scholarly journals Investigation of Mean-Time-to-Failure Measurements from AlGaN/GaN High-Electron-Mobility Transistors Using Eyring Model

Electronics ◽  
2021 ◽  
Vol 10 (24) ◽  
pp. 3052
Author(s):  
Surajit Chakraborty ◽  
Tae-Woo Kim

We present the mean-time-to-failure (MTTF) calculations for AlGaN/GaN high-electron-mobility transistors (HEMTs) using two independent acceleration factors. MTTF predictions are generally calculated through the Arrhenius relationship, based on channel temperature and acceleration, depend only on one parameter. Although the failure modes of the AlGaN/GaN HEMTs depend largely on the applied electric fields, the Eyring model is introduced to investigate both voltage and temperature dependent degradation of AlGaN/GaN devices. In anticipation of adequate MTTF values, studies were conducted on non-commercial devices. Further, we distinguished the cumulative failure percentages through the Weibull and log-normal distributions. We also explored the increase in gate leakage current at high temperatures for early device deterioration.

Author(s):  
Gaudenzio Meneghesso ◽  
Matteo Meneghini ◽  
Augusto Tazzoli ◽  
Nicolo' Ronchi ◽  
Antonio Stocco ◽  
...  

In the present paper we review the most recent degradation modes and mechanisms recently observed in AlGaN/GaN (Aluminum Gallium Nitride/Gallium Nitride). High Electron-Mobility Transistors (HEMTs), as resulting from a detailed accelerated testing campaign, based on reverse bias tests and DC accelerated life tests at various temperatures. Despite the large efforts spent in the last few years, and the progress in mean time to failure values, reliability of GaN HEMTs, and millimeter microwave integrated circuits still represent a relevant issue for the market penetration of these devices. The role of temperature in promoting GaN HEMT failure is controversial, and the accelerating degradation factors are largely unknown. The present paper proposes a methodology for the analysis of failure modes and mechanisms of GaN HEMTs, based on (i) DC and RF stress tests accompanied by an (ii) extensive characterization of traps using deep level transient spectroscopy and pulsed measurements, (iii) detailed analysis of electrical characteristics, and (iv) comparison with two-dimensional device simulations. Results of failure analysis using various microscopy and spectroscopy techniques are presented and failure mechanisms observed at the high electric field values typical of the operation of these devices are reviewed.


ESSDERC ’89 ◽  
1989 ◽  
pp. 813-816
Author(s):  
Claudio Canali ◽  
Giuseppe Castellaneta ◽  
Fabrizio Magistrali ◽  
Marco Sangalli ◽  
Carlo Tedesco ◽  
...  

2021 ◽  
pp. 108050
Author(s):  
Maria Glória Caño de Andrade ◽  
Luis Felipe de Oliveira Bergamim ◽  
Braz Baptista Júnior ◽  
Carlos Roberto Nogueira ◽  
Fábio Alex da Silva ◽  
...  

Author(s):  
Yu-Chen Lai ◽  
Yi-Nan Zhong ◽  
Ming-Yan Tsai ◽  
Yue-Ming Hsin

AbstractThis study investigated the gate capacitance and off-state characteristics of 650-V enhancement-mode p-GaN gate AlGaN/GaN high-electron-mobility transistors after various degrees of gate stress bias. A significant change was observed in the on-state capacitance when the gate stress bias was greater than 6 V. The corresponding threshold voltage exhibited a positive shift at low gate stress and a negative shift when the gate stress was greater than 6 V, which agreed with the shift observation from the I–V measurement. Moreover, the off-state leakage current increased significantly after the gate stress exceeded 6 V during the off-state characterization although the devices could be biased up to 1000 V without breakdown. The increase in the off-state leakage current would lead to higher power loss.


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