A Flexible, Low Cost Test System for Failure Analysis of High Power Mixed Signal ASICs

2003 ◽  
Author(s):  
T. Kolasa ◽  
J. C. De La Torre ◽  
L. Bertram
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
High Power ◽  
Low Cost ◽  
Test System ◽  
Modular Construction ◽  
Mixed Signal ◽  
Charge Pumps ◽  
Switching Power ◽  
Compact Size

Abstract In this paper, we will present our solution to the problem of test based fault localization in the failure analysis laboratory environment. The test system described herein is currently used for a number of high power mixed signal application specific integrated circuits (ASICs) that incorporate functions including switching power supplies, charge pumps, high current drivers, precision references, ADCs/DACs, comparator circuits, and digital cores. The solution addresses the shortcomings of alternative options through modular construction, compact size, and use of a commercially available graphical software compiler to create the control code and graphical user interface (GUI).

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS BASED ON GaAs MESFET TECHNOLOGY

1995 ◽  
Vol 06 (01) ◽  
pp. 91-124
Author(s):  
INDER J. BAHL
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Low Cost ◽  
Performance Status ◽  
Microwave Integrated Circuits ◽  
Monolithic Microwave Integrated Circuits ◽  
Monolithic Microwave Integrated Circuit ◽  
Compact Size ◽  
Commercial Market ◽  
Viable Approach

Advanced military microwave systems are demanding increased integration, reliability, radiation hardness, compact size and lower cost when produced in large volume, whereas the microwave commercial market, including wireless communications, mandates low cost circuits. Monolithic Microwave Integrated Circuit (MMIC) technology provides an economically viable approach to meeting these needs. In this paper the design considerations for several types of MMICs and their performance status are presented. Multi-function integrated circuits that advance the MMIC technology are described, including integrated microwave/digital functions and a highly integrated transceiver at C-band.

Low cost test architecture for mixed-signal integrated circuits

2014 ◽  
Author(s):  
Julio L. da Silva ◽  
Emerson Camargo ◽  
Douglas Foster ◽  
Sandro T. Coelho ◽  
Antonio G. de Oliveira ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Low Cost ◽  
Mixed Signal ◽  
Test Architecture

The Design and Validation of DFT System for Mixed-Signal Circuits Based on JTAG

2013 ◽  
Vol 427-429 ◽  
pp. 636-639
Author(s):  
Guo Gang Liao ◽  
Jun Li
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Test System ◽  
Design For Test ◽  
Boundary Scan ◽  
Electronic Control ◽  
Integrity Test ◽  
Mixed Signal ◽  
Mixed Signal Circuits ◽  
Electronic Control System

Nowadays with the increases of the density of large scale integrated circuits, researches of Design for Test (DFT) become more and more important, JTAG (JTAG: Joint Test Action Group, also called Boundary Scan ) has been widely used in test area , which improves the testability and reliability of mixed-signal circuits. This paper puts forward a scheme to design a Built-in Test System (BITS) based on boundary scan technology. The BITS is realized in a weapon electronic control system, which is composed of mixed-signal circuits including ARM, AD/DA, FPGA, etc. With this method, several test experiments are carried out in the BITS, which include infrastructure integrity test, interconnect test, cluster test, AD/DA test and so on. The results of experiments show that the Built-in Test System based on JTAG can work normally, which is able to reduce effectively the complexity and the time of test. In a word, the capability of BITS is viable and the system is a virtual tool in the process of DFT design and application.

Methodologies for Isolating Faults in Multi Chip Fiber Optic Transceivers That Use GHz Mixed Signal ICs

2002 ◽  
Author(s):  
Kuhn Seo ◽  
Brent Wahl ◽  
Myrna Mayonte ◽  
Young Gon Kim
Keyword(s):  
Integrated Circuits ◽  
Failure Analysis ◽  
Fiber Optic ◽  
Digital Signals ◽  
Mixed Signal ◽  
Loading Effect ◽  
High Impedance ◽  
Single Probe ◽  
Data Signal ◽  
Rf Signal

Abstract This paper outlines a methodology which accurately identifies fault locations in Mixed Signal Integrated Circuits (ICs). The architecture of Mixed Signal ICs demands more attention during failure analysis because of the complexity of measuring both the analog and digital signals in a compact circuit. In this paper, the GHz range of data signal or radio frequency (RF) signal from an internal IC circuit will be extracted by a high-impedance active single probe in order to find the internal IC circuit failure locations. The advantages of using a single probe is that it can maneuver to extract data almost anywhere in the circuit, providing ranges of bandwidth in GHz with no loading effect on the circuits during measurement. The process of preparing a sample and extracting a signal will be described.

scholarly journals Design automation of ΔΣ switched capacitor modulators using spice and MATLAB

2014 ◽  
Vol 11 (1) ◽  
pp. 47-59
Author(s):  
Dejan Mirkovic ◽  
Predrag Petkovic
Keyword(s):  
Integrated Circuits ◽  
Design Automation ◽  
Low Cost ◽  
Signal Design ◽  
Time Saving ◽  
Mixed Signal ◽  
Working Environments ◽  
High Level ◽  
Technology Processes ◽  
Simulation Time

Concerning the fact that the design of contemporary integrated circuits (IC) is practically impossible without using sophisticated Electronic Design Automation (EDA) software, this paper gives some interesting thoughts and considerations about that issue. As technology processes advances on year basis consequently EDA industry is forced to follow this trend as well. This, on the other hand, requires IC designer to frequently and efficiently accommodate to new working environments. Authors of this paper suggest a method for high level circuit analysis that is based on using common (open source or low cost) circuit simulators but precise and fast enough to meet requirements imposed by demanding mixed-signal blocks. The paper demonstrates the proposed EDA procedure on an example of second order ?? modulator design. It illustrates considerable simulation time saving which is more than welcome in a world of analogue and mixed-signal design.

scholarly journals Numerical analysis of thermal performance of heat exchanger: Different plate structures and fluids

2021 ◽  
pp. 195-195
Author(s):  
Muhammad Khan ◽  
Yong Song ◽  
Qunying Huang
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Heat Transfer Rate ◽  
Thermal Performance ◽  
Transfer Rate ◽  
Low Cost ◽  
Working Fluid ◽  
Modular Construction ◽  
Construction Time ◽  
Compact Size

Due to compact size, high power density, low cost and short construction time, the Small Modular Reactors (SMRs) are considered as one of the candidate reactors, in which the power generation system is important with a compact heat exchanger for modular construction. Therefore, the effect of plate structure and nature of the working fluid on the thermal performance of Plate Heat Exchanger (PHE) are analyzed for the design of compact and efficient heat exchanger. The heat transfer rate, temperature counters, velocity vectors and pressure drop have been optimized and investigated using FLUENT. The Nusselt number has been calculated for the corrugated and flat PHE to validate the convective heat transfer. The numerical results are agreed well with correlation within deviation of ~ 5-7%. The performance of heat exchanger can be improved by controlling the mass flow rate and temperature of working fluid. The corrugation PHE increases the heat transfer rate 20 % and effectiveness 23 %, respectively, as compare to flat PHE when the working fluid is water. In the case of air, heat transfer rate and effectiveness are about 10 % and 9 %, respectively. The results show that the corrugated PHE is more effective than the flat PHE because corrugation pattern enhances the turbulence of fluids, which further increase heat transfer rate and coefficient. The selection of the working fluid and structure of the plate must be considered carefully for efficient and compact design of heat exchanger.

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