scholarly journals SAT-Attack Resistant Hardware Obfuscation using Camouflaged Two-Dimensional Heterostructure Devices

2020 ◽  
Author(s):  
Akshay Wali ◽  
Andrew Arnold ◽  
Shamik Kundu ◽  
Soumyadeep Choudhury ◽  
Kanad Basu ◽  
...  

Abstract Reverse engineering (RE) is one of the major security threats to the semiconductor industry due to the involvement of untrustworthy parties in an increasingly globalized chip manufacturing supply chain [1-5]. RE efforts have already been successful in extracting device level functionalities from an integrated circuit (IC) with very limited resources [6]. Camouflaging is an obfuscation method that can thwart such RE [7-9]. Existing work on IC camouflaging primarily uses fabrication techniques such as doping and dummy contacts to hide the circuit structure or build cells that look alike but have different functionalities. While promising these Si complementary metal oxide semiconductor (CMOS) based obfuscation techniques adds significant area overhead and are successfully decamouflaged by the Satisfiability solver (SAT)-based reverse engineering techniques [9-13]. Emerging solutions, such as polymorphic gates based on giant spin Hall effect (GSHE) are promising but adds delay overhead in hybrid CMOS-GSHE designs restricting the camouflaging to a maximum of 15% of all the gates in the circuit. Here, we harness the unique properties of two-dimensional (2D) transition metal dichalcogenides (TMDs) including MoS2, MoSe2, MoTe2, WS2, and WSe2 and their optically transparent transition metal oxides (TMOs) to demonstrate novel area efficient camouflaging solutions that are resilient to SAT-attack and automatic test pattern generation (ATPG) attacks. We show that resistors with resistance values differing by 8 orders of magnitude, diodes with variable turn-on voltages and reverse saturation currents, and field effect transistors (FETs) with adjustable conduction type, threshold voltages and switching characteristics can be optically camouflaged to look exactly similar by engineering TMO/TMD heterostructures allowing hardware obfuscation of both digital and analog circuits. Since this 2D heterostructure devices family is intrinsically camouflaged, NAND/NOR/AND/OR gates in the circuit can be obfuscated with significantly less area overhead allowing 100% logic obfuscation compared to only 5% for CMOS-based camouflaging. Finally, we demonstrate that the largest benchmarking circuit from ISCAS’85, comprised of more than 4000 logic gates when obfuscated with the CMOS-based technique are successfully decamouflaged by SAT-attack in less than 40 minutes; whereas, it renders to be invulnerable even in more than 10 hours, when camouflaged with 2D heterostructure devices thereby corroborating our hypothesis of high resilience against RE. Our approach of connecting unique material properties to innovative devices to secure circuits can be considered as one of its kind demonstrations, highlighting the benefits of cross-layer optimization.

Author(s):  
Jiao Yu ◽  
Caijuan Xia ◽  
Zhengyang Hu ◽  
jianping Sun ◽  
Xiaopeng Hao ◽  
...  

With in-plane heterojunction contacts between semiconducting 2H phase (as channel) and the metallic 1T' phase (as electrode), the two-dimensional (2D) transition metal chalcogenides (TMDs) field-effect transistors (FETs) have received much...


2017 ◽  
Vol 23 (5) ◽  
pp. 916-925
Author(s):  
Pritesh Parikh ◽  
Corey Senowitz ◽  
Don Lyons ◽  
Isabelle Martin ◽  
Ty J. Prosa ◽  
...  

AbstractThe semiconductor industry has seen tremendous progress over the last few decades with continuous reduction in transistor size to improve device performance. Miniaturization of devices has led to changes in the dopants and dielectric layers incorporated. As the gradual shift from two-dimensional metal-oxide semiconductor field-effect transistor to three-dimensional (3D) field-effect transistors (finFETs) occurred, it has become imperative to understand compositional variability with nanoscale spatial resolution. Compositional changes can affect device performance primarily through fluctuations in threshold voltage and channel current density. Traditional techniques such as scanning electron microscope and focused ion beam no longer provide the required resolution to probe the physical structure and chemical composition of individual fins. Hence advanced multimodal characterization approaches are required to better understand electronic devices. Herein, we report the study of 14 nm commercial finFETs using atom probe tomography (APT) and scanning transmission electron microscopy–energy-dispersive X-ray spectroscopy (STEM-EDS). Complimentary compositional maps were obtained using both techniques with analysis of the gate dielectrics and silicon fin. APT additionally provided 3D information and allowed analysis of the distribution of low atomic number dopant elements (e.g., boron), which are elusive when using STEM-EDS.


