Solar Energy as Renewable Energy for the Degradation of Pollutants using High Active Ag@TiO2/α-Fe2O3 Ternary Nanocomposite Photocatalyst

Preparation and Characterization of Ag@TiO2/α-Fe2O3 Ternary Nanocomposite for enhanced visible light photocatalytic performance

10.21203/rs.3.rs-814762/v1 ◽

2021 ◽

Author(s):

Nesrine Ben Saber ◽

Amine Mezni

Keyword(s):

Visible Light ◽

Chemical Reduction ◽

Average Particle Size ◽

Visible Region ◽

Metallic Silver ◽

Average Particle ◽

Ternary Nanocomposite ◽

Photo Response ◽

Chemical Procedure

Abstract In this work, ternary Ag@TiO2/α-Fe2O3 nanocomposite were synthesized via solvothermal chemical reduction method using N,N-dimethylformamide (DMF) as solvent and reducing agent. The chemical procedure involves the use of only metals precursors without the need to use any other surfactants or capping agents. Physicochemical properties of the designed photocatalyst are found by means of various modern techniques. XRD data confirmed the high crystallinity of the obtained ternary nanocomposite. On the other hand, using TEM and HRTEM instruments, the shape and morphology of the Ag@TiO2/α-Fe2O3 nanocomposite were found to be spherical with an average particle size of 150 nm. The UV-Vis measurement shows that Ag@TiO2/α-Fe2O3 as photocatalyst exhibited good photo response in the visible region. The effect of preparation method and the performance of the designed photocatalyst were evaluated by photodegradation measurements of MB under visible light irradiation. We observed that the combination of metallic silver nanoparticles (AgNPs) and hematite iron oxide (α-Fe2O3) with titanium dioxide (TiO2) enhance the photocatalytic activity of the ternary Ag@TiO2/α-Fe2O3 photocatalyst compared to bare TiO2 suggesting its potential for many purification applications.

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Lead Free Paste with under 3um Solder Particles for Fine Pitch C4 bumping and pre-coating solder applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2013dpc-tp25 ◽

2013 ◽

Vol 2013 (DPC) ◽

pp. 000862-000889

Author(s):

Hironori Uno ◽

Masayuki Ishikawa ◽

Akihiro Masuda ◽

Hiroki Muraoka ◽

Kanji Kuba

Keyword(s):

Chemical Reduction ◽

Average Particle Size ◽

Average Particle ◽

Solder Paste ◽

Chemical Reduction Method ◽

Property Evaluation ◽

Fine Pitch ◽

Solder Bumps ◽

Size Of Particles ◽

Average Size

The work to be detailed in this paper is our development of 96.5mass%Sn-3.0mass%Ag-0.5mass%Cu fine solder particles with an average particle size of under 3um (D50), using a chemical reduction method. An evaluation was conducted on the properties of the particles. The average size of particles appeared to be under 3um with a higher yield compared to particles using the conventional gas atomization method. The melting temperature of fine solder particles using this method was its eutectic temperature, which is same as using the gas–atomized particles. 120um pitch solder bumps from the solder paste using the above mentioned fine solder particles were created on the substrate. As a result of property evaluation, it was turned out that the solder paste created a superior printing shape and coplanarity compared to the conventional paste with gas-atomized particles. In order to investigate the superior printing property generated by the paste with fine solder particles, the rheology of the paste was evaluated.It was verified that the anisotropic shape of particles has contributed to prevent the printed paste from slumping, which has resulted in the improvement of printed shape. It also shows that the filling characteristic of the paste was improved by the smaller particles and the better coplanarity was observed. The importance of finer solder particles for finer pitch assembly will be presented.

