Numerical Method for Fatigue Life of Aircraft Lugs Under Thermal Stress

2020 ◽  
Vol 57 (4) ◽  
pp. 597-602 ◽  
Author(s):  
Ziyun You ◽  
Xintian Liu ◽  
Zhao Jiang ◽  
Xu Wang ◽  
Yansong Wang ◽  
...  
Keyword(s):  
Thermal Stress ◽  
Fatigue Life ◽  
Numerical Method

scholarly journals Simulation of Thermal Stress and Fatigue Life Prediction of High Speed Steel Work Roll during Hot Rolling Considering the Initial Residual Stress

Metals ◽  
2019 ◽  
Vol 9 (9) ◽  
pp. 966 ◽  
Author(s):  
Kejun Hu ◽  
Fuxian Zhu ◽  
Jufang Chen ◽  
Nao-Aki Noda ◽  
Wenqin Han ◽  
...  
Keyword(s):  
Residual Stress ◽  
Thermal Stress ◽  
Fatigue Life ◽  
Hot Rolling ◽  
Work Roll ◽  
Roll Surface ◽  
Initial Residual Stress ◽  
Thermal Fatigue Life ◽  
Cooling Conditions ◽  
Roll Temperature

Considerable residual stress is produced during heat treatment. Compressive residual stress at the shell is conductive to improving the thermal fatigue life of a work roll, while tensile stress in the core could cause thermal breakage. In hot rolling, thermal stress occurs under the heating-cooling cycles over the roll surface due to the contact with the hot strip and water spray cooling. The combination of thermal stress and residual stress remarkably influences the life of a work roll. In this paper, finite element method (FEM) simulation of hot rolling is performed by treating the residual stress as the initial stress. Afterwards, the effects of the initial roll temperature and cooling conditions on thermal stress considering the initial residual stress are discussed. Lastly, the thermal fatigue life of a work roll is estimated based on the strain life model. The higher initial roll temperature causes a higher temperature but a lower compressive thermal stress at the roll surface. The surface temperature and compressive stress increase significantly in the insufficient cooling conditions, as well as the center tensile stress. The calculation of the fatigue life of a work roll based on the universal slopes model according to the 10% rule and 20% rule is reasonable compared with experimental results.

The Heat Performance Analysis of HSK Shrink Toolholder

2012 ◽  
Vol 723 ◽  
pp. 275-279
Author(s):  
Jian Chen ◽  
Gui Cheng Wang ◽  
Wei Song ◽  
Gang Liu
Keyword(s):  
Thermal Stress ◽  
Fatigue Life ◽  
Performance Analysis ◽  
Induction Heating ◽  
Thermal Structure ◽  
Optimal Temperature ◽  
Ansys Software ◽  
Heating Performance ◽  
Heating And Cooling ◽  
Fea Model

The principle of the HSK shrink toolholder is expanding with heat and contracting with cold. The heat performance of HSK is analyzed. Firstly, the induction heating performance is studied by using electromagnetism-thermal-structure FEA in ANSYS software and experiment, the optimal temperature of HSK shrink toolholder is got. Secondly, thermal fatigue and calculation of the fatigue life is analyzed by using thermal-stress in ANSYS software and Coffin-Manson formula. The loads applied on the FEA model are temperature during the cycle of heating and cooling.

Thermal Wrinkling Analysis of the Platelet Thermal Management Devices

2012 ◽  
Vol 479-481 ◽  
pp. 550-554
Author(s):  
Feng Zhang ◽  
Kai Xiao ◽  
Wei Qiang Liu
Keyword(s):  
Thermal Stress ◽  
Numerical Method ◽  
Rectangular Plate ◽  
Thermal Management ◽  
Static Method ◽  
Plate Model ◽  
Analysis Method ◽  
Simply Supported ◽  
Plate Structure ◽  
Wrinkling Analysis

A simplified rectangular plate model is built up with three simply supported sides and one free side for the thermal wrinkling analysis of the platelet thermal management devices. By using the static method and the Galerkin's method, the thermal wrinkling of the structural plates under the uniform and no-uniform thermal stress is analyzed; meanwhile, numerical method for solving the platelets with three simply supported sides and one free side is also tested. The analysis method presents in the article could not only apply to the platelet thermal management devices, but also to the the wall of a rectangular vessel with an open top, and to the distortion of a welded plate structure.

Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models

2011 ◽  
Vol 462-463 ◽  
pp. 622-627 ◽  
Author(s):  
Meng Kao Yeh ◽  
Chun Lin Lu
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Thermal Stress ◽  
Fatigue Life ◽  
Stress Distribution ◽  
Thermal Fatigue ◽  
Simplified Model ◽  
The Finite Element Method ◽  
Nonlinear Analyses ◽  
Thermal Fatigue Life

The thermal stress and thermal fatigue life for three different microgyroscope chip models were investigated in this paper. The deformation and stress distribution in chip, at interface between microgyroscope and chip, and in the spring of microgyroscope were obtained for three different microgyroscope chip models by the finite element method. The results show that for the simplified model, no obvious differences from linear or nonlinear analyses are obtained and the fatigue life of microgyroscope chip can be predicted with the properly simplified model. Also, the model having the same process in fabricating microgyroscope and carrier has better reliability. This paper provides an effective method for the reliability analysis of microgyroscope chip.

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