2018 ◽  
Vol 17 (1) ◽  
Author(s):  
Md Ibnul Bin Kader Arnub ◽  
M Tanseer Ali

The double gate MOSFET, where two gates are fabricated along the length of the channel one after another. Design of logic gates is one of the most eminent application of Double Gate MOSFET. Gallium nitride (GaN) based metal-oxide semiconductor field-effect transistors (MOSFETs) are shown to be promising for digital logic applications. This paper describes the design and analysis of different types of logic gates using GaN based DG-MOSFET. The gate length (LG) is kept constant at 10.6 nm. The gate voltage varies from 0 to 1 V for the device switching from turn OFF to turn ON-state. For the device with HfO2 as gate oxide, the ON-state current (ION) and OFF-state current (IOFF) are found 8.11×10-3 and 6.38605×10-9A/μm respectively. The leakage current is low for the device with HfO2 as compared to that for the device with ZrO2. The subthreshold swing (SS) is 68.7408 mV/dec for the device with HfO2.


2015 ◽  
Vol 24 (03n04) ◽  
pp. 1550008 ◽  
Author(s):  
Bander Saman ◽  
P. Mirdha ◽  
M. Lingalugari ◽  
P. Gogna ◽  
F. C. Jain ◽  
...  

This paper presents the design and modeling of logic gates using two channel spatial wavefunction switched field-effect transistors (SWSFETs) it is also known as a twin-drain MOSFET. In SWSFETs, the channel between source and drain has two or more quantum wells (QWs) layers separated by a high band gap material between them. The gate voltage controls the charge carrier concentration in the two quantum wells layers and it causes the switching of charge carriers from one channel to other channel of the device. The first part of this paper shows the characteristics of n-channel SWSFET model, the second part provides the circuit topology for the SWSFET inverter and universal gates- NAND, AND, NOR,OR, XOR and XOR. The proposed model is based on integration between Berkeley Short-channel IGFET Model (BSIM) and Analog Behavioral Model (ABM), the model is suitable to investigate the gates configuration and transient analysis at circuit level. The results show that all basic two-input logic gates can be implanted by using n-channel SWSFET only, It covers less area compared with CMOS (Complementary metal–oxide–semiconductor) gates. The NAND-NOR can be performed by three SWSFET, moreover the exclusive-NOR “XNOR” can be done by four SWSFET transistors also AND, OR, XOR gates require two additional SWSFET for inverting.


Nanoscale ◽  
2020 ◽  
Vol 12 (33) ◽  
pp. 17253-17264 ◽  
Author(s):  
Maomao Liu ◽  
Sichen Wei ◽  
Simran Shahi ◽  
Hemendra Nath Jaiswal ◽  
Paolo Paletti ◽  
...  

Both generalized atomic doping and localized contact decoration using transition metal, Cu, can significantly improve the contact condition and enhance the carrier transport of two-dimensional semiconductors.


2021 ◽  
Vol 42 (12) ◽  
pp. 122001
Author(s):  
Panpan Wang ◽  
Songxuan Han ◽  
Ruge Quhe

Abstract Owing to the high carrier mobility, two-dimensional (2D) gallium antimonite (GaSb) is a promising channel material for field-effect transistors (FETs) in the post-silicon era. We investigated the ballistic performance of the 2D GaSb metal–oxide–semiconductor FETs with a 10 nm-gate-length by the ab initio quantum transport simulation. Because of the wider bandgap and better gate-control ability, the performance of the 10-nm monolayer (ML) GaSb FETs is generally superior to the bilayer counterparts, including the three-to-four orders of magnitude larger on-current. Via hydrogenation, the delay-time and power consumption can be further enhanced with magnitude up to 35% and 57%, respectively, thanks to the expanded bandgap. The 10-nm ML GaSb FETs can almost meet the International Technology Roadmap for Semiconductors (ITRS) for high-performance demands in terms of the on-state current, intrinsic delay time, and power-delay product.


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