Comparative Study on Decapsulation for Copper and Silver Wire-Bonded Devices

2014 ◽  
Author(s):  
François Kerisit ◽  
Bernadette Domenges ◽  
Michael Obein
Keyword(s):  
Comparative Study ◽  
Failure Analysis ◽  
Silver Wire ◽  
Bonding Material ◽  
Bond Wires

Abstract The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.

scholarly journals A visible light-activated direct-bonding material: An in vivo comparative study

1989 ◽  
Vol 95 (4) ◽  
pp. 348-351 ◽  
Author(s):  
K.D. O'Brien ◽  
M.J.F. Read ◽  
R.J. Sandison ◽  
C.T. Roberts
Keyword(s):  
Comparative Study ◽  
Visible Light ◽  
Bonding Material

CF4-Free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices

2016 ◽  
Author(s):  
Jiaqi Tang ◽  
Jing Wang ◽  
Gregory B. Anderson ◽  
Johannes Bruckmeier ◽  
Claudia Keller ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Semiconductor Device ◽  
Copper Wire ◽  
Semiconductor Devices ◽  
Etching Rate ◽  
Automatic Process ◽  
Microwave Induced Plasma ◽  
Bond Wires ◽  
Etching Selectivity ◽  
Bond Pads

Abstract Failure analysis of automotive semiconductor devices requires highly reliable techniques to guaranty the success of artifact-free decapsulation with high repeatability and reproducibility. With the introduction of new qualification standards, new mold compounds, and new packaging structures, advanced decapsulation tools are needed to enable failure analysis to achieve a high success rate. Microwave Induced Plasma (MIP) machine has been developed as an advanced decapsulation solution. The CF4-free MIP etching ensures artifact-free exposure of bond wires made of new materials, the die, passivation, bond pads, and original failure sites. The high mold compound etching rate, high etching selectivity of mold compound to wire/pad/passivation/die, and the fully automatic process are the unique features of MIP decapsulation. Comparisons are made between acid, conventional plasma with CF4, and CF4-free MIP decapsulation. Multiple case studies are discussed that address challenging automotive semiconductor device decapsulation, including bare copper wire, copper redistribution layer, exposed power copper metal, stitch bond on silver plated leadframe, complex mold compound, Bond-Over-Active-Circuit, eWLB, and localized decapsulation.

Nondestructive Bond Pull and Ball Shear Failure Analysis Based on Real Structural Properties

2016 ◽  
Author(s):  
Navid Asadizanjani ◽  
Domenic Forte ◽  
Mark Tehranipoor
Keyword(s):  
Finite Element ◽  
Failure Analysis ◽  
Shear Failure ◽  
Element Analysis ◽  
Bond Wires ◽  
Bond Wire ◽  
Pull Tests ◽  
Pull Testing ◽  
Ic Package ◽  
Physical Access

Abstract Bond pull testing, a well-known method in the failure analysis community, is used to evaluate the integrity of an electronic microchip as well as to detect counterfeit ICs. Existing bond pull tests require that the microchip be de-capsulated in order to obtain physical access to the bond wires in the IC package. Bond pull analysis based on simulation and finite element methods also exists but relies on the original model for a bond wire from a CAD design. In this work, we introduce X-ray tomography imaging with 700nm imaging resolution to acquire the 3D geometry details of bond wires non-destructively. Such information can be used to develop more accurate models for finite element analysis based on real size and structure. Therefore, one can test the bond wire strength as a proof of concept for virtual mechanical testing and counterfeit detection in microchips.

Package Related Failure Mechanisms in Plastic BGA Packages Used for ASIC Devices

1996 ◽  
Author(s):  
K. Parekh ◽  
R. Milburn ◽  
K. Georgia
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Failure Mechanisms ◽  
Circuit Board ◽  
Physical Damage ◽  
Bga Packages ◽  
Plastic Surface ◽  
Bga Package ◽  
Bond Wires ◽  
Ball Bonds

Abstract This paper describes various package related failure mechanisms observed in the plastic surface mount Ball Grid Array (BGA) package. Two types of plastic BGA packages commonly known as 225 OMPAC™ (Over Molded Pad Array Carrier) and 225 GTPAC (Glob Top Pad Array Carrier) are covered in this paper. The GTPAC is not offered as a production package, but it is used for commercial prototypes and evaluations. The failure analysis results discussed in this paper are primarily of the devices which failed at different times during various reliability and qualification testing over a period of two years. The failure analysis results of field returns (about 10% of al the devices analyzed) from customers for the same period are also included in this study. Of all the devices in the BGA packages which were failure analyzed, about 50% lailed due to package related problems. All the package related failures fall into two major categories of failure mechanisms, package delamination and cracked open copper traces on the printed circuit board (PCB). The delamination resulted in a variety of physical damage such as lifted ball bonds at the die pads, fractured bond wires in the span as well as at the heel of the crescent bonds on the PCB substrate, and cracking of the encapsulant. The copper traces cracked from two types of stresses, mechanical and thermal. In addition, some of the techniques used for the failure analysis are briefly discussed in this paper.

A Visible Light-activated Direct Bonding Material: An In Vitro Comparative Study

1984 ◽  
Vol 11 (1) ◽  
pp. 33-37 ◽  
Author(s):  
M. A. Tavas ◽  
D. C. Watts
Keyword(s):  
Comparative Study ◽  
Visible Light ◽  
Mechanical Performance ◽  
Bonding Agent ◽  
Bonding Material ◽  
Orthodontic Bonding

This paper reports on the mechanical performance of a visible light cured orthodontic bonding agent. It is concluded that this type of material is as effective as other commercial adhesives and offers certain advantages in handling. Resistance to 4kg of force in the shear/peel mode within the first 5 minutes of its application is expected from a clinically usable adhesive.

Decapsulation of Copper Bonded Plastic Encapsulated Integrated Circuits Utilizing Laser Ablation and Mixed Acid Chemistry

2010 ◽  
Author(s):  
Jake E. Klein ◽  
Lucas Copeland
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Packaging Material ◽  
Device Characterization ◽  
Mixed Acid ◽  
Root Cause ◽  
Analysis Methodology ◽  
Bond Wires ◽  
Root Cause Failure Analysis

Abstract By utilizing a NdYAG lamp pumped marking laser, along with unique mixes of specific acids, reproducible decapsulation of copper bonded devices without damage to the bond wires, packaging material, or to the silicon die circuitry itself can be achieved. With the copper bond wires, die, or substrate exposed, typical failure analysis methodology can then be applied to drive root cause failure analysis or device characterization.

Author response for "Laminar distribution of cortical projection neurons to the pulvinar: A comparative study in cats and mice"

2020 ◽  
Author(s):  
Bruno Oliveira Ferreira de Souza ◽  
Éve‐Marie Frigon ◽  
Robert Tremblay‐Laliberté ◽  
Christian Casanova ◽  
Denis Boire
Keyword(s):  
Comparative Study ◽  
Author Response ◽  
Projection Neurons ◽  
Cortical Projection ◽  
Laminar Distribution
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