scholarly journals Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management

2016 ◽  
Vol 20 (3) ◽  
pp. 899-902
Author(s):  
Kang-Jia Wang ◽  
Zhong-Liang Pan
Keyword(s):  
Thermal Management ◽  
Integrated Circuit ◽  
Three Dimensional ◽  
Design Guidelines ◽  
Thermal Design ◽  
Steady State Temperature ◽  
Detailed Evaluation ◽  
Microchannel Cooling ◽  
Three Dimensional Integrated Circuit ◽  
The Relationship

Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this paper, we perform a detailed evaluation of the influence of the microchannel structure and the parameters of the cooling liquid on steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for three dimensional integrated circuit with microchannel cooling.

scholarly journals Thermal management of the hotspots in 3-D integrated circuits

2018 ◽  
Vol 22 (4) ◽  
pp. 1685-1690 ◽  
Author(s):  
Kang-Jia Wang ◽  
Hong-Chang Sun ◽  
Cui-Ling Li ◽  
Guo-Dong Wang ◽  
Hong-Wei Zhu
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Vertical Integration ◽  
Integrated Circuit ◽  
Design Guidelines ◽  
Thermal Design ◽  
Micro Channel ◽  
Through Silicon Vias ◽  
Microchannel Cooling ◽  
Silicon Vias

Vertical integration for microelectronics possesses significant challenges due to its fast dissipation of heat generated in multiple device planes. This paper focuses on thermal management of a 3-D integrated circuit, and micro-channel cooling is adopted to deal with the 3-D integrated circuitthermal problems. In addition, thermal through-silicon vias are also used to improve the capacity of heat trans-mission. It is found that combination of microchannel cooling and thermal through-silicon vias can remarkably alleviate the hotspots. The results presented in this paper are expected to aid in the development of thermal design guidelines for 3-D integrated circuits.

scholarly journals Thermal management of three-dimensional integrated circuits with special structures

2021 ◽  
pp. 109-109
Author(s):  
Kang-Jia Wang ◽  
Cui-Ling Li
Keyword(s):  
Temperature Distribution ◽  
Integrated Circuits ◽  
Heat Source ◽  
Thermal Management ◽  
Integrated Circuit ◽  
Three Dimensional ◽  
Numerical Approach ◽  
Optimal Structure ◽  
Maximum Temperature ◽  
Three Dimensional Integrated Circuit

Different stacked structures affect greatly the temperature distribution of a three-dimensional integrated circuit(3-D IC), and an optimal structure is much needed to reduce the maximal temperature. This paper suggests a numerical approach to such structures with different heat source distributions. The results show that an optimal stacked structure can reduce the maximum temperature by 8.7?C.

Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

2013 ◽  
Vol 110 ◽  
pp. 13-15 ◽  
Author(s):  
Y.J. Chen ◽  
T.L. Yang ◽  
J.J. Yu ◽  
C.L. Kao ◽  
C.R. Kao
Keyword(s):  
Integrated Circuit ◽  
Three Dimensional ◽  
Three Dimensional Integrated Circuit
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