Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric Films

2003 ◽  
Vol 766 ◽  
Author(s):  
Do Y. Yoon ◽  
Hyun Wook Ro ◽  
Eun Su Park ◽  
Jin-Kyu Lee ◽  
Hie-Joon Kim ◽  
...  
Keyword(s):  
Copper Interconnects ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Structure And Properties ◽  
Structure Property ◽  
Detailed Structure ◽  
Low Dielectric ◽  
Structure Property Relationships ◽  
Mechanical Modulus ◽  
Made In

AbstractPolysilsesquioxanes (PSSQs) with the empirical formula (RSiO3/2)n have become very important as low-dielectric insulators for copper interconnects in the next-generation logic devices, but the detailed structure-property relationships were completely lacking. We have investigated the microstructure and functional properties of PSSQs with varying alkyl substituents and also PSSQ copolymers. As a result, significant advances have been made in the scientific understanding of PSSQ structures and significant improvements of key properties such as the crack resistance, mechanical modulus and hardness, and incorporation of nanometer-sized (<4 nm) porosity for ultra-low dielectric constants (<2.0).

Insoluble, Low Dielectric Polyimides

1990 ◽  
Vol 214 ◽  
Author(s):  
Diane M. Stoakleya ◽  
Anne K. St. Clair
Keyword(s):  
Dielectric Constants ◽  
Structure Property ◽  
Polyimide Films ◽  
Electronic Interactions ◽  
Excellent Thermal Stability ◽  
Low Dielectric ◽  
Structure Property Relationships ◽  
Enhanced Solubility ◽  
Hydraulic Fluids ◽  
Image Position

ABSTRACTStudies have been conducted at NASA Langley establishing structure-property relationships in polyimides that provide a means of lowering dielectric constants by reducing chain-chain electronic interactions and by incorporation of fluorine into the polymer molecular structure. The resulting polyimides exhibit excellent thermal stability and mechanical strength, improved resistance to moisture and enhanced solubility. Most polyimides containing fluorine in only one monomer are at least partially soluble in common organic solvents, and polyimides containing fluorine in both the dianhydride and the diamine are fully soluble. Although this enhanced solubility aides processability and is desirable for many applications, it is a severe disadvantage for aircraft applications where exposure to hydraulic fluids and other chemicals is likely to occur. This work involves the development of insoluble, low dielectric polymers prepared from 2, 2-bis[4-(3, 4-dicarboxyphenoxy)phenyl]hexafluoropropane dianhydride (BFDA) and selected fluorine-containing diamines.BFDA-containing polyimide films had dielectric constants that ranged from 2.44 to 2.53 at 10 GHz and exhibited insolubility in solvents including N, N-dimethylacetamide, chloroform, diglyme and N-methylpyrrolidinone.

Structure–property relationships of aromatic polyamides and polythioamides: comparative consideration with those of analogous polyesters, polythioesters and polydithioesters

RSC Advances ◽  
2015 ◽  
Vol 5 (117) ◽  
pp. 96611-96622 ◽  
Author(s):  
Masayuki Nagasawa ◽  
Tatsuya Ishii ◽  
Daisuke Abe ◽  
Yuji Sasanuma
Keyword(s):  
Structure And Properties ◽  
Structure Property ◽  
Aromatic Polyamides ◽  
Structure Property Relationships

The structure and properties of aromatic polyamides and polythioamides were investigated and compared with those of analogous polyesters, polythioesters, and polydithioesters.

Development of Structure-Property Relationships in Disordered Zirconia Thin Films for High Energy Density Mim Capacitors

2006 ◽  
Vol 969 ◽  
Author(s):  
Guneet Sethi ◽  
Michael T. Lanagan ◽  
Eugene Furman ◽  
Mark W. Horn
Keyword(s):  
Thin Films ◽  
High Energy ◽  
Dc Conductivity ◽  
High Energy Density ◽  
Dielectric Films ◽  
Structure Property ◽  
Gate Oxides ◽  
Low Frequencies ◽  
Structure Property Relationships ◽  
Mim Capacitors

AbstractAmorphous zirconium oxide thin films were prepared by reactive magnetron sputtering. The dielectric films were characterized by impedance spectroscopy with temperature. The effect of annealing on capacitor performance was studied. Annealing gold electroded thin films at 250°C greatly reduced the losses with little changes in crystallinity. Space charge relaxation started to appear at 190°C. The activation energy for the relaxation was 0.84 eV with a very low relaxation frequency at room temperature (0.23μHz). Electrode effects dominated at very low frequencies at all temperatures. AC conductivity followed the universality behavior for the AC charge transport showing that the films are highly disordered. No DC conductivity regime was observed indicating that DC conductivity is very low. DC conductivity of the films was of the order of 10−13 S/m, which is lesser than the comparable thickness high quality gate oxides.

