Recent Advances in On-Chip Cooling Systems: Experimental Evaluation and Dynamic Modeling

2014 ◽  
Author(s):  
N. Lamaison ◽  
J.B. Marcinichen ◽  
John R. Thome
Keyword(s):  
Dynamic Modeling ◽  
Experimental Evaluation ◽  
Cooling Systems ◽  
Chip Cooling ◽  
Recent Advances ◽  
On Chip

scholarly journals A review of on-chip micro-evaporation: Experimental evaluation of liquid pumping and vapor compression driven cooling systems and control

2012 ◽  
Vol 92 ◽  
pp. 147-161 ◽  
Author(s):  
Jackson Braz Marcinichen ◽  
Jonathan A. Olivier ◽  
Vinicius de Oliveira ◽  
John R. Thome
Keyword(s):  
Experimental Evaluation ◽  
Vapor Compression ◽  
Cooling Systems ◽  
Systems And Control ◽  
On Chip ◽  
And Control

Two-Phase On-Chip Cooling Systems for Green Data Centers

2012 ◽  
pp. 513-567
Author(s):  
John R. Thome ◽  
Jackson B. Marcinichen ◽  
Jonathan A. Olivier
Keyword(s):  
Data Centers ◽  
Two Phase ◽  
Cooling Systems ◽  
Chip Cooling ◽  
On Chip ◽  
Green Data Centers

scholarly journals An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding

Sensors ◽  
2020 ◽  
Vol 20 (19) ◽  
pp. 5533
Author(s):  
Yunlong Qiu ◽  
Wenjie Hu ◽  
Changju Wu ◽  
Weifang Chen
Keyword(s):  
Experimental Study ◽  
Reynolds Number ◽  
Pressure Drop ◽  
Heat Sink ◽  
Cooling Systems ◽  
Number Range ◽  
Pin Fin ◽  
Chip Cooling ◽  
High Heat Transfer ◽  
On Chip

This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature sensors are fabricated by micromachining and silicon-to-silicon direct bonding. Three micro heat sink structures: a microchannel heat sink (MCHS), an inline micro-pin-fin heat sink (I-MPFHS) and a staggered micro-pin-fin heat sink (S-MPFHS) are tested in the Reynolds number range of 79.2 to 882.3. The results show that S-MPFHS is preferred if the water pump can provide enough pressure drop. However, S-MPFHS has the worst performance when the rated pressure drop of the pump is lower than 1.5 kPa because the endwall effect under a low Reynolds number suppresses the disturbance generated by the staggered micro pin fins but S-MPFHS is still preferred when the rated pressure drop of the pump is in the range of 1.5 to 20 kPa. When the rated pressure drop of the pump is higher than 20 kPa, I-MPFHS will be the best choice because of high heat transfer enhancement and low pressure drop price brought by the unsteady vortex street.

scholarly journals Editorial for the Special Issue on Organs-on-Chips

Micromachines ◽  
2020 ◽  
Vol 11 (4) ◽  
pp. 369 ◽  
Author(s):  
Yu-suke Torisawa ◽  
Yi-Chung Tung
Keyword(s):  
Cell Culture ◽  
Special Issue ◽  
Cell Culture Techniques ◽  
Culture Techniques ◽  
Recent Advances ◽  
Functional Units ◽  
On Chip ◽  
Microsystems Technology

Recent advances in microsystems technology and cell culture techniques have led to the development of organ-on-chip microdevices to model functional units of organs [...]

scholarly journals Thermoelectric Property Requirements for On-Chip Cooling of Device Transients

2020 ◽  
Vol 67 (9) ◽  
pp. 3716-3721
Author(s):  
Lakshmi Amulya Nimmagadda ◽  
Sanjiv Sinha
Keyword(s):  
Thermoelectric Property ◽  
Chip Cooling ◽  
On Chip

Silicon Hot Spot Remediation With a Germanium Self Cooling Layer

2011 ◽  
Author(s):  
Horacio Nochetto ◽  
Peng Wang ◽  
Avram Bar-Cohen
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Silicon Layer ◽  
Great Promise ◽  
Applied Current ◽  
Chip Cooling ◽  
Primary Driver ◽  
Germanium Layer ◽  
On Chip ◽  
Spot Temperature

Driven by shrinking feature sizes, microprocessor hot spots have emerged as the primary driver for on-chip cooling of today’s IC technologies. Current thermal management technologies offer few choices for such on-chip hot spot remediation. A solid state germanium self-cooling layer, fabricated on top of the silicon chip, is proposed and demonstrated to have great promise for reducing the severity of on-chip hot spots. 3D thermo-electrical coupled simulations are used to investigate the effectiveness of a bi-layer device containing a germanium self-cooling layer above an electrically insulated silicon layer. The parametric variables of applied current, cooler size, silicon percentage, and total die thickness are sequentially optimized for the lowest hot spot temperature compared to a non-self-cooled silicon chip. Results suggest that the localized self-cooling of the germanium layer coupled with the higher thermal conductivity of the silicon chip can significantly reduce the temperature rise resulting from a micro-scaled hot spot.

scholarly journals Fundamentals, Recent Advances, and Future Challenges in Bioimpedance Devices for Healthcare Applications

2019 ◽  
Vol 2019 ◽  
pp. 1-42 ◽  
Author(s):  
David Naranjo-Hernández ◽  
Javier Reina-Tosina ◽  
Mart Min
Keyword(s):  
Healthcare Applications ◽  
Body Composition Assessment ◽  
Impedance Tomography ◽  
Lab On Chip ◽  
Recent Advances ◽  
Chip Technology ◽  
Impedance Pneumography ◽  
Future Challenges ◽  
On Chip ◽  
Frequency Behavior

This work develops a thorough review of bioimpedance systems for healthcare applications. The basis and fundamentals of bioimpedance measurements are described covering issues ranging from the hardware diagrams to the configurations and designs of the electrodes and from the mathematical models that describe the frequency behavior of the bioimpedance to the sources of noise and artifacts. Bioimpedance applications such as body composition assessment, impedance cardiography (ICG), transthoracic impedance pneumography, electrical impedance tomography (EIT), and skin conductance are described and analyzed. A breakdown of recent advances and future challenges of bioimpedance is also performed, addressing topics such as transducers for biosensors and Lab-on-Chip technology, measurements in implantable systems, characterization of new parameters and substances, and novel bioimpedance applications.

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