Rapid Thermal Annealing of Ni/Al/Si and Ni/Si Systems

1986 ◽  
Vol 74 ◽  
Author(s):  
A. Katz ◽  
Y. KOMEM
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Thermal Processing ◽  
Reference System ◽  
Diffusion Processes ◽  
Eutectic Temperature ◽  
Melting Process ◽  
Polycrystalline Layer ◽  
Smooth Interface ◽  
And Diffusion

AbstractThe effect of Rapid Thermal Annealing on phase formation and diffusion processes in the Ni(30 nm) /Al(10 nm)/Si system was studied and coxpared to a Ni(30 nm)/Si reference system. Heat treatments were carried out at temperatures between 400°C and 900°C for 2 seconds.The results obtained by means of TEM, AES and XRD indicated that the Ni/Al/Si system underwent a local melting in the intermediate Al layer at the Al/Si eutectic temperature (577°C). This reaction, due to the rapid melting process, resulted in formation of a unique layered-structure composed of a columnar polycrystalline layer (60 nm thick) of Ni2Si and NiSi adjacent to the Si substrate with relatively smooth interface and an outer layer of two separate polycrystalline films (both about 10 m thick) of Al3Ni (inside) and Ni(Al0.5Si0.5 ) (outside). Under the same rapid thermal processing conditions the Ni/Si reference system underwent a solid state reaction which resulted in the formation of a polycrystalline layer (60 nm thick) composed of Ni2Si and NiSi as well as NiSi2.

Phenomenology of the heating, melting and diffusion processes in Au nanoparticles

2021 ◽  
Author(s):  
Dalía S. Bertoldi ◽  
Emmanuel N. Millán ◽  
A. Fernández Guillermet
Keyword(s):  
Au Nanoparticles ◽  
Diffusion Processes ◽  
Melting Process ◽  
Physico Chemical ◽  
And Diffusion

The paper reports the results of a MD study of the heating and melting process of Au nanoparticles. A physico-chemical isomerization-like model of the melting step accounts for structural, thermodynamic and diffusion results, trends and interrelations.

Formation and Morphology Evolution of Nickel Germanides on Ge (100) under Rapid Thermal Annealing

2004 ◽  
Vol 810 ◽  
Author(s):  
K.Y. Lee ◽  
S.L. Liew ◽  
S.J. Chua ◽  
D.Z. Chi ◽  
H.P. Sun ◽  
...  
Keyword(s):  
Grain Growth ◽  
Sheet Resistance ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Microstructure Evolution ◽  
Interfacial Microstructure ◽  
Morphology Evolution ◽  
Smooth Interface ◽  
Substrate Side ◽  
Nickel Germanides

ABSTRACTPhase formation and interfacial microstructure evolution of nickel germanides formed by rapid thermal annealing in a 15-nm Ni/Ge (100) system have been studied. Coexistence of a NiGe layer and Ni-rich germanide particles was detected at 250°C. Highly textured NiGe film with a smooth interface with Ge was observed. Annealing at higher temperatures resulted in grain growth and severe grooving of the NiGe film at the substrate side, followed by serious agglomeration above 500°C. Fairly low sheet resistance was achieved in 250-500°C where the NiGe film continuity was uninterrupted.

Fast Diffusion in Germanium and Silicon Investigated by Lamp-Based Rapid Thermal Annealing

2008 ◽  
Vol 573-574 ◽  
pp. 35-43 ◽  
Author(s):  
Nicolaas Stolwijk ◽  
Ludmila Lerner ◽  
Axel Giese ◽  
Wilfried Lerch
Keyword(s):  
Temperature Measurement ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Isothermal Annealing ◽  
Diffusion Processes ◽  
Fast Diffusion ◽  
Scientific Impact ◽  
Accurate Temperature ◽  
Accurate Temperature Measurement

The study of fast diffusion processes in materials requires short isothermal annealing treatments combined with an accurate temperature measurement. The paper discusses the special demands on rapid thermal annealing (RTA) devices in diffusion research and how these can be met in practice. The scientific impact of RTA for diffusion research in semiconductors is demonstrated by several examples dealing with fast impurities in Ge and Si.

Rapid Thermal Annealing and Oxidation of Silicon Wafers with Back-Side Films

1997 ◽  
Vol 470 ◽  
Author(s):  
A. T. Fiory
Keyword(s):  
Thermal Oxidation ◽  
Sheet Resistance ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Temperature Control ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Oxide Thickness ◽  
Back Side ◽  
Control Accuracy

ABSTRACTTemperatures for lamp-heated rapid thermal processing of wafers with various back-side films were controlled by a Lucent Technologies pyrometer which uses a/c lamp ripple to compensate for emissivity. Process temperatures for anneals of arsenic and boron implants were inferred from post-anneal sheet resistance, and for rapid thermal oxidation, from oxide thickness. Results imply temperature control accuracy of 12°C to 17°C at 3 standard deviations.