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Synthesis and Consolidation of Nano-Sized NiCo Powder by Powder Technology Rout

Materials Science Forum ◽

10.4028/www.scientific.net/msf.561-565.1425 ◽

2007 ◽

Vol 561-565 ◽

pp. 1425-1428 ◽

Cited By ~ 2

Author(s):

W.M. Daoush

Keyword(s):

Composite Powder ◽

Chemical Reduction ◽

Average Particle Size ◽

Complexing Agent ◽

Average Particle ◽

Chemical Reduction Method ◽

Homogeneous Microstructure ◽

Electrical And Magnetic Properties ◽

Saturation Induction ◽

Metallic Salt

Nano sized Co-20wt%Ni composite powder was synthesized by electroless chemical reduction method using metallic salt precursors and hypophosphite as a reducing agent in alkaline tartarate bath as a complexing agent. The synthesized powder provide better sinterability, mechanical, electrical and magnetic properties with homogeneous microstructure. The nano-sized powder could be obtained, which have the average particle size of 40 nm, with a saturation magnetization (Bs ) of 97.95 which was increased by heat treatments of powder in hydrogen to 127 emu/g due to the exclusion of the precipitated phosphrous in the composite powder. The powder underwent cold compaction at 600 Mpa and sintering at 1050 oC for 30 min. The saturation induction for the sintered material of 149.3 emu/g higher than the synthesized powder and has electrical resistivity value of 7.6 μcm.

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Electrical Properties of Silver Paste Prepared from Nanoparticles and Lead-Free Frit

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2007.059 ◽

2007 ◽

Vol 7 (11) ◽

pp. 3917-3919 ◽

Cited By ~ 9

Author(s):

Sung Hyun Park ◽

Dong Seok Seo ◽

Jong Kook Lee

Keyword(s):

Silver Nanoparticles ◽

Electrical Properties ◽

Screen Printing ◽

Chemical Reduction ◽

Silver Powder ◽

Average Particle Size ◽

Average Particle ◽

Chemical Reduction Method ◽

Silver Paste ◽

Thermal And Electrical Properties

Recently, PbO containing glass systems in commercial silver paste have been used due to their low glass transition temperature, good thermal and electrical properties. However, PbO is a hazardous material to both health and the environment. In this study, Pb-free silver paste was prepared by mixing commercial silver powder and silver nanoparticles. The commercial powder has an average particle size of 1.6 μm. The silver nanoparticles with particles size of 20–50 nm were synthesized by a chemical reduction method using surfactant. Pb-free frit was added into the mixed silver powder as the amounts of 3, 6 and 9 wt%. Using the obtained paste, thick films were fabricated by a screen printing on alumina substrate and the films were fired at temperature from 400 to 550 °C. The films had thickness of 6–11 μm and sheet resistivity of about 4–11 μΩ cm.

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Synthesis and Characterization of Sn/Ag Nanoparticle Composite as Electro-Catalyst for Fuel Cell

Journal of Research in Nanoscience and Nanotechnology ◽

10.37934/jrnn.1.1.1221 ◽

2021 ◽

Vol 1 (1) ◽

pp. 12-21

Author(s):

Tan Wei Kang ◽

Siti Husnaa Mohd Taib ◽

Pooria Moozarm Nia ◽

Mikio Miyake ◽

Kamyar Shameli

Keyword(s):

Chemical Reduction ◽

Sodium Succinate ◽

Average Particle Size ◽

Average Particle ◽

Protective Agent ◽

Ag Nanoparticle ◽

Chemical Reduction Method ◽

Sn Nanoparticle ◽

Composite Samples

In this research, Sn/Ag nanoparticle composite was produced by using chemical reduction method with the aids of sodium borohydride as reducing agent and sodium succinate as protective agent. The XRD, EDX, and TEM analyses showed that the Sn/Ag nanoparticle composite was formed with an average particle size of 4.37 + 0.44 nm. For the application, LSV analysis was done on Sn nanoparticle and Sn/Ag nanoparticle composite samples, and the analysis showed current produced from Sn/Ag nanoparticle composite (4.10 × 10-6 A) is higher than Sn nanoparticle (3.47 × 10-6 A) at the potential of -0.83V.

