Failure Analysis of Total-Dose Radiation-Induced Degradation on FinFET Logic ICs

2020 ◽  
Author(s):  
Joy Y. Liao ◽  
Somayyeh Rahimi ◽  
Christian Schmidt ◽  
Howard Lee Marks
Keyword(s):  
Failure Analysis ◽  
Total Dose ◽  
Semiconductor Industry ◽  
Total Ionizing Dose ◽  
X Ray ◽  
Surface Mount ◽  
X Ray Imaging ◽  
Device Applications ◽  
Radiation Induced ◽  
Dose Radiation

Abstract X-ray imaging for both Failure Analysis and In-line Inspection has been utilized widely in the semiconductor industry, especially for surface mount device applications. During the investigation of total ionizing dose (TID) induced degradation of logic ICs with bulk FinFET technology, we observed that the degradation is mainly in the form of an increase in I/O leakage and IDDQ. Using filters during radiation was shown to impact TID. Failure Analysis was performed to localize the excessive current in both I/O leakage and IDDQ.

X-ray radiation source for total dose radiation studies

2004 ◽  
Vol 71 (3-4) ◽  
pp. 713-715 ◽  
Author(s):  
D. Bisello ◽  
A. Candelori ◽  
A. Kaminski ◽  
A. Litovchenko ◽  
E. Noah ◽  
...  
Keyword(s):  
Total Dose ◽  
Radiation Source ◽  
X Ray ◽  
Dose Radiation

High-Stable X-ray Imaging from All-Inorganic Perovskite Nanocrystals under a High Dose Radiation

2020 ◽  
Vol 11 (21) ◽  
pp. 9203-9209 ◽  
Author(s):  
Liuli Yang ◽  
Hao Zhang ◽  
Min Zhou ◽  
Lei Zhao ◽  
Weiqing Chen ◽  
...  
Keyword(s):  
High Dose ◽  
Inorganic Perovskite ◽  
Perovskite Nanocrystals ◽  
X Ray ◽  
X Ray Imaging ◽  
Dose Radiation

Failure Analysis Using Microfocus X-ray Imaging

1999 ◽  
Vol 27 (2) ◽  
pp. 137 ◽  
Author(s):  
DR Petersen ◽  
RE Link ◽  
RH Bossi
Keyword(s):  
Failure Analysis ◽  
X Ray ◽  
X Ray Imaging

Total-dose radiation-induced degradation of thin film ferroelectric capacitors

1990 ◽  
Vol 37 (6) ◽  
pp. 1703-1712 ◽  
Author(s):  
J.R. Schwank ◽  
R.D. Nasby ◽  
S.L. Miller ◽  
M.S. Rodgers ◽  
P.V. Dressendorfer
Keyword(s):  
Thin Film ◽  
Total Dose ◽  
Radiation Induced ◽  
Ferroelectric Capacitors ◽  
Dose Radiation

Application to Non Destructive Physical Analysis Method Using X-ray CT Imaging

2010 ◽  
Author(s):  
Akira Mizoguchi ◽  
Minoru Sugawara ◽  
Masahide Nakamura ◽  
Koichiro Takeuchi
Keyword(s):  
Failure Analysis ◽  
Three Dimensional ◽  
Ct Imaging ◽  
Temperature Cycling ◽  
Physical Analysis ◽  
Printed Wiring Boards ◽  
X Ray ◽  
X Ray Imaging ◽  
X Ray Computed ◽  
Non Destructive

Abstract We have been paying attention to the development of the nondestructive physical analysis (NDPA) technology. We think that NDPA is a technology which doesn't depend on the worker's capability or experience. There are many NDPA techniques, and analysis using X-ray imaging is one of the principal techniques. Due to the progress of the image analysis using computers in recent years, X-ray imaging have been evolving from two dimensional images to three dimensional imaging. We have been applying X-ray CT imaging to actual failure analysis and reliability evaluation since 2008. At ISTFA 2009, we reported on the effectiveness of X-ray Computed Tomography (CT) images in the failure analysis. [1] We confirmed that the X-ray CT image had various applications, for example, screening for counterfeit parts, the detection of the defect of the multi-layers printed wiring boards (multi-layers PWB), the structure confirmation of caulking contacts, and the detection of cracks or voids of the solder joint. This paper discusses the effectiveness of X-ray CT imaging in failure analysis and discusses the effectiveness of applying X-ray CT imaging to the propagation of cracks occurring at solder joints during temperature cycling test.

scholarly journals X-Ray Hesitancy: Patients’ Radiophobic Concerns Over Medical X-rays

Dose-Response ◽  
2020 ◽  
Vol 18 (3) ◽  
pp. 155932582095954 ◽  
Author(s):  
Paul A. Oakley ◽  
Deed E. Harrison
Keyword(s):  
Low Dose ◽  
Background Radiation ◽  
X Rays ◽  
Adaptive Responses ◽  
Low Dose Radiation ◽  
X Ray ◽  
X Ray Imaging ◽  
The Family ◽  
Diagnostic Radiation ◽  
Dose Radiation

