Synthesis and Properties of Crystalline Carbon Nitride Composite Superhard Coatings

1995 ◽  
Vol 403 ◽  
Author(s):  
Yip-Wah Chung
Keyword(s):  
Smooth Surface ◽  
Carbon Nitride ◽  
Multilayer Coatings ◽  
Substrate Bias ◽  
Nitrogen Partial Pressure ◽  
Dc Magnetron Sputtering ◽  
Tin Coatings ◽  
Crystalline Films ◽  
Superhard Coatings ◽  
Sputtering System

AbstractMultilayer carbon nitride/TiN coatings were synthesized using a dual-cathode dc magnetron sputtering system. Fully crystalline films can be obtained when the thickness of the carbon nitride component is on the order of one nm. There appears to be a strong correlation between the occurrence of strong TiN(111) texture and the hardness of these multilayer coatings, as controlled by target powers, nitrogen partial pressure and substrate bias. These coatings can be synthesized at near room temperatures, with smooth surface morphology and hardness in the range of 45–55 GPa.

TiN Protective Coating on NdFeB by DC Magnetron Sputtering

2012 ◽  
Vol 482-484 ◽  
pp. 1130-1133
Author(s):  
Jin Long Li ◽  
Shou Dong Mao ◽  
Zhen Lun Song ◽  
Qun Ji Xue
Keyword(s):  
Corrosion Resistance ◽  
Magnetron Sputtering ◽  
Partial Pressure ◽  
Protective Coating ◽  
Nitrogen Pressure ◽  
Scratch Resistance ◽  
Nitrogen Partial Pressure ◽  
Dc Magnetron Sputtering ◽  
Tin Coating ◽  
Tin Coatings

TiN protective coating was prepared on NdFeB by DC magnetron sputtering to improve the corrosion resistance and scratch resistance of the magnetic. During deposition, the nitrogen/argon mixture gas was introduced into the chamber with the nitrogen partial pressure at 20 % and 10 % and the bias of 200 V was applied to subtract, respectively. At a lower nitrogen partial pressure of 10%, TiN coating was composed of many particles with an irregular shape. With increasing the nitrogen pressure to 20%, composing particles become small and show as the regular trihedron shape. All TiN coatings have a cubic structure. The bias makes the depositing TiN coating denser and preferential growth become no obvious. By the nitrogen partial pressure of 20 % and bias of 200 V, the dense TiN coating has best corrosion resistance and excellent wear resistance.

Tunable ion flux density and its impact on AlN thin films deposited in a confocal DC magnetron sputtering system

2018 ◽  
Vol 348 ◽  
pp. 159-167 ◽  
Author(s):  
M. Trant ◽  
M. Fischer ◽  
K. Thorwarth ◽  
S. Gauter ◽  
J. Patscheider ◽  
...  
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Flux Density ◽  
Ion Flux ◽  
Dc Magnetron Sputtering ◽  
Sputtering System

scholarly journals Hands-on project aimed at technical education: realizing a dc magnetron sputtering system

2021 ◽  
Author(s):  
Sonny Massahi ◽  
Desiree Ferreira ◽  
Michael Avngaard ◽  
Aksel Christensen ◽  
Daniel Haugbølle ◽  
...  
Keyword(s):  
Magnetron Sputtering ◽  
Technical Education ◽  
Dc Magnetron Sputtering ◽  
Hands On ◽  
Sputtering System

Spontaneous Growth of Nickel Silicide Nanowires and Formation of Self-Assembled Nanobridges by the Metal Induced Growth Method

2005 ◽  
Vol 872 ◽  
Author(s):  
Joondong Kim ◽  
Wayne A. Anderson ◽  
Young-Joo Song
Keyword(s):  
Low Temperatures ◽  
Nickel Silicide ◽  
Dc Magnetron Sputtering ◽  
Growth Property ◽  
Growth Method ◽  
Self Assembled ◽  
Metal Induced Growth ◽  
Lift Off ◽  
Si Wafer ◽  
Sputtering System

