Research on Optimizing Parameters of Thermal Bonding Technique for PMMA Microfluidic Chip

This experimental study reports a method to increase the resolving power of isoelectric focusing (IEF) on a polymeric microfluidic chip. Microfluidic chip is formed on poly-di-methyl siloxane (PDMS) using soft lithography and multilayer bonding technique. In this novel bioseparation technique, IEF is staged by first focusing protein species in a straight channel using broad-range ampholytes and then refocusing segments of that first channel into secondary channels that branch out from the first one. Experiments demonstrated that three fluorescent protein species within a segment of pH gradient in the first stage were refocused in the second stage with much higher resolution in a shallower pH gradient. A serially performed two-stage IEF was completed in less than 25 minutes under particularly small electric field strength up to 100 V/cm.

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Study on the Manufacturing Process of Polymer Microfluidic Chip with Integrated Cu Micro Array Electrode

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.723.884 ◽

2015 ◽

Vol 723 ◽

pp. 884-887

Author(s):

Yao Xin Gu ◽

Hong Chao Qiao

Keyword(s):

Microfluidic Chip ◽

Manufacturing Process ◽

Oxygen Plasma ◽

Bonding Temperature ◽

Cover Plate ◽

Oxygen Plasma Treatment ◽

Thermal Bonding ◽

Array Electrode ◽

Micro Channels ◽

Micro Array

To produce perfect polymer microfluidic chip with integrated metal micro array electrode, an oxygen-plasma assisted manufacturing process was developed. The Cu micro array electrodes on the poly substrate was formed by photolithography, sputtering and wet etching; the micro channels on the polymer plate were hot-embossed using metal master; the bonding of cover plate and substrate using thermal bonding. The surface of the polymer plate with micro channels was treated by oxygen-plasma before thermal bonding. The oxygen-plasma treatment could decrease thermal bonding temperature from 100 °C to 85 °C. The bonding of this chip is complete, the micro electrode array keeps its integrity, and the micro channel is not distorted obviously.

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Multilayered film microreactors fabricated by a one-step thermal bonding technique with high reproducibility and their applications

Lab on a Chip ◽

10.1039/c5lc01585e ◽

2016 ◽

Vol 16 (6) ◽

pp. 977-983 ◽

Cited By ~ 8

Author(s):

Kyoung-Ik Min ◽

Jin-Oh Kim ◽

Heejin Kim ◽

Do Jin Im ◽

Dong-Pyo Kim

Keyword(s):

Three Dimensional ◽

Multilayered Film ◽

Thermal Bonding ◽

High Reproducibility ◽

Membrane Emulsification ◽

Pressure Tolerance ◽

One Step ◽

Bonding Technique

We report the versatile uses of multilayered polyimide (PI) film microreactors with various functions including pressure tolerance, three-dimensional mixing and multistep membrane emulsification.

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Microfluidic chip fabrication using hot embossing and thermal bonding of COP

Polymers for Advanced Technologies ◽

10.1002/pat.1447 ◽

2009 ◽

Vol 21 (7) ◽

pp. 457-466 ◽

Cited By ~ 23

Author(s):

Boe-Yu Pemg ◽

Chih-Wei Wu ◽

Yung-Kang Shen ◽

Yi Lin

Keyword(s):

Microfluidic Chip ◽

Hot Embossing ◽

Thermal Bonding ◽

Chip Fabrication

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Fabrication of two dimensional polyethylene terephthalate nanofluidic chip using hot embossing and thermal bonding technique

Biomicrofluidics ◽

10.1063/1.4902945 ◽

2014 ◽

Vol 8 (6) ◽

pp. 066503 ◽

Cited By ~ 13

Author(s):

Zhifu Yin ◽

E Cheng ◽

Helin Zou ◽

Li Chen ◽

Shenbo Xu

Keyword(s):

Polyethylene Terephthalate ◽

Hot Embossing ◽

Two Dimensional ◽

Thermal Bonding ◽

Bonding Technique ◽

Nanofluidic Chip

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A Microfluidic Chip Microwave Bonding Method Based on the PMMA

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.562-565.561 ◽

2013 ◽

Vol 562-565 ◽

pp. 561-565

Author(s):

Xiao Wei Liu ◽

Xiao Wei Han ◽

He Zhang ◽

Xi Yun Jiang ◽

Lin Zhao

Keyword(s):

Microwave Radiation ◽

Microfluidic Chip ◽

Mass Production ◽

Bonding Strength ◽

Microfluidic Chips ◽

Ultrasonic Bonding ◽

Microwave Absorbing ◽

Bonding Method ◽

Bonding Technique

A new bonding technique mainly for PMMA microfluidic chips is presented in this paper. In this technique, polymer microfluidic microchannels were bonded by microwave radiation. Its strength and time can be controlled accurately in watt and second level. There are so many techniques for mass-production of polymer microfluidic chip, such as heat bonding, ultrasonic bonding. However, we may find different kinds of shortages when we use these techniques. In this paper, the experiment result shows that microwave radiation’s strength and time have effects on microfluidic chip`s bonding strength. The microwave absorbing coating can also have a certain degree influence on microfluidic chip`s bonding strength.

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