All too often the family physician, orthopedic surgeon, dentist or chiropractor is met with radiophobic concerns about X-ray imaging in the clinical setting. These concerns, however, are unwarranted fears based on common but ill-informed and perpetuated ideology versus current understanding of the effects of low-dose radiation exposures. Themes of X-ray hesitancy come in 3 forms: 1. All radiation exposures are harmful (i.e. carcinogenic); 2. Radiation exposures are cumulative; 3. Children are more susceptible to radiation. Herein we address these concerns and find that low-dose radiation activates the body’s adaptive responses and leads to reduced cancers. Low-dose radiation is not cumulative as long as enough time (e.g. 24 hrs) passes prior to a repeated exposure, and any damage is repaired, removed, or eliminated. Children have more active immune systems; the literature shows children are no more affected than adults by radiation exposures. Medical X-rays present a small, insignificant addition to background radiation exposure that is not likely to cause harm. Doctors and patients alike should be better informed of the lack of risks from diagnostic radiation and the decision to image should rely on the best evidence, unique needs of the patient, and the expertise of the physician—not radiophobia.

scholarly journals Development of a Lightweight Tungsten Shielding Fiber That Can Be Used for Improving the Performance of Medical Radiation Shields

2021 ◽  
Vol 11 (14) ◽  
pp. 6475
Author(s):  
Seon-Chil Kim
Keyword(s):  
Scattered Radiation ◽  
Low Dose ◽  
Radiation Shielding ◽  
Shielding Effectiveness ◽  
Tungsten Fiber ◽  
Low Dose Radiation ◽  
X Ray ◽  
Medical Institutions ◽  
X Ray Imaging ◽  
Dose Radiation

Radiation exposure in medical institutions is mainly due to low doses. Low-dose radiation mainly means scattered radiation, and such scattered radiation can be shielded with a lightweight shielding suit. In this study, the shielding performance of shielding fabrics woven by winding polyethylene (PE) yarn around a 30 μm tungsten wire was evaluated. To improve the shielding performance, an air pressure dispersion process of coating tungsten nanopowder on the fiber was developed. The radiation shielding effectiveness of the shielding fibers with and without dispersed tungsten nanopowder were compared by measuring the spatial dose inside the diagnostic X-ray imaging room of a medical institution. The results of the experiment confirmed that the fabric coated with tungsten nanopowder improved the shielding performance of the general tungsten fiber by approximately 15% and provided relatively effective low-dose radiation shielding at approximately 1.2 m of the X-ray imaging equipment. This study shows that tungsten fiber can be helpful in manufacturing lightweight shielding clothing for protection from scattered radiation in medical institutions.

Non-Destructive 3D Failure Analysis Work Flow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy

2018 ◽  
Author(s):  
Antonio Orozco ◽  
Elena Talanova ◽  
Alex Jeffers ◽  
Florencia Rusli ◽  
Bernice Zee ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Failure Analysis ◽  
Integrated Circuit ◽  
Semiconductor Industry ◽  
Three Dimensional ◽  
X Ray ◽  
Electrical Failure ◽  
Magnetic Field Imaging ◽  
3D Stacking ◽  
Field Imaging

Abstract Industry and market requirements keep imposing demands in terms of tighter transistor packing, die and component real estate management on the package, faster connections and expanding functionality. This has forced the semiconductor industry to look for novel packaging approaches to allow for 3D stacking of transistors (the so called “More than Moore”). This complex 3D geometry, with an abundance of opaque layers and interconnects, presents a great challenge for failure analysis (FA). Three-dimensional (3D) magnetic field imaging (MFI) has proven to be a natural, useful technique for non-destructively mapping 3D current paths in devices that allows for submicron vertical resolution. 3D X-ray microscopy (XRM) enables 3D tomographic imaging of advanced IC packages without the need to destroy the device. This is because it employs both geometric and optical image magnifications to achieve high spatial resolution. In this paper, we propose a fully nondestructive, 3D-capable workflow for FA comprising 3D MFI and 3D XRM. We present an application of this novel workflow to 3D defect localization in a complex 2.5D device combining high bandwidth memory (HBM) devices and an application specific integrated circuit (ASIC) unit on a Si interposer with a signal pin electrical short failure.

The Changing Role of Advanced Sample Preparation in X-Ray Inspection Supporting 2.5D and 3D Sample Failure Analysis

2015 ◽  
Author(s):  
Rosanne M. LaVoy ◽  
Fred Babian ◽  
Matthew Mulholland ◽  
Scott Silverman
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Tomographic Reconstruction ◽  
Integrated Approach ◽  
The Novel ◽  
Throughput Time ◽  
X Ray ◽  
Flip Chips ◽  
X Ray Imaging ◽  
Changing Role

Abstract The X-ray inspection of fully assembled samples is becoming ever more important as the benefits of using area array packages/chip scale packages/flip chips are applied to more and more products. Sample preparation has traditionally been used to improve access to geometry or a specific location with a known defect that requires verification. The novel paradigm is an integrated approach to sample preparation and X-ray inspection to optimize resolution and throughput time performance with minimally deprocessed sample. This paper, covering the limitations of X-Ray imaging and 3D tomographic reconstruction, discusses the development of models for throughput time and resolution by failure analysis labs. It also discusses the processes involved in advanced sample preparation techniques and global BGA removal to obtain improved resolution at die level.

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