Analysis of the Mechanical Failure in a Multilayered Thin Film System Tested by Microtensile Loading
AbstractMultilayered thin films were deposited on pure Al substrate test bars for in situ scanning electron microscope (SEM) microtensile deformation. The films consisted of a TiN layer covered by either SiO2 or W. Deformation of the samples showed that the TiN film dominated cracking events and caused cracking in the W to occur at lower critical stress values than previously reported. Crack deflections along the TiN-W interface were also seen. W film strain was measured by X-ray diffraction before and after testing to look at the effect of cracking and deformation on stress in this film.
2012 ◽
Vol 715-716
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pp. 461-466
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