Design Optimization of High Voltage NPN ESD Protection Device in 130nm Power SOI Technology

Author(s):  
Raunak Kumar ◽  
Jie Zeng ◽  
Kyong Jin Hwang ◽  
Robert Gauthier
2019 ◽  
Vol 66 (7) ◽  
pp. 2884-2891 ◽  
Author(s):  
Da-Wei Lai ◽  
Gijs de Raad ◽  
Stephen Sque ◽  
Wim Peters ◽  
Theo Smedes

2003 ◽  
Vol 47 (5) ◽  
pp. 865-871 ◽  
Author(s):  
Chung-Hui Chen ◽  
Yean-Kuen Fang ◽  
Wen-De Wang ◽  
Chien-Chun Tsai ◽  
Shen Tu ◽  
...  

2020 ◽  
Vol E103.C (4) ◽  
pp. 191-193
Author(s):  
Yibo JIANG ◽  
Hui BI ◽  
Hui LI ◽  
Zhihao XU ◽  
Cheng SHI

2014 ◽  
Vol 687-691 ◽  
pp. 3251-3254
Author(s):  
Zhuo Tian ◽  
Bai Cheng Li

ComparedtobulkCMOStechnology,Silicon-on-Insulator (SOI) CMOS technology has many advantages, such as low power consumption, low leakage current, low parasitic capacitance and a low soft error rate from both alpha particles and cosmic rays. However,electrostatic discharge (ESD) protection in SOI technology is still a major substantial barrier to overcome for the poor thermal conductivity of isolation oxide and the absence of vertical diode and silicon controlled rectifier (SCR).


2019 ◽  
Vol 159 ◽  
pp. 90-98 ◽  
Author(s):  
Louise De Conti ◽  
Thomas Bedecarrats ◽  
Sorin Cristoloveanu ◽  
Maud Vinet ◽  
Philippe Galy

Sign in / Sign up

Export Citation Format

Share Document