scholarly journals FPGA Data Acquisition of Electrical Parameter

2021 ◽  
Vol 6 (4) ◽  
pp. 105-123
Author(s):  
Kennedy Ahamefula Iroanusi
Keyword(s):  
Data Acquisition ◽  
Personal Computer ◽  
High Speed ◽  
Electrical Parameter ◽  
Logic Gate ◽  
System On Chip ◽  
Circuit Board ◽  
Sensor Data ◽  
Voltage Level ◽  
On Chip

A data acquisition system using a Programmable Logic Gate Array (FPGA) and Graphical User Interface (GUI) for visual enhancement designed for Personal Computer is shown. The data acquisition of voltage (V), current (A) and temperature ( ) signals and/or parameters transmitted at high frequency in real time via the system-on-chip (SOC) created on Spartan 6 FPGA. The system-on-chip is achieved by programming the FPGA with a high-speed hardware description language (Verilog) code written for the system, Printed Circuit Board (PCB) was designed for the system and the GUI has been created using a graphical approach utilizing LabVIEW to enable data monitoring on Personal Computer (PC) display. The FPGA requires digital input signals; therefore, an analogue to digital convertor (ADC) is required for the convert sensor data from analogue signal from sensors to digital signals. A voltage level shifter is required to normalise the voltage level standards within the circuity in between the 5V from the ADC converter and the 3.3V voltage requirement for the FPGA. The Spartan 6 FPGA receives data from the analogue sensors via the ADC, the data are wrapped up in packets and transmitted through RS-232 serial port to the PC. The three aforementioned parameters are monitored on the GUI on the PC presented in both numerical and graphical format and all data can be store in a file for backup storage, maintenance or reference purposes.

scholarly journals Design and Implementation of SOC-Based Noncontact-Type Level Sensing for Conductive and Nonconductive Liquids

2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
J. L. Mazher Iqbal ◽  
Munagapati Siva Kishore ◽  
Arulkumaran Ganeshan ◽  
G. Narayan
Keyword(s):  
Printed Circuit Board ◽  
System On Chip ◽  
Circuit Board ◽  
Sensor Technology ◽  
Electromechanical Systems ◽  
Printed Circuit ◽  
Design And Implementation ◽  
Hardware System ◽  
On Chip

In contrast to the existing electromechanical systems, the noncontact-type capacitive measurement allows for a chemically and mechanically isolated, continuous, and inherently wear-free measurement. Integration of the sensor directly into the container’s wall offers considerable savings potential because of miniaturization and installation efforts. This paper presents the implementation of noncontact (NC)-type level sensing techniques utilizing the Programmable System on Chip (PSoC). The hardware system developed based on the PSoC microcontroller is interfaced with capacitive-based printed circuit board (PCB) strip. The designer has the choice of placing the sensors directly on the container or close to it. This sensor technology can measure both the conductive and nonconductive liquids with equal accuracy.

A broadband differential cascode power amplifier in 45 nm CMOS for high-speed 60 GHz system-on-chip

2010 ◽  
Author(s):  
Morteza Abbasi ◽  
Torgil Kjellberg ◽  
Anton de Graauw ◽  
Edwin van der Heijden ◽  
Raf Roovers ◽  
...  
Keyword(s):  
Power Amplifier ◽  
High Speed ◽  
System On Chip ◽  
60 Ghz ◽  
On Chip

Optimized High Power GaN Transistors

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000195-000199
Author(s):  
J. Roberts ◽  
A. Mizan ◽  
L. Yushyna
Keyword(s):  
High Speed ◽  
Figure Of Merit ◽  
Printed Circuit Board ◽  
Heat Removal ◽  
Vital Role ◽  
Circuit Board ◽  
Die Structure ◽  
Power Switches ◽  
On Chip ◽  
Very High

GaN transistors intended for use at 600–900 V and that are capable of providing of 30–100 A are being introduced this year. These devices have a substantially better switching Figure-of-Merit (FOM) than silicon power switches. Rapid market acceptance is expected leading to compound annual growth rates of 85 %. However these devices present new packaging challenges. Their high speed combined with the very high current being switched demands that very low inductance packaging must be combined with highly controlled drive circuitry. While convention, and the usually vertical power device die structure, has largely determined power transistor package formats in the past, the lateral nature of the today GaN devices requires the use of new package types. The new packages have to operate at high temperatures while providing effective heat removal, low inductance, and low series resistance. Because GaN devices are lateral they require the package metal tracks to be integrated within the on-chip tracks to carry the current away from the thin on-chip metal tracks. The new GaN devices are available in two formats: one for use in embedded modular assemblies and the other for use mounted upon conventional circuit board systems. The package intended for discrete printed circuit board (PCB) assemblies has a top side cooling option that simplifies the thermal interface to the heat sink. The paper describes the die layout including the added copper tracks. The corresponding package elements that interface directly with the surface of the die play a vital role in terms of the current handling. They also provide the interface to the external busbars that allow the package to be mounted within, or on PCB. The assembly has been subject to extensive thermal analysis and the performance of a 30 A, 650 V transistor is described.

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