scholarly journals The effect of UV-irradiation on the thermal stability of modified urea-formaldehyde resins with thermally activated montmorillonite

2021 ◽  
Author(s):  
Vojislav Jovanović ◽  
Suzana Samaržija-Jovanović ◽  
Branka Petković ◽  
Tijana Jovanović ◽  
Gordana Marković ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Uv Irradiation ◽  
Urea Formaldehyde ◽  
Thermally Activated ◽  
Thermal Stability Of ◽  
Modified Urea

scholarly journals THERMAL STABILITY OF Pinus oocarpa AND MAIZE COB PARTICLEBOARDS

2015 ◽  
Vol 39 (4) ◽  
pp. 348-354 ◽  
Author(s):  
Mário Vanoli Scatolino ◽  
Thiago de Paula Protásio ◽  
Rafael Farinassi Mendes ◽  
Lourival Marin Mendes
Keyword(s):  
Thermal Stability ◽  
Agricultural Waste ◽  
Urea Formaldehyde ◽  
Curve Analysis ◽  
Raw Material ◽  
Waste Materials ◽  
Pressing Cycle ◽  
Pinus Oocarpa ◽  
Maize Cob ◽  
Thermal Stability Of

Agricultural waste materials are generated in large quantities in Brazil. These can accumulate and cause serious environmental problems. One of the most commonly generated wastes in the brazilian agricultural culture is the maize cob. Being lignocellulosic in nature, the maize cob can find use as the raw material in the production of particleboards mainly concerned with furniture making. Therefore, studies regarding its thermal stability and fire resistance would be interesting. The aim of this study was to evaluate the combustibility and thermal stability of the particleboards produced from maize cob and Pinus oocarpa wood. The percentages in which maize cob was associated with Pinus oocarpa were 0%, 25%, 50%, 75% and 100%. The panels were produced using 8% urea-formaldehyde and 1% paraffin. The pressing cycle parameters included: temperature 150 °C, pressure of 3.92 MPa during 10 min. The combustibility curve analysis showed that the panels containing 25% content of maize cob had higher resistance to combustion. In general, the thermal stability decreased as the wood substitution by maize cob increased.

Structural Processes in Gold-Based Metallization During the Formation of Ohmic Contacts to GaSb

1995 ◽  
Vol 403 ◽  
Author(s):  
A. Piotrowska ◽  
E. Kańifiska ◽  
M. Guziewicz ◽  
E. Mizera ◽  
E. Dynowska ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Ohmic Contact ◽  
Ohmic Contacts ◽  
Contact System ◽  
Contact Reaction ◽  
Annealing Behavior ◽  
Thermally Activated ◽  
Combined Use ◽  
Semiconductor System ◽  
Thermal Stability Of

AbstractAnnealing behavior of Au, AuZn, and AuSb metallization on GaSb have been investigated by the combined use of RBS, XRD, TEM, and I-V characterization. The results give evidence that the thermally activated contact reaction strongly depends on the particular elements incorporated in the Au layer. Pure Au reacts with GaSb at 100°C. The addition of Zn to Au metallization increases the thermal stability of the metallization/semiconductor system to 200°C. Antimony, forming with gold the AuSb2 phase in metallization, provides the most stable ohmic contact system.

Thermal stability of microencapsulated epoxy resins with poly(urea–formaldehyde)

2006 ◽  
Vol 91 (10) ◽  
pp. 2300-2306 ◽  
Author(s):  
Li Yuan ◽  
Guo-Zheng Liang ◽  
Jian-Qiang Xie ◽  
Jing Guo ◽  
Lan Li
Keyword(s):  
Thermal Stability ◽  
Epoxy Resins ◽  
Urea Formaldehyde ◽  
Thermal Stability Of

THERMAL GRAVIMETRIC AND ACTIVATION ENERGY ANALYSIS OF RENEWABLE POLYMER UPON ULTRAVIOLET (UV) IRRADIATION

2015 ◽  
Vol 77 (32) ◽  
Author(s):  
Nik Normunira Mat Hassan ◽  
Anika Zafiah M. Rus
Keyword(s):  
Activation Energy ◽  
Thermal Stability ◽  
Uv Irradiation ◽  
Hard Segment ◽  
Soft Segment ◽  
Great Influence ◽  
Automotive Application ◽  
Polymer Foam ◽  
Wide Range ◽  
Thermal Stability Of

Renewable polymer made from renewable material is one of the most important groups of polymer because of their versatility and they can be manufactured in a wide range of insulation and automotive application. In this project, renewable polymer based on waste vegetable oil were synthesized and crosslink with commercial polymethane polyphenyl isocyanate. The renewable polymer foam (RPF) was compressed by using hot compression moulding technique at 90 oC based on the evaporation of volatile matter and known as compressed renewable polymer (CRP). The thermal degradation and activation energy of RPF and CRP samples is consistant with the increasing of UV irradiation time at the first degradation, second degradation and third degradation. This is due to thermal stability of samples at the hard segment has a great influence on the thermal stability of soft segment. A higher thermal stability of hard segment leads to a higher degradation temperature of soft segment.

Effect of γ-irradiation on the hydrolytic and thermal stability of micro- and nano-TiO2 based urea–formaldehyde composites

RSC Advances ◽  
2015 ◽  
Vol 5 (73) ◽  
pp. 59715-59722 ◽  
Author(s):  
V. Jovanović ◽  
S. Samaržija-Jovanović ◽  
B. Petković ◽  
V. Dekić ◽  
G. Marković ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Behavior ◽  
Urea Formaldehyde ◽  
Hydrolytic Stability ◽  
Formaldehyde Resin ◽  
Γ Irradiation ◽  
Nano Tio2 ◽  
Inorganic Composites ◽  
Before And After ◽  
Thermal Stability Of

The hydrolytic stability and thermal behavior of organic–inorganic composites prepared by two-stage polymerization of urea–formaldehyde resin (UF) with micro- and nano-TiO2 before and after irradiation has been investigated.

Comparison of Growth and Microstructure of Copper Films Deposited From Different Cu(Ii) Precursors

1994 ◽  
Vol 337 ◽  
Author(s):  
J. Goswami ◽  
S.A. Shivashankar ◽  
Lakshmi Raghunathan ◽  
Anjana Devi ◽  
K.V. Ramanathan
Keyword(s):  
Thermal Stability ◽  
Growth Rate ◽  
Deposition Temperature ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Copper Films ◽  
High Quality ◽  
Thermally Activated ◽  
Thermal Stability Of ◽  
Lower Resistivity

ABSTRACTHigh quality copper thin films have been obtained by low pressure thermally-activated chemical vapour deposition from two different Cu(II) metalorganic precursors, (a) bis(dipivaloyl-methanato) Cu (II) or Cu(dpm)2 and (b) bis(t-butylaceto acetato)Cu(II) or Cu(tbaoac)2, the latter synthesised with a view to reducing the deposition temperature. A comparative study of the volatility and thermal stability of the two precursors, as well as of the growth and microstructure of copper films from these two precursors, is presented.While the threshold deposition temperature is significantly lower for Cu(tbaoac)2 compared to Cu(dpm)2, the growth rate is considerably higher with Cu(dpm)2-Films obtained from Cu(tbaoac)2 are denser and of lower resistivity at a given thickness compared to those from Cu(dpm)2, and are also smoother, exhibiting mirror-like reflectivity.

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