scholarly journals Characterization of Soldering Alloy Type Bi-Ag-Ti and the Study of Ultrasonic Soldering of Silicon and Copper

Metals ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 624
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Babincova ◽  
Peter Gogola

The aim of the research work was to characterize the soldering alloy type Bi-Ag-Ti and to study the direct soldering of silicon and copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on the content of silver and titanium. The solder begins to melt at the temperature of 262.5 ∘C and full melting is completed at 405 ∘C. The solder microstructure consists of a bismuth matrix with local eutectics. The silver crystals and titanium phases as BiTi2 and Bi9Ti8 are segregated in the matrix. The average tensile strength of the solder varies around 42 MPa. The bond with silicon is formed due to interaction of active titanium with the silicon surface at the formation of a reaction layer, composed of a new product, TiSi2. In the boundary of the Cu/solder an interaction between the liquid bismuth solder and the copper substrate occurs, supported by the eutectic reaction. The mutual solubility between the liquid bismuth solder is very limited, on both the Bi and the Cu side. The average shear strength in the case of a combined joint of Si/Cu fabricated with Bi11Ag1.5Ti solder is 43 MPa.

Metals ◽  
2020 ◽  
Vol 11 (1) ◽  
pp. 27
Author(s):  
Roman Kolenak ◽  
Igor Kostolny ◽  
Jaromir Drapala ◽  
Paulina Babincova ◽  
Martin Sahul

The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn–Al–Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 °C and the eutectoid transformation at 285 °C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)2 and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.


2019 ◽  
Vol 53 (10) ◽  
pp. 1411-1422 ◽  
Author(s):  
Roman Koleňák ◽  
Igor Kostolný ◽  
Jaromír Drápala ◽  
Marián Drienovský ◽  
Martin Sahul

The study aimed at direct flux-free soldering of metal-ceramics composite (MMC) with a copper substrate. Soldering was performed with type Zn10In1Mg Zn-solder. The soldered joints were fabricated using power ultrasound. The solder used consists of a zinc matrix, while the solid solution (In) and MgZn2 phase were segregated on the grain boundaries. The soldered MMC joint is formed due to dissolution of the aluminium matrix in zinc solder. A new composite, composed of matrix consisting mainly of solid solution (Al) is thus formed. Moreover, there is also a solid solution present (In) and Cu3.2Zn0.7Al4.2 phase. The bond with copper substrate is formed due to interaction of Zn and Al from the solder at formation of two transient phases, namely Cu3.2Zn0.7Al4.2 and an unstable phase of Al(Cu,Zn)2. The average shear strength of combined joints of MMC/Cu is 16.5 MPa.


2009 ◽  
Vol 131 (1) ◽  
Author(s):  
Xiaoqin Lin ◽  
Le Luo

Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was used as SnAg solder bumping process. Multiple reflow was preformed on as-plated solder bumps. Scanning electron microscopy and energy dispersive X-ray analysis were used to investigate the intermetallic compound and microvoids of cross-sectioned solder bump. Shear test was used to evaluate the reliabilities of the SnAg bumps. The 13×13 area-array Sn/3.0Ag solder bumps of 70 μm in height and 90 μm in diameter were fabricated with a smooth and shiny surface and with a uniform distribution of Ag. During multireflow, the scalloped Cu6Sn5 phase grows by a ripening process. Volume shrinkage was the main reason for the formation of microvoids during multireflow. The average shear strength of solder bumps on TiW/Cu under bump metallurgy (UBM) increased with reflow times. The electroplating process is suitable for mass production of well-controlled geometry and uniformity of SnAg solder bumps. Microvoids have trivial negative impacts on the solder bonds. The combination of TiW/Cu UBM and SnAg solder is reliable.


2015 ◽  
Vol 1101 ◽  
pp. 99-103
Author(s):  
Cheng Yen Wang ◽  
Ren Kae Shiue

The purpose of this research is focused on vacuum furnace brazing Incoloy 800 (IN-800) using the copper filler foil. Microstructural evolution and shear strength of brazed joints for various brazing conditions has been evaluated in the experiment. The Cu-rich matrix dominates entire brazed joint. The width of Cu-rich matrix is decreased with increasing the brazing temperature and/or time. Average shear strength of the joint is approximately 215 MPa. Dimple dominated fracture is widely observed for the specimen brazed below 1160oC. However, cleavage dominated fracture is found for the specimen brazed at 1200oC. It is advised that copper brazing IN-800 alloy should be confined below 1160oC.


2021 ◽  
Author(s):  
Ramratan Guru ◽  
Anupam Kumar ◽  
Rohit Kumar

This research work has mainly utilized agricultural waste material to make a good-quality composite sheet product of the profitable, pollution free, economical better for farmer and industries. In this study, from corn leaf fibre to reinforced epoxy composite product has been utilized with minimum 35 to maximum range 55% but according to earlier studies, pulp composite material was used in minimum 10 to maximum 27%. Natural fibre-based composites are under intensive study due to their light weight, eco-friendly nature and unique properties. Due to the continuous supply, easy of handling, safety and biodegradability, natural fibre is considered as better alternative in replacing many structural and non-structural components. Corn leaf fibre pulp can be new source of raw material to the industries and can be potential replacement for the expensive and non-renewable synthetic fibre. Corn leaf fibre as the filler material and epoxy as the matrix material were used by changing reinforcement weight fraction. Composites were prepared using hand lay-up techniques by maintaining constant fibre and matrix volume fraction. The sample of the composites thus fabricated was subjected to tensile, impact test for finding the effect of corn husk in different concentrations.