The Ion Implanted Arsenic Tail in Silicon

1989 ◽  
Vol 147 ◽  
Author(s):  
S. E. Beck ◽  
R. J. Jaccodine ◽  
C. Clark
Keyword(s):  
Silicon Dioxide ◽  
Thermal Annealing ◽  
Anodic Oxidation ◽  
Rapid Thermal Annealing ◽  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Electrical Activation ◽  
Spreading Resistance ◽  
Transient Spectroscopy ◽  
And Diffusion

AbstractRapid thermal annealed tail regions of shallow junction arsenic implants into silicon have been investigated. Tail profiles have been roduced by an anodic oxidation and stripping technique after implantation to fluences of 1014 to 1016 cm−2 and by implanting through a layer of silicon dioxide. Electrical activation and diffusion have been achieved by rapid thermal annealing in the temperature range of 800 to 1100 °C. Electrically active defects remain after annealing. Spreading resistance and deep level transient spectroscopy results are presented. The diffusion of the arsenic tail is discussed and compared with currently accepted models.

Doping properties of the Ion-Beam-Sputtered SiGe Film

1996 ◽  
Vol 441 ◽  
Author(s):  
Wen-Jie Qi ◽  
Zhi-Sheng Wang ◽  
Zhi-Guang Gu ◽  
Guo-Ping Ru ◽  
Guo-Bao Jialig ◽  
...  
Keyword(s):  
Ion Implantation ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Ion Beam ◽  
X Ray Diffraction ◽  
Electrical Measurements ◽  
Polycrystalline Structure ◽  
X Ray ◽  
Post Annealing ◽  
And Diffusion

AbstractThe ion-beam-sputtered polycrystalline SiGe film and its doping properties have been studied. Boron and phosphorus have been doped into the sputtered poly-SiGe film by ion implantation and diffusion. To activate the implanted impurities, both rapid thermal annealing and fiirnace annealing have been used. The electrical measurements show that boron and plhosphorus can be doped into sputtered SiGe films and effectively activated by both ion implantation with post-annealing and diffiision. Hall mobilities as high as 31 cm2/V-s and 20 cm2/V.s have been obtained in B-difflhsed and P-diffused SiGe films, respectively. The x-ray diffraction spectra of the sputtered Sifie filhn show its typical polycrystalline structure with (111), (220) and (311) as the preferential orientations.

Correlated photoluminescence spectroscopy investigation of grain boundaries and diffusion processes in nanocrystalline and amorphous silicon (nc-Si:H) mixtures

2011 ◽  
Vol 1321 ◽  
Author(s):  
Jeremy D. Fields ◽  
K. G. Kiriluk ◽  
D. C. Bobela ◽  
L. Gedvilas ◽  
P. C. Taylor
Keyword(s):  
Fourier Transform ◽  
Thermal Annealing ◽  
Diffusion Processes ◽  
Volume Fraction ◽  
Nanocrystalline Silicon ◽  
Silicon Alloys ◽  
Thermally Driven ◽  
Grain Boundary Characteristics ◽  
Boundary Characteristics ◽  
And Diffusion

ABSTRACTPhotoluminescence (PL) spectra obtained with correlated set of experiments investigating grain boundary characteristics and diffusion processes in nanocrystalline silicon alloys (nc-Si:H), provide insight regarding formation and passivation of electronic defects in these regions. Based upon current results and previous works we believe thermally driven processes induce a PL band centered at 0.7 eV upon thermal annealing, and most likely involve diffusion of hydrogen and oxygen near interfaces. A nc-Si:H sample set with varied crystal volume fraction, Xc, was subject to thermal annealing treatments at different temperatures – each exceeding the deposition temperature. Fourier-transform photoluminescence (FTPL) and Fourier-transform infrared absorption spectroscopy (FTIR), were employed to correlate the relative 0.7 eV defect band emergence with compositional changes indicative of Si–Hx and Si–O species, for each sample, at each temperature, respectively. Hydrogen effusion data provide additional perspective.We find the Xc to strongly affect susceptibility of nc-Si:H to oxygen related effects. The higher the Xc, the more readily oxygen penetrates the nc-Si:H network. We attribute this relationship to elevated diffusivity of oxygen in highly crystalline nc-Si:H materials, owing to their abundance of gain boundaries and interfaces, which serve as pathways for impurity migration. These findings corroborate the expectation that oxygen impurities and diffusion processes contribute to development of microstructural features giving rise to radiative recombination through deep defects in nc-Si:H.

Mg implant activation and diffusion in GaAs during rapid thermal annealing in arsine ambient

1990 ◽  
Vol 67 (6) ◽  
pp. 2857-2861 ◽  
Author(s):  
H. Tews ◽  
R. Neumann ◽  
A. Hoepfner ◽  
S. Gisdakis
Keyword(s):  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
And Diffusion
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