scholarly journals Research on Material Removal Mechanism of Micro-EDM in Deionized Water

Coatings ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 322
Author(s):  
Tingting Ni ◽  
Qingyu Liu ◽  
Yunzhong Wang ◽  
Zhiheng Chen ◽  
Dongsheng Jiang
Keyword(s):  
Material Removal ◽  
Open Circuit Voltage ◽  
Pulse Discharge ◽  
Reference Value ◽  
Open Circuit ◽  
Deionized Water ◽  
Micro Edm ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Crater Size

As one of the most promising processing methods, the microelectrical discharge machining (micro-EDM) process is widely used in industrial production; however, the material removal mechanism of micro-EDM in deionized water has not been clarified due to scale effect. In this paper, the influence of discharge parameters on the discharge crater size was studied by means of a single-pulse discharge experiment using a resistor–capacitor circuit (RC circuit). The variation trend of the discharge crater size with open-circuit voltage and capacitance was discussed based on the experimental results. The results show that the diameter and depth of the discharge crater increases with capacitance and open-circuit voltage due to the increasing discharge duration and the energy density of the discharge plasma. The discharge energy increases with the increase of capacitance and open-circuit voltage, which causes more materials to melt and vaporize, leading to the crater volume becoming larger. This study has reference value for the further application of micro-EDM adopting deionized water as a dielectric.

scholarly journals Material removal mechanism in low-energy micro-EDM process

CIRP Annals ◽  
2015 ◽  
Vol 64 (1) ◽  
pp. 225-228 ◽  
Author(s):  
Jun Qian ◽  
Fei Yang ◽  
Jun Wang ◽  
Bert Lauwers ◽  
Dominiek Reynaerts
Keyword(s):  
Material Removal ◽  
Low Energy ◽  
Micro Edm ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Edm Process

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

A Review of Material Removal Mechanism in Ultra-Precision Polishing of Optical Glass

2021 ◽  
Vol 48 (4) ◽  
pp. 0401014
Author(s):  
蒋小为 Jiang Xiaowei ◽  
龙兴武 Long Xingwu ◽  
谭中奇 Tan Zhongqi
Keyword(s):  
Material Removal ◽  
Optical Glass ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Ultra Precision
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