The Relations between Polymer Structure and Properties in Urethans

1960 ◽  
Vol 33 (5) ◽  
pp. 1259-1292 ◽  
Author(s):  
J. H. Saunders
Keyword(s):  
Polymer Structure ◽  
Future Research ◽  
Reliable Control ◽  
Structure And Properties ◽  
Structure Property ◽  
Structure Property Relationships ◽  
Precise Knowledge ◽  
Polymer Properties ◽  
Wide Range ◽  
The Many

Abstract Sufficient data are available from studies of urethan foams and elastomers to draw semiquantitative conclusions regarding the effect of any gross structural change on most polymer properties. These relationships apply to other areas of application as well, e.g., coatings, adhesives and sealants. Future research may be expected to provide more reliable control of the many reactions involved in preparing urethans, thus better control over structure. Similarly a more quantitative and extensive knowledge of polymer properties may be expected. The result of these combined efforts will be a more precise knowledge of structure-property relationships and an improved ability to produce polymers having the properties desired for a wide range of applications.

Effects of Electron Beam Exposure on Poly(Arylene Ether) Dielectric Films

1997 ◽  
Vol 476 ◽  
Author(s):  
J. S. Drage ◽  
J. J. Yang ◽  
D. K. Choi ◽  
R. Katsanes ◽  
K. S. Y. Lau ◽  
...  
Keyword(s):  
Electron Beam ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Large Area ◽  
Dielectric Coatings ◽  
Low Dielectric ◽  
Arylene Ether ◽  
Excellent Candidate ◽  
Before And After ◽  
Beam Dose

AbstractThis paper presents a study of the effects of electron beam (e-beam) exposure on the chemical and physical properties of FLARE™ 1.0X, a non-fluorinated member of the FLARE™ family of poly(arylene ether) dielectric coatings. Spin-coated films of this poly(arylene ether) were cured by large-area e-beam exposure, as well as by conventional thermal processing. Neither swelling nor dissolution was observed for the e-beam cured films after immersion in N-methylpyrrolidone (NMP) at 90 °C for 1 hour. The glass transition temperature (Tg) for films cured with a low e-beam dose is slightly higher than, or nearly the same as, the (Tg) for thermally-cured films (∼ 270 °C). However, the Tg for films cured with a high e-beam dose exceeds 400 °C. Dielectric constants of e-beam cured films and thermally cured films are nearly the same. FTIR spectra of FLARE™ films obtained before and after e-beam exposure suggest that e-beam curing does not induce any significant change in the chemical structure. Increased solvent resistance, higher Tg, and low dielectric constant are properties that make this e-beam cured poly(arylene ether) film an excellent candidate for interlevel dielectric integration processes.

Investigation of the Structure-Property Relationships of Improved Low Compression Set Nitrile Rubbers

1981 ◽  
Vol 54 (1) ◽  
pp. 170-180 ◽  
Author(s):  
D. M. Chang
Keyword(s):  
Molecular Weight ◽  
Physical Properties ◽  
Structure And Properties ◽  
Structure Property ◽  
Compression Set ◽  
Structure Property Relationships ◽  
Polymer Properties ◽  
Nitrile Rubbers ◽  
New Type ◽  
The Right

Abstract The effect of polymer structures on the rubber processing and physical properties of the improved Hycar 1090 low compression set nitrile rubbers was investigated. The molecular weight and acrylonitrile content of a polymer are important variables in determining the compound processing and vulcanizate physical properties. Within the range of 21 to 88 Mooney, a blend of high and low Mooney polymers has approximately the same properties as those from a single polymer of the same Mooney viscosity. The molecular weight distribution was not significantly broadened to become an important factor affecting the polymer properties. All polymers with Mooney viscosities from 21 to 88 showed good properties. An understanding of the structure and properties of this new type of NBR, will help in choosing the right kind of polymer for particular applications.

Preparation and Properties of Polysilsesquioxanes - Polysilsesquioxanes as a Candidate to a Low Dielectrics for Electronic Devices -

1999 ◽  
Vol 565 ◽  
Author(s):  
Yoshimoto Abe ◽  
Keiko Kagayama ◽  
Norihiro Takamura ◽  
Takahiro Gunji
Keyword(s):  
Molecular Weight ◽  
Elevated Temperatures ◽  
Heating Time ◽  
Dielectric Constants ◽  
Dielectric Films ◽  
Coating Films ◽  
Low Dielectric ◽  
Inorganic Substrates ◽  
Acid And Base ◽  
Molecular Weight Increase

AbstractPolysilsesquioxanes PSSQ as a candidate of coatings for interlayer low dielectric films were synthesized by acid and base catalyzed hydrolytic polycondensation of RSi(OMe)3 (R=methyl, vinyl, 3-methacryloxypropyl). Dip and spin coating of PSSQ on organic and inorganic substrates followed by curing at 100 °C, 400 °C, and 450 °C provided transparent and tough coating films of thickness 2000–9000 A. Polysilsesquioxanes adhered strongly to the substrates to form coating films of which the adhesion strength and hardness were 10 and 9H based on JIS K5400 comparable to ISO standard, as heating time and molecular weight increase. On curing at the elevated temperatures, they provided the films with a very smooth surface and the dielectric constants of 3.2∼3.6 (R=3-methacryloxypropyl), 3.8∼4.0 (R=vinyl), and 2.5∼2.7 (R=methyl) depending on film thickness and molecular weight of PSSQ. The films from PSSQ (R=methyl) were found to be porous compared with those from PSSQ (R=vinyl).

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