ◽  
...  

ABSTRACTIn this paper is reported the development and implementation of a new local electronic stopping model for arsenic ion implantation into single-crystal silicon. Monte Carlo binary collision (MCBC) models are appropriate for studying channeling effects since it is possible to include the crystal structure in the simulators. One major inadequacy of existing MCBC codes is that the electronic stopping of implanted ions is not accurately and physically accounted for, although it is absolutely necessary for predicting the channeling tails of the profiles. In order to address this need, we have developed a new electronic stopping power model using a directionally dependent electronic density (to account for valence bonding) and an electronic stopping power based on the density functional approach. This new model has been implemented in the MCBC code, UT-MARLOWE The predictions of UT-MARLOWE with this new model are in very good agreement with experimentally-measured secondary ion mass spectroscopy (SIMS) profiles for both on-axis and off-axis arsenic implants in the energy range of 15-180 keV.

1996 ◽  
Vol 438 ◽  
Author(s):  
S. J. Morris ◽  
B. Obradovic ◽  
S.-H. Yang ◽  
A. F. Tasch ◽  
L. Rubin

AbstractAn electronic stopping power model for boron, arsenic, and phosphorus ion implantation into single-crystal Si is reported over the energy range from a few keV to several MeV, for both offand on-axis implant angles relative to the <100> crystallographic direction. Combined with previously developed models for damage accumulation, this model allows physically-based simulation of 3-D profiles over an extremely wide range of implant conditions. In particular, this allows modeling of MeV implants which are being used more and more frequently.


1996 ◽  
Vol 9 (1) ◽  
pp. 49-58 ◽  
Author(s):  
Shyh-Horng Yang ◽  
S.J. Morris ◽  
Shiyang Tian ◽  
K.B. Parab ◽  
A.F. Tasch

1996 ◽  
Vol 439 ◽  
Author(s):  
S. J. Morris ◽  
B. Obradovic ◽  
S. -H. Yang ◽  
A. F. Tasch ◽  
L. Rubin

AbstractAn electronic stopping power model for boron, arsenic, and phosphorus ion implantation into single-crystal Si is reported over the energy range fr'om a few keV to several MeV, for both offand on-axis implant angles relative to the <100> crystallographic direction. Combined with previously developed models for damage accumulation, this model allows physically-based simulation of 3-D profiles over an extremely wide range of implant conditions. In particular, this allows modeling of MeV implants which are being used more and more frequently.


Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.


Author(s):  
S. A. Vabishchevich ◽  
S. D. Brinkevich ◽  
V. S. Prosolovich ◽  
N. V. Vabishchevich ◽  
D. I. Brinkevich

1996 ◽  
Vol 143 (11) ◽  
pp. 3784-3790 ◽  
Author(s):  
S.‐H. Yang ◽  
C. M. Snell ◽  
S. J. Morris ◽  
S. Tian ◽  
K. Parab ◽  
...  

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