scholarly journals Effect of Electromigration and Thermal Ageing on the Tin Whiskers’ Formation in Thin Sn–0.7Cu–0.05Ga Lead (Pb)-Free Solder Joints

Coatings ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 935
Author(s):  
Noor Zaimah Mohd Mokhtar ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Muhammad Mahyiddin Ramli ◽  
Jitrin Chaiprapa ◽  
...  
Keyword(s):  
Solder Joints ◽  
Short Circuit ◽  
Electronic Devices ◽  
Fracture Morphology ◽  
Optical Microscope ◽  
Thermal Ageing ◽  
Ambient Conditions ◽  
Sn Whisker ◽  
Sn Whiskers ◽  
Free Solder

The investigation on tin (Sn) whiskers formation has been widely applied in the field of lead-free electronic packaging. This is due to the fact that use of the Sn–Pb finishes has converted to Pb-free finishes in the electronic industry. Sn whiskers can grow long enough to cause a short circuit, which affects electronic devices’ reliability. This study investigates Sn whiskers’ formation in the thin Sn–0.7Cu–0.05Ga Pb-free solder under the influence of electromigration and thermal ageing for surface finish applications. The samples were stored in ambient conditions for 1000 h before being exposed to electromigration and thermal ageing to study the corresponding whiskers’ growth. A scanning electron microscope (SEM) was used to study the Sn whiskers’ microstructure, while an optical microscope (OM) was utilized to investigate the IMC layers in the samples. The results show that the addition of 0.05 wt.% gallium (Ga) decreased the Sn whisker’s length and growth density while simultaneously refining the IMC layers. Synchrotron micro-XRF (µ-XRF) shows the existence and distribution of Ga addition in both electromigration and thermal ageing samples. The shear test was used to determine the solder alloys’ mechanical properties. As a result, the addition of Ga to the Sn–0.7Cu solder improved the fracture morphology of solder joints. In conclusion, Ga’s addition resulted in decreasing Sn whisker formation and refining of the IMCs while also increasing the shear strength of the Sn–0.7Cu solder by ~14%.

A Study on Evaluation Technique for the Fatigue Life Scatter of Lead-Free Solder Joints

2007 ◽  
Author(s):  
Hiroki Miyauchi ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Masaki Shiratori
Keyword(s):  
Fatigue Life ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Electronic Device ◽  
Electronic Devices ◽  
Lead Free ◽  
Sensitivity Analyses ◽  
Lead Free Solder ◽  
Free Solder ◽  
Design Factors

The electronic device equipments using a lot of semiconductors are widespread to all industrial fields. Solder joints are used to mount the electronic chips, such as ceramic resistors and capacitors, on the printed-circuit boards in almost all electronic devices. However, since in many cases the thermal expansion coefficients of electronic parts and PCBs have mismatch, cyclic thermal stress and strain causes solder fatigue. Especially in the power electronic module and car electric module, the evaluation of thermal fatigue life for the chip components is important. It is understood that the fatigue lives of some electronic devices show large scatter in the thermal cycle test, even if their design is the same. The dispersion of main design factors of solder joints is thought as one of these reasons. Moreover, the influence of the dispersion grows when the lead-free solder materials are used in the devices. Therefore, it cannot be bypassed as the main issue for the reliability evaluation in the solder joints. In this study, how the dispersion of design factors influences the fatigue life in lead-free solder joint was investigated by the analytical approach. At first, sensitivity analyses were carried out to study the main effect of the dispersion of each factor on solder joints. And then, the interacting effects between the factors on the reliability were studied by considering the structural asymmetry due to the unbalanced solder joints. FEM analyses were carried out, and the fatigue life in solder joints was calculated from the inelastic strain range. As a result, practical evaluating approach for the fatigue life scatter of solder joints was proposed.

scholarly journals Reliability issues of lead-free solder joints in electronic devices

2019 ◽  
Vol 20 (1) ◽  
pp. 876-901 ◽  
Author(s):  
Nan Jiang ◽  
Liang Zhang ◽  
Zhi-Quan Liu ◽  
Lei Sun ◽  
Wei-Min Long ◽  
...  
Keyword(s):  
Solder Joints ◽  
Electronic Devices ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

scholarly journals Generating Electricity from Natural Evaporation Using PVDF Thin Films Incorporating Nanocomposite Materials

Energies ◽  
2021 ◽  
Vol 14 (3) ◽  
pp. 585
Author(s):  
Ariel Ma ◽  
Jian Yu ◽  
William Uspal
Keyword(s):  
Thin Films ◽  
Graphene Oxide ◽  
Polyvinylidene Fluoride ◽  
Capillary Flow ◽  
Short Circuit ◽  
Current Source ◽  
Nanocomposite Materials ◽  
The Other ◽  
Pvdf Film ◽  
Ambient Conditions

Natural evaporation has recently come under consideration as a viable source of renewable energy. Demonstrations of the validity of the concept have been reported for devices incorporating carbon-based nanocomposite materials. In this study, we investigated the possibility of using polymer thin films to generate electricity from natural evaporation. We considered a polymeric system based on polyvinylidene fluoride (PVDF). Porous PVDF films were created by incorporating a variety of nanocomposite materials into the polymer structure through a simple mixing procedure. Three nanocomposite materials were considered: carbon nanotubes, graphene oxide, and silica. The evaporation-induced electricity generation was confirmed experimentally under various ambient conditions. Among the nanocomposite materials considered, mesoporous silica (SBA-15) was found to outperform the other two materials in terms of open-circuit voltage, and graphene oxide generated the highest short-circuit current. It was found that the nanocomposite material content in the PVDF film plays an important role: on the one hand, if particles are too few in number, the number of channels will be insufficient to support a strong capillary flow; on the other hand, an excessive number of particles will suppress the flow due to excessive water absorption underneath the surface. We show that the device can be modeled as a simple circuit powered by a current source with excellent agreement between the theoretical predictions and experimental data.

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Wettability of CNT-Doped Solder under Isothermal Aging

2016 ◽  
Vol 857 ◽  
pp. 76-78
Author(s):  
Norliza Ismail ◽  
Roslina Ismail ◽  
Nur Izni Abd Aziz ◽  
Azman Jalar
Keyword(s):  
Carbon Nanotubes ◽  
Contact Angle ◽  
Isothermal Aging ◽  
Optical Microscope ◽  
Image Analyzer ◽  
Solder Paste ◽  
Reflow Process ◽  
Weight Percentage ◽  
Test Board ◽  
Free Solder

Wettability for lead free solder 99.0Sn-0.3Ag-0.7Cu (SAC237) with addition of different weight percentage carbon nanotube after thermal treatment was investigated. SAC 237 solder powder with flux was mixed with 0.01%, 0.02%, 0.03% and 0.04% carbon nanotubes (CNTs) to form SAC-CNTs solder paste. Printed solder paste on test board with Cu surface finish was then reflow under 270°C temperature and isothermal aging at 150°C for 0,200 and 400 hours. Wettability of SAC-CNT solder was determined by measuring contact angle using optical microscope and image analyzer. As a result, from reflow process right through 400 hours of thermal aging, SAC237 with 0.04% CNT has the lowest contact angle as compared to other SAC-CNTs and SAC237 solder. As a conclusion, addition of carbon nanotubes into solder SAC237 improved their wettability on Cu substrate, especially at 0.04% of CNTs.

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