scholarly journals Correlation Of Printed Circuit Board Properties To Pad-Crater Defects Under Monotonic Spherical Bend

2021 ◽  
Author(s):  
Brian Gray
Keyword(s):  
Tensile Properties ◽  
Strain Energy ◽  
Printed Circuit Board ◽  
Bend Test ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Base Materials ◽  
Materials Used ◽  
Strain Responses

The restriction of lead in solder has caused a change in base materials used to make electronics—the result of which has been a new failure mode known as pad-crater. The susceptibility of six commercially available printed circuit board (PCB) laminates to pad-crater by spherical bend test was determined. The correlation of PCB laminate tensile properties, Vicker’s hardness (VH) of the resin, and weave dimensions showed an inverse relation between susceptibility to pad-crater and VH. Spherical bend testing of pure G10 laminate showed the orthotropic nature of laminates must be accounted for when modeling spherical bend. Comparison of bare PCB spherical bend test results showed the warp and weft direction have different strain responses for some materials. Comparison of strain energy of printed circuit board assemblies and bare PCB subjected to spherical bend showed the additional stiffness added by the ball grid array is almost identical for PCB laminates with different tensile properties.

scholarly journals Correlation Of Printed Circuit Board Properties To Pad-Crater Defects Under Monotonic Spherical Bend

2021 ◽  
Author(s):  
Brian Gray
Keyword(s):  
Tensile Properties ◽  
Strain Energy ◽  
Printed Circuit Board ◽  
Bend Test ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Base Materials ◽  
Materials Used ◽  
Strain Responses

The restriction of lead in solder has caused a change in base materials used to make electronics—the result of which has been a new failure mode known as pad-crater. The susceptibility of six commercially available printed circuit board (PCB) laminates to pad-crater by spherical bend test was determined. The correlation of PCB laminate tensile properties, Vicker’s hardness (VH) of the resin, and weave dimensions showed an inverse relation between susceptibility to pad-crater and VH. Spherical bend testing of pure G10 laminate showed the orthotropic nature of laminates must be accounted for when modeling spherical bend. Comparison of bare PCB spherical bend test results showed the warp and weft direction have different strain responses for some materials. Comparison of strain energy of printed circuit board assemblies and bare PCB subjected to spherical bend showed the additional stiffness added by the ball grid array is almost identical for PCB laminates with different tensile properties.

scholarly journals Research on the calibrated method for MEMS magnetometer arrays

2020 ◽  
Author(s):  
Zetao Guo ◽  
Xiang Xu ◽  
Tao zhang
Keyword(s):  
Printed Circuit Board ◽  
Experimental Tests ◽  
Measurement Model ◽  
General Purpose ◽  
Circuit Board ◽  
Test Results ◽  
Adaptive Kalman Filter ◽  
Unknown Parameters ◽  
Printed Circuit ◽  
Magnetometer Arrays

The MEMS magnetometer determines the orientation for the MEMS inertial system. Because of the large noise of the MEMS magnetometer and the interference of soft and hard iron outside, the measurement error of the MEMS magnetometer is large. To reduce the effects of the random noises, the MEMS magnetometer arrays are designed in this paper. In our design, thirty-two MEMS magnetometers are welding on a printed circuit board (PCB), which area is 5×5 cm2. The forty general-purpose input-output (GPIO) ports, which are thirty-two data ports and eight clock ports, are used to collect the data of MEMS magnetometers. Then, averaging the thirty-two measurements of the MEMS magnetometers, the random noises of the measurements of the MEMS magnetometers can be reduced. Based on the averaging operation for the collected sensors’ data, a unified measurement model for the MEMS magnetometer arrays is constructed. Using the unified measurement model, an adaptive Kalman filter is developed to estimate the unknown parameters. To validate the performance of the MEMS magnetometer arrays, the simulation and experimental tests are designed. The test results show that, comparing with the single MEMS magnetometer, the random noises of the MEMS magnetometer arrays are reduced effectively.

The biocompatibility of materials used in printed circuit board technologies with respect to primary neuronal and K562 cells

Biomaterials ◽  
2010 ◽  
Vol 31 (6) ◽  
pp. 1045-1054 ◽  
Author(s):  
Manuela Mazzuferi ◽  
Roberta Bovolenta ◽  
Massimo Bocchi ◽  
Tanja Braun ◽  
Joerg Bauer ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
K562 Cells ◽  
Circuit Board ◽  
Printed Circuit ◽  
Materials Used

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

scholarly journals The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints

Materials ◽  
2019 ◽  
Vol 12 (6) ◽  
pp. 960 ◽  
Author(s):  
Min-Soo Kang ◽  
Do-Seok Kim ◽  
Young-Eui Shin
Keyword(s):  
Solder Joint ◽  
Strain Energy ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Solder Paste ◽  
Element Analysis ◽  
Printed Circuit ◽  
Shock Testing ◽  
Polymer Addition

To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit board. The effect of repetitive thermal stress on the solder joints was then analyzed experimentally using thermal shock testing (−40 °C to 125 °C) over 2000 cycles. The viscoplastic stress–strain curves generated in the solder were simulated using finite element analysis, and the hysteresis loop was calculated. The growth and propagation of cracks in the solder were also predicted using strain energy formulas. It was confirmed that the epoxy paste dispersed the stress inside the solder joint by externally supporting the solder fillet, and crack formation was suppressed, improving the lifetime of the solder joint.

Use of Printed Circuit Board as Electrode in EHD-Enhanced Condensation Experiments for a Shell/Tube Bundle Heat Exchanger

2005 ◽  
Author(s):  
J. Wu ◽  
M. M. Ohadi ◽  
S. Dessiatoun ◽  
J. Qi
Keyword(s):  
Heat Exchanger ◽  
Printed Circuit Board ◽  
Tube Bundle ◽  
Saturation Temperature ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Transfer Tube ◽  
Enhanced Tubes ◽  
R 134A

Electro-hydrodynamic (EHD) enhancement of external condensation of refrigerant R-134a for a twenty-four tube bundle heat exchanger was studied experimentally. The tubes used in the bundle were state of the art enhanced tubes provided by a heat transfer tube manufacturer. Printed circuit board was used as the electrode and it was inserted between the tube columns to reduce the bundle effect. Different heat flux levels were tested, ranging from 10 to 20 kW/m2. The saturation temperature was 30°C and the applied electric field voltage ranged from 0 to 20 kV. The obtained test results indicated that PCB electrode worked effectively as the electrode in the tube bundle test and up to 31% enhancement was achieved. Comparison with single tube test showed that bundle was reduced to a satisfactory level.

scholarly journals Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

2020 ◽  
Vol 17 (3) ◽  
pp. 89-98
Author(s):  
John H. Lau ◽  
Cheng-Ta Ko ◽  
Chia-Yu Peng ◽  
Kai-Ming Yang ◽  
Tim Xia ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Printed Circuit Board ◽  
Drop Test ◽  
Circuit Board ◽  
Reliability Test ◽  
Heterogeneous Integration ◽  
Test Results ◽  
Glass Panel ◽  
Printed Circuit

Abstract In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous integration of one large chip (10 × 10 mm2) and two small chips (7 × 5 mm2) by an FOPLP method on a 20 × 20-mm2 RDL-first substrate fabricated on a 515 × 510 mm2 temporary glass panel. Reliability test such as the drop test of the heterogeneous integration package on a printed circuit board (PCB) is performed, and test results including failure analysis are presented. Some recommendations are also provided.

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