Direct Imaging of Ordered Structures and Antiphase Boundaries in FeTiO3-Fe2O3 Solid Solution Thin Films

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

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Microstructural Study of Thin Films CuFe Obtained by Thermal Evaporation of Nanostructured Milled Powder

Journal of Nano Research ◽

10.4028/www.scientific.net/jnanor.47.71 ◽

2017 ◽

Vol 47 ◽

pp. 71-78

Author(s):

H. Mechri ◽

Ahmed Haddad ◽

M. Zergoug ◽

Mohammed Azzaz

Keyword(s):

Thin Films ◽

Solid Solution ◽

Physical Vapor Deposition ◽

Thermal Evaporation ◽

Supersaturated Solid Solution ◽

Milled Powder ◽

Mechanically Alloyed ◽

Glass Substrates ◽

Milling Duration ◽

Tungsten Boat

Commercial copper and iron powders were used as starting materials. These powders were mechanically alloyed to obtain Cu(100-x) Fex supersaturated mixture. The milling duration was chosen in such a way as to obtain a nanostructured mixture and to form a supersaturated solid solution of CuFe; the powder mixture was used to deposit CuFe on a glass substrate. The elaboration of our films has been carried out using thermal evaporation process (physical vapor deposition) under 1 × 10-6 mbar vacuum from an electrically heated tungsten boat, using the supersaturated solid solution Cu(100-x) Fex powder obtained by mechanical alloying. The films deposition has been done on glass substrates. In this study, we present the composition effect on the structural and magnetic proprieties of Cu(100-x) Fex powder and thin films. The chemical composition, structural and magnetic proprieties of milled powders and thin films were examined by SEM, TEM, XRD, XRF and VSM.

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Fabrication of p-type ferrimagnetic semiconductor thin films based on FeTiO3–Fe2O3 solid solution

Journal of Magnetism and Magnetic Materials ◽

10.1016/j.jmmm.2006.10.782 ◽

2007 ◽

Vol 310 (2) ◽

pp. 2105-2107 ◽

Cited By ~ 10

Author(s):

Hajime Hojo ◽

Koji Fujita ◽

Katsuhisa Tanaka ◽

Kazuyuki Hirao

Keyword(s):

Thin Films ◽

Solid Solution ◽

Semiconductor Thin Films ◽

P Type

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Solid Solution Alloy Effects on Microstructure and Indentation Hardness in Pt-Ru Thin Films

MRS Proceedings ◽

10.1557/proc-673-p3.2 ◽

2001 ◽

Vol 673 ◽

Cited By ~ 2

Author(s):

Seungmin Hyun ◽

Oliver Kraft ◽

Richard P. Vinci

Keyword(s):

Thin Films ◽

Solid Solution ◽

Elastic Moduli ◽

Composition Range ◽

Dislocation Motion ◽

Solid Solution Alloy ◽

Indentation Hardness ◽

Solid Solution Strengthening ◽

Si Substrates ◽

Solution Strengthening

ABSTRACTThe elastic moduli and flow stresses of as-deposited Pt and Pt-Ru solid solution thin films were investigated by the nanoindentation method. The influence of solid solution alloying was explored by depositing Pt-Ru solid solution thin films with various compositions onto Si substrates. The 200 nm films were prepared by DC magnetron cosputtering with a Ru composition range from 0 to 20wt%. As expected, the modulus and the flow stress both increased significantly with an increase in Ru. The experimental results compare favorably to predictions based on a simple dislocation motion model consisting of three strengthening terms: substrate constraint, grain size strengthening and solid solution strengthening.

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