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Simple One-Step Synthesis of Uniform Disperse Copper Nanoparticles

MRS Proceedings ◽

10.1557/proc-879-z6.3 ◽

2005 ◽

Vol 879 ◽

Cited By ~ 4

Author(s):

Chunwei Wu ◽

Brian P. Mosher ◽

Taofang Zeng

Keyword(s):

Ascorbic Acid ◽

Copper Nanoparticles ◽

Chemical Reduction ◽

Average Particle Size ◽

Average Particle ◽

Face Centered Cubic ◽

Chemical Reduction Method ◽

Disperse Copper ◽

One Step ◽

Face Centered

AbstractIn this paper, we describe a simple and rapid solution-phase chemical reduction method with no inert gas protection, for preparing stable copper nanoparticle colloid with average particle size of 3.4 nm and narrow size distribution. In our synthesis route, ascorbic acid, natural vitamin C (VC), serves as both a reducing agent and an antioxidant to reduce copper salt precursor and effectively prevent the general oxidation process occurring to the newborn nanoparticles. XRD and UV/vis confirm the formation of pure face-centered cubic (fcc) copper nanoparticles and the excellent antioxidant ability of ascorbic acid.

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Antimicrobial Activity of Silver Nanoparticles Prepared Under an Ultrasonic Field

International Journal of Pharmaceutical Sciences and Nanotechnology ◽

10.37285/ijpsn.2011.4.3.8 ◽

2011 ◽

Vol 4 (3) ◽

pp. 1491-1496

Author(s):

Umadevi M ◽

Rani T ◽

Balakrishnan T ◽

Ramanibai R

Keyword(s):

Escherichia Coli ◽

Antimicrobial Activity ◽

Silver Nanoparticles ◽

Reduction Method ◽

Therapeutic Potential ◽

Chemical Reduction ◽

Ultrasonic Field ◽

Great Promise ◽

Chemical Reduction Method ◽

E Coli

Nanotechnology has great promise for improving the therapeutic potential of medicinal molecules and related agents. In this study, silver nanoparticles of different sizes were synthesized in an ultrasonic field using the chemical reduction method with sodium borohydride as a reducing agent. The size effect of silver nanoparticles on antimicrobial activity were tested against the microorganisms Staphylococcus aureus (MTCC No. 96), Bacillus subtilis (MTCC No. 441), Streptococcus mutans (MTCC No. 497), Escherichia coli (MTCC No. 739) and Pseudomonas aeruginosa (MTCC No. 1934). The results shows that B. subtilis, and E. coli were more sensitive to silver nanoparticles and its size, indicating the superior antimicrobial efficacy of silver nanoparticles.

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Influence of Cu on the Improvement of Magnetic Properties and Structure of L10 FePt Nanoparticles

Nanomaterials ◽

10.3390/nano11051097 ◽

2021 ◽

Vol 11 (5) ◽

pp. 1097

Author(s):

Luran Zhang ◽

Xinchen Du ◽

Hongjie Lu ◽

Dandan Gao ◽

Huan Liu ◽

...

Keyword(s):

Magnetic Properties ◽

Annealing Temperature ◽

Reduction Method ◽

Solid Phase ◽

Average Particle Size ◽

Fept Nanoparticles ◽

Average Particle ◽

Phase Reduction ◽

Different Temperatures ◽

One Step

L10 ordered FePt and FePtCu nanoparticles (NPs) with a good dispersion were successfully fabricated by a simple, green, one-step solid-phase reduction method. Fe (acac)3, Pt (acac)2, and CuO as the precursors were dispersed in NaCl and annealed at different temperatures with an H2-containing atmosphere. As the annealing temperature increased, the chemical order parameter (S), average particle size (D), coercivity (Hc), and saturation magnetization (Ms) of FePt and FePtCu NPs increased and the size distribution range of the particles became wider. The ordered degree, D, Hc, and Ms of FePt NPs were greatly improved by adding 5% Cu. The highest S, D, Hc, and Ms were obtained when FePtCu NPs annealed at 750 °C, which were 0.91, 4.87 nm, 12,200 Oe, and 23.38 emu/g, respectively. The structure and magnetic properties of FePt and FePtCu NPs at different annealing temperatures were investigated and the formation mechanism of FePt and FePtCu NPs were discussed in detail.

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