AbstractNickel monosilicide (NiSi) nanowires (NWs) have been fabricated by the metal induced growth (MIG) method. Ni as a catalyst was deposited on a SiO2 coated Si wafer. In a DC magnetron sputtering system, the Ni reacts at 575°C with sputtered Si to give nanowires. Different metal catalysts (Co and Pd) were used to prove the MIG NW growth mechanism. NiSi NWs were a single crystal structure, 20-80 nm in diameter and 1-10 μm in length. The linear NW growth property provided nanobridge formation in a trenched Si wafer. The trenches in a Si wafer were made by dry etching and a simple, conventional metal lift off method. The self-assembled nanobridge can be applied to form nanocontacts at relatively low temperatures. The MIG NB is a promising 1 dimensional nanoscale building block to satisfy the need of ‘self and direct’ assembled ‘bottom-up’ fabrication concepts.

Effect of substrate bias on the bonding structure of carbon nitride thin films

1999 ◽  
Vol 355-356 ◽  
pp. 85-88 ◽  
Author(s):  
A.K.M.S. Chowdhury ◽  
D.C. Cameron ◽  
M.A. Monclus
Keyword(s):  
Thin Films ◽  
Carbon Nitride ◽  
Substrate Bias ◽  
Bonding Structure

Influence of Zr Doping on the Tribological Properties of Amorphous Carbon-Nitride Coating

2019 ◽  
Vol 823 ◽  
pp. 9-14
Author(s):  
Yen Liang Su ◽  
Sun Hui Yao ◽  
Yu Chen Lai ◽  
Huang Ming Wu
Keyword(s):  
Magnetron Sputtering ◽  
Amorphous Carbon ◽  
Carbon Nitride ◽  
Tribological Behavior ◽  
Nitride Coating ◽  
Wear Performance ◽  
Amorphous Carbon Nitride ◽  
Pin On Disk ◽  
Nanohardness Tester ◽  
Sputtering System

This study aimed to understand the influence of small amount of Zr doping of amorphous carbonitride (a-CN) coatings on the structure, and mechanical and tribological behavior. The coatings were prepared using a four-target close-field unbalance magnetron sputtering system; two graphite, one Ti and one Zr targets were used. GDOS, SEM, XRD and XPS were used. A surface profilometer, a nanohardness tester, and a pin-on-disk wear tester were used. It was found the Zr doping resulting in the formation of ZrC and ZrN phases within the coating and the increase in the sp3 bonding fraction. The nanohardness was increased and the wear performance was largely improved.

FORMATION OF TRIANGULAR Cu MICROCRYSTALS IN Ti/Cu/Si THIN FILMS DURING ANNEALING

2018 ◽  
Vol 25 (05) ◽  
pp. 1850097
Author(s):  
QIJING LIN ◽  
WEIXUAN JING ◽  
ZHUANGDE JIANG ◽  
NA ZHAO ◽  
ZIRONG WU ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Magnetron Sputtering ◽  
Rapid Thermal Annealing ◽  
Dc Magnetron Sputtering ◽  
Triangular Pyramid ◽  
Single Side ◽  
Surface Patterns ◽  
Cu Thin Film ◽  
Sputtering System

Sandwich stacked Ti/Cu/Si thin films were deposited on a single-side polished Si(111) substrate using DC magnetron sputtering system and annealed using a rapid thermal annealing (RTA) system. Complex dendritic patterns, whose branches are composed of Cu rods and triangular Cu microcrystals were obtained on Ti/Cu thin film annealed at 700[Formula: see text]C. The shape of one triangular Cu microcrystal is a truncated equilateral triangular pyramid with a flat top. Triangular Cu microcrystals grow in the number when Ti/Cu thin films are annealed at 800[Formula: see text]C. Experimental results show that anisotropy affects the growth of surface patterns and the top Ti capping layer works as a protection for the underlying Cu layer from oxidation.

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