Combining the Nano-Probing Technique with Mathematics to Model and Identify Non-Visual Failures

2007 ◽  
Author(s):  
Cha-Ming Shen ◽  
Tsan-Chen Chuang ◽  
Shi-Chen Lin ◽  
Lian-Fon Wen ◽  
Chen-May Huang
Keyword(s):  
Electron Microscopy ◽  
Failure Mechanisms ◽  
Defect Modes ◽  
Failure Characteristics ◽  
Transmission Electron ◽  
Electrical Analysis ◽  
Visual Failure ◽  
Electrical Data ◽  
Tem Transmission Electron Microscopy

Abstract In this paper, we focus on how to identify non-visual failures by way of electrical analysis because some special failures cannot be observed by SEM (scanning electron microscopy) or TEM (transmission electron microscopy) even when they are precisely located by other analytical instrumentation or are symptomatic of an authentic or single suspect. The methodology described here was developed to expand the capabilities of nano-probing via C-AFM (conductive atomic forced microscopy), which can acquire detailed electrical data, and combining the technique with reasoned simulation using various mathematic models emulating all of the significant failure characteristics. Finally, a case study is presented to verify that such defect modes can be identified even when general PFA (physical failure analysis) cannot be implemented for investigating non-visual failure mechanisms.

An Overview of Cu Wire Intermetallic Compound Formation and a Corrosion Failure Mechanism

2012 ◽  
Author(s):  
Dongmei Meng ◽  
Laura Buck ◽  
James Cargo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Corrosion Mechanism ◽  
Fundamental Study ◽  
Corrosion Failure ◽  
Transmission Electron ◽  
Intermetallic Compound Formation ◽  
Scanning Transmission ◽  
Low K

Abstract Cu needs a higher level of ultrasound combined with bonding force to be bonded to the Al pad properly, not just because Cu is harder than Au, but it is also harder to initiate intermetallic compounds (IMC) formation during bonding. This increases the chances of damaging the metal/low k stack under the bondpad. This paper presents a fundamental study of IMC as well as one example of a failure mode of Cu/Al bonded devices, all based on detailed analysis using scanning electron microscopy, scanning transmission electron microscopy, energy dispersive spectrometers, and transmission electron microscopy. It presents a case study showing a corrosion mechanism of Cu/Al ballbond after 168hr UHAST stress. It is observed that all Cu9Al4 was consumed, while very little copper aluminide remained after 168 hours of UHAST stressing.

Microstructure of Interface between Zirconia and Veneer Porcelain

2011 ◽  
Vol 492 ◽  
pp. 55-60 ◽  
Author(s):  
Bin Deng ◽  
Hong Chen Liu ◽  
Yuan Fu Yi ◽  
Long Quan Shao ◽  
Kang Lin Hou ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Surface Composition ◽  
Glass Composition ◽  
Lattice Structure ◽  
Etching Time ◽  
Interface Bonding ◽  
Transmission Electron ◽  
Bonding Property ◽  
Amorphous Glass ◽  
Tem Transmission Electron Microscopy

To study whether the veneering technique will have an impact on zirconia grain and the bonding type and relationship on interface between zirconia and veneer porcelain. Materials and methods: After sintered, zirconia was annealed for 15 minute to finish the phase transition from m to t.4 types of veneer porcelains were sintered and observed with SEM (scanning electron microscopy) and TEM (transmission electron microscopy). Results: With etching time extending, it appeared that many materials loosed and corrosional pit deepened, enlarged in the veneer porcelain, which made crystallize structure move into veneering surface. Composition of interface mainly was amorphous glass matrix and zirconia. Energy spectrum analysis showed that there was no remnant glass composition in the zirconia side departing from interface. SEM showed that crystal in veneering side did not participate interface bonding. Conclusion: The interface between 4 types of veneer porcelains and zirconia bonded well. Veneering sintering technique didn’t change lattice structure of zirconia, which still was tetragonal structure. The specific bonding property of interface still remained to be analyzed further to determine.

scholarly journals Particle size distributions by transmission electron microscopy: an interlaboratory comparison case study

Metrologia ◽  
2013 ◽  
Vol 50 (6) ◽  
pp. 663-678 ◽  
Author(s):  
Stephen B Rice ◽  
Christopher Chan ◽  
Scott C Brown ◽  
Peter Eschbach ◽  
Li Han ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Particle Size ◽  
Interlaboratory Comparison ◽  
Size Distributions ◽  
Particle Size Distributions ◽  
Transmission Electron

A Study of SRAM Device Soft Failures Caused by Contact Volcano Defects Using Nanoprobing Analysis

2011 ◽  
Author(s):  
Yu Hsiang Shu ◽  
Vincent Huang ◽  
Chia Hsing Chao
Keyword(s):  
Failure Analysis ◽  
High Resistance ◽  
Ion Beam ◽  
Analysis Method ◽  
Root Cause ◽  
Parametric Data ◽  
Transmission Electron ◽  
Focus Ion Beam ◽  
Electrical Data

Abstract Using nanoprobing techniques to accomplish transistor parametric data has been reported as a method of failure analysis in nanometer scale defect. In this paper, we focus on how to identify the influence of Contact high resistance on device soft failures using nanoprobing analysis, and showing that the equivalent mathematical models could be used to describe the corresponding electrical data in a device with Contact high resistance issue. A case study was presented to verify that Contact volcano defect caused Contact high resistance issue, and this issue can be identified via physical failure analysis (PFA) method (e.g. Transmission Electron Microscope and Focus Ion Beam techniques) and nanoprobing analysis method. Finally, we would explain the physical root cause of Contact volcano issue.

Length Scale Effect on Deformation and Failure Mechanisms of Ultra-Fine Grained Aluminum

2005 ◽  
Vol 907 ◽  
Author(s):  
Khalid Hattar ◽  
J H Han ◽  
D M Follstaedt ◽  
S J Hearne ◽  
T A Saif ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Shear Failure ◽  
Failure Mechanisms ◽  
Deformation And Failure ◽  
Fine Grained ◽  
Transmission Electron ◽  
Microscopic Deformation ◽  
Different Thickness ◽  
Scanning Electron

AbstractThe deformation and failure processes in ultra-fine and nanograined metals over different length scales have been probed using transmission electron microscopy (TEM) and scanning electron microscopy (SEM) in combination with a micromechanical in situ straining device. This novel straining device affords the opportunity to directly correlate the macroscopic mechanical properties with the microscopic deformation and failure mechanisms. Through use of this device it has been shown that increased film thickness results in a transition between limited plasticity and intergranular fracture to global plasticity and shear failure for deposited aluminum samples of similar grain size but different thickness.

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