ACCOUNTING OF THE POROSITY OF THE MATERIAL IN THE SIMULATION OF THE TIME-DEPENDENT DIELECTRIC BREAKDOWN IN THE METALLIZATION SYSTEM OF INTEGRATED CIRCUITS
Keyword(s):
In this work, simulation modeling of processes of the diffusion of copper ions in low-k dielectric between two neighboring copper lines is performed
2008 ◽
Vol 23
(6)
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pp. 1802-1808
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Keyword(s):
2017 ◽
Vol 35
(2)
◽
pp. 021509
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Keyword(s):