2021 ◽  
Vol 1035 ◽  
pp. 925-930
Author(s):  
Ya Zhou Li ◽  
Yu Zhao ◽  
Xu Ran

To reduce the agglomeration of graphene and enhance the interface bonding between reduced graphene oxide (RGO) and copper substrate, copper plating on the graphene surface was prepared by the in-situ reduction method. To improve the strength of the copper matrix, the microalloying strategy of adding titanium to the matrix was adopted. By changing the mass fraction of titanium in the matrix, the optimum ratio of RGO was obtained( Ti mass fraction was 5:1), and the tensile strength was maximized. The results show that RGO did not agglomerate obviously in the matrix. At the same time, the composite powder could be densified rapidly by spark plasma sintering (SPS), which could effectively protect the original distribution of the additive phase in the matrix. In this paper, Cu@RGO/Cu-Ti was prepared and the strengthening mechanism of the composites discussed, providing a new insights into the interface design and carbide formation mechanism of advanced graphene/copper composites with high mechanical properties.


Author(s):  
Xiulin Yan ◽  
Ruiqian Zhang ◽  
Yan Liu ◽  
Yunhua Zhang ◽  
Hui Chen

Cr coating on Zr-based fuel tubes is a potential approach for the development of accident tolerant fuels (ATF). To settle the cracking behavior and quantitative evaluation of shear strength of Cr coating under different loading conditions, the average shear strength between Cr coating and zircaloy substrate has been estimated using a modified shear-lag model in this paper. Its key parameters are determined experimentally, and the tensile method has been used to research the cracking behavior of Cr coating under different strain rates. The results show that with the increase of strain rate, the interfacial shear strength increases because of the decrease of cracking spacing, while the shear strength changes erratically with the coating thickness increases. Furthermore, abundant two unequal-crack-spacings and few two equal-crack-spacings are observed which are perpendicular to the loading direction.


Entropy ◽  
2019 ◽  
Vol 21 (3) ◽  
pp. 283 ◽  
Author(s):  
Chieh Lin ◽  
Ren-Kae Shiue ◽  
Shyi-Kaan Wu ◽  
Huai-Li Huang

Infrared vacuum brazing of CoCrFeMnNi high entropy alloy (HEA) using BNi-2 and MBF601 fillers has been investigated. Both brazes show poor wettability at temperatures only 20 °C above their liquidus temperatures. However, the wettability of BNi-2 and MBF601 fillers on CoCrFeMnNi HEA is greatly improved with increasing the test temperatures, 50 °C above their liquidus temperatures. The BNi-2 brazed joints are dominated by Ni-rich matrix with huge CrB and a few tiny boride precipitates. Average shear strengths of joints increase with increasing brazing temperature and/or time, and fracture location changes from blocky CrB in the brazed zone to grain boundary boride in the substrate. The MBF601 brazed joints are composed of CoCrFeMnNi-based matrix, particles of B/Co/Cr/Fe/Mn/Ni/P compounds, and some phosphides form along the grain boundaries of the substrate. The specimen brazed with MBF601 filler foil at 1050 °C for 600 s has the highest average shear strength of 321 MPa, while that brazed at 1080 °C for 600 s has a lower average shear strength of 271 MPa due to the presence of solidification shrinkage voids.


2018 ◽  
Vol 19 ◽  
pp. 12-22 ◽  
Author(s):  
A. D'Alessandro ◽  
A. Meoni ◽  
F. Ubertini

The progress of nanotechnology resulted in the development of new instruments in the civil engineering and its applications. In particular, the use of carbon nanofillers into the matrix of construction materials can provide enhanced properties to the material in both of mechanical and electrical performance. In constructions, concrete is among the most used material. Due to the peculiarities of its components and its structure, it is suitable to modifications, at the nanometer level too. Moreover, to guarantee structural safety it is desirable to achieve a diffuse monitoring of structures in order to identify incipient situations of damages and possible risk for people. The ideal solution would be to realize structures able to identify easily and quickly their behavior modifications. This paper presents a research work about the characterization of the self-sensing abilities of novel cementitious composites with conductive carbon nanoinclusions and their application into a structural reinforced concrete beam. The self-sensing evidence is achieved through the correlation between the variation of strains and the variation of electrical resistance or resistivity. Nanomodified cement pastes with different carbon nanofillers has been tested. The experimental campaign shows the potentialities of this new types of sensors made of nanomodified concrete for diffuse Structural Health Monitoring.


Photonics ◽  
2019 ◽  
Vol 6 (4) ◽  
pp. 127
Author(s):  
Yury Korobov ◽  
Yulia Khudorozhkova ◽  
Holger Hillig ◽  
Alexander Vopneruk ◽  
Aleksandr Kotelnikov ◽  
...  

Ni/60WC coatings on copper substrate were placed via laser deposition (LD). A structural study was conducted using electron microscopy and a microhardness evaluation. Two body abrasive wear tests were conducted with a pin-on-plate reciprocating technique. A tool steel X12MF GOST 5960 (C-Cr-Mo-V 1.6-12-0.5-0.2) with a hardness of 63 HRC was used as a counterpart. The following results were obtained: Precipitation of the secondary carbides takes place in the thicker layers. Their hardness is lower than that of the primary carbides in the deposition (2425 HV vs. 2757 HV) because they mix with the matrix material. In the thin layers, precipitation is restricted due to a higher cooling rate. For both LD coatings, the carbide’s hardness increases compared to the initial mono-tungsten carbide (WC)-containing powder (2756 HV vs. 2200 HV). Such a high level of microhardness reflects the combined influence of a low level of thermal destruction of carbides during laser deposition and the formation of a boride-strengthening phase from the matrix powder. The thicker layer showed a higher wear resistance; weight loss was 20% lower. The changes in the thickness of the laser deposited Ni-WC coating altered its structure and wear resistance.


Sign in / Sign up

Export Citation Format

Share Document