scholarly journals Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

2021 ◽  
Author(s):  
Mohammad Hafifi Hafiz Ishak ◽  
Mohd Syakirin Rusdi ◽  
Mohd Zulkifly Abdullah ◽  
Mohd Sharizal Abdul Aziz ◽  
Muhammad Khalil Abdullah ◽  
...  
Keyword(s):  
Cfd Simulation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Aperture Size ◽  
Small Aperture ◽  
Cross Model ◽  
Percentage Difference ◽  
Free Solder ◽  
Experimental Values

Abstract This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepancy with CP1° while PP 0.5 mm gap showed the lowest average discrepancy. At small aperture volume, all tests performed shows similar value of filled volume except PP 0.5 mm which exhibit the lowest percentage difference when compared with the experimental values at a bigger aperture volume.

Stencil printing process performance on various aperture size and optimization for lead-free solder paste

2019 ◽  
Vol 102 (9-12) ◽  
pp. 3369-3379 ◽  
Author(s):  
M. S. Rusdi ◽  
M. Z. Abdullah ◽  
S. Chellvarajoo ◽  
M. S. Abdul Aziz ◽  
M. K. Abdullah ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Process Performance ◽  
Solder Paste ◽  
Aperture Size ◽  
Stencil Printing ◽  
Printing Process ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Study of a Low Cost Reballing of BGA Method with Lead-Free Solder Paste

2019 ◽  
Vol 14 (1) ◽  
pp. 651-657
Author(s):  
Talita Mazon ◽  
Guilherme E. Prevedel ◽  
Egont A. Schenkel ◽  
Marcio T. Biasoli
Keyword(s):  
Low Cost ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Free Solder

Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates

2018 ◽  
Vol 27 (10) ◽  
pp. 5011-5017 ◽  
Author(s):  
D. Soares ◽  
H. Leitão ◽  
C. S. Lau ◽  
J. C. Teixeira ◽  
L. Ribas ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Free Solder

Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing Aids

2017 ◽  
Vol 2017 (1) ◽  
pp. 000201-000207 ◽  
Author(s):  
Youngtak Lee ◽  
Doug Link
Keyword(s):  
Hearing Aids ◽  
Flip Chip ◽  
Failure Modes ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Practical Application ◽  
Surface Mount ◽  
Free Solder ◽  
On Chip

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Considerable amount of defects associated with solder overflow are found on chip-on-flip-chip (COFC) SiP in hearing aids. Through the use of design of experiments (DOE), lead-free solder defect causes on hearing aids application can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components for hearing aid applications. The practical application and analysis of lead-free solder for hearing aids will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types through the DOE process.

Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability

2016 ◽  
Vol 2016 (1) ◽  
pp. 000111-000116
Author(s):  
Youngtak Lee ◽  
Doug Link
Keyword(s):  
Design Of Experiments ◽  
Flip Chip ◽  
Failure Modes ◽  
Form Factors ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Modeling And Analysis ◽  
Surface Mount ◽  
Free Solder

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Through the use of design of experiments (DOE), lead-free solder defect causes can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components. The systematic investigation will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types utilizing the design of experiments methods.

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