scholarly journals Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 265
Author(s):  
Yuxin You ◽  
Beibei Zhang ◽  
Sulian Tao ◽  
Zihui Liang ◽  
Biao Tang ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Thermal Radiation ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Thermal Emissivity ◽  
Effect Of Surface

Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction.

An Elaborate Review for Micro-Fin Heat Sink

2020 ◽  
Vol 38 (1A) ◽  
pp. 105-112
Author(s):  
Ibtisam A. Hasan ◽  
Sahar R. Fafraj ◽  
Israa A. Mohmmad
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Low Cost ◽  
High Heat ◽  
Heat Sinks ◽  
Nano Particles ◽  
High Heat Flux ◽  
Pin Fins

Heat sinks are low cost, the process of manufacturing reliability, and design simplicity which leads to taking into consideration various cutting-edge applications for heat transfer. Like stationary, fuel cells, automotive electronic devices also PV panels cooling and other various applications to improve the heat sinks thermal performance. The aim is to focus on some countless fundamental issues in domains such as; mechanics of fluids and heat transfer, sophisticated prediction for temperature distribution, high heat flux removal, and thermal resistance reduction. The outcome of this survey concluded that the best configuration of heat sinks has a thermal resistance about (0.140 K/W to 0.250 K/W) along with a drop of pressure less than (90.0 KPa) with a temperature gradient about 2 °C/mm. Heat sinks with square pin fins lead to enhance the effectiveness of heat dissipation than heat sinks with microcolumn pin fins. While other researches recommend the use of high conductive coating contains nano-particles. The present survey focuses on the researches about future heat sink with micro fin and the development to resolve the fundamental issues. The main benefits and boundaries of micro fins heat sink briefed.

Optimization of the Heat Sink for the Power Component by Taguchi Method

2012 ◽  
Vol 538-541 ◽  
pp. 1983-1986
Author(s):  
Nan Li ◽  
Gui Cui Fu ◽  
Chun Pei ◽  
Dong Zhang
Keyword(s):  
Taguchi Method ◽  
Heat Sink ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Machining Errors ◽  
Taguchi Doe ◽  
Controllable Factors ◽  
Volume Method ◽  
Base Width

With the development of manufacture technology, it is a critical problem for the reliability of avionic devices that components have to operate at high heat flux. And the package of components cannot meet the requirements of the heat dissipation. Therefore, it is essential to add heat sink on the top of power components. This paper presents the use of Taguchi method in optimizing the heat sink. The heat sink is designed to balance the weight and the temperate distribution of the component. At first, several parameters of the heat sink, including the base width, the base length, the fin height, the fin number, are chosen to be controllable factors. The machining errors are the uncontrollable factors. Then, four orthogonal arrays are used to lead the design of experiments (DOE). Finite-volume method (FVM) is used to calculate the case temperature of the component. Basing on the results generated by the Taguchi DOE method, the optimal design of heat sink can be chosen. Additionally, the heat sink can be optimized, while the reliability of component and device can be improved by using this method.

scholarly journals Numerical Simulation of a Thermosyphon Radiator Used in Electronic Devices

2021 ◽  
Vol 1 (1) ◽  
Author(s):  
Liang Ding ◽  
Wei Wang ◽  
Bingrui Li ◽  
Yong Shuai ◽  
Bingxi Li
Keyword(s):  
Heat Flux ◽  
Numerical Model ◽  
Thermal Resistance ◽  
Wall Temperature ◽  
Thermal Load ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux ◽  
Load Conditions

The heat dissipation of electronic devices is an important issue. The thermosyphon radiators have high heat dissipation performance, so they are gradually widely used in electronic devices. In this study, a numerical model of the thermosyphon is established. It is observed that simulated temperatures agree well with experimental data in the literature with a relative error no more than 4%. After the numerical model is validated, it is used in the simulation of the thermosyphon radiator. The wall temperature of the condensing section under different thermal load conditions is compared, and the thermal resistance of the condensing section is analyzed. The results show that with the increase of heating and condensing heat flux, the wall temperature fluctuation of the condensing section increases, but very small just about 5K, 6K, 7K, and 9K, respectively. The thermal resistance of the condensing section decreases, indicating that the thermosyphon radiator has a better performance under high heat flux conditions.

scholarly journals Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling

Energies ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 6347
Author(s):  
Taha Baig ◽  
Zabdur Rehman ◽  
Hussain Ahmed Tariq ◽  
Shehryar Manzoor ◽  
Majid Ali ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Heat Removal ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Base Temperature ◽  
High Processing

Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20 %, 8.74 %, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work.

Vapor Chambers in Blade Server CPU Cooling Solutions

2007 ◽  
Author(s):  
Matt Connors
Keyword(s):  
Heat Sink ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Air Cooling ◽  
Vapor Chamber ◽  
Two Phase ◽  
Blade System ◽  
Overall Resistance ◽  
Aluminum Base

Current blade processors need air cooling solutions that dissipate 100–300 watts with heat sinks that are less than 30 mm high. In order to cool these processors, the heat sink base has to grow in length and width to compensate for the lack of available height. As these dimensions grow, decreasing the base spreading of the heat sink becomes an important factor is decreasing the overall resistance of the heat sink. A vapor chamber used as a substitute to common copper or aluminum as the base of the heat sink can increase performance by 20–25%. A vapor chamber is a two phase heat transport system that significantly reduces the spreading resistance in applications where there is a high heat flux processor coupled with a large heat sink. In this paper, a CFD model will be constructed to predict the performance gains realized by using a vapor chamber base in lieu of a copper or aluminum base. These predictions will then be experimentally tested to confirm the modeling parameters and the actual measured thermal performance of the heat sink. By utilizing vapor chambers in heat sink design, thermal engineers will gain valuable heat sink performance within the constraints imposed by the blade system architecture.

scholarly journals A Brief Review of Heat Sink, Heat Pipe, and Vapor Chamber as a Key Function of Thermal Solution for Electronic Devices

2020 ◽  
Vol 5 (11) ◽  
pp. 1297-1300
Author(s):  
Mohamed Elnaggar ◽  
Mohammed Abu Hatab ◽  
Ezzaldeen Edwan
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
Electronic Devices ◽  
High Heat ◽  
Design Guidelines ◽  
Thermal Design ◽  
High Heat Flux ◽  
Efficient Design ◽  
Vapor Chamber ◽  
Working Process

Electronics industry requires efficient design that can handle fast mathematical operations to compensate for the growing development and demand for processing power. These days, there are numerous equipment or parts inside machines called heating elements particularly with electrical or electronic devices and they should be cooled during the working process. However, with respect to their size, manufacturers are minifying day by day to satisfy requirements of users but the power should be maintained. Hence, elements withstand a high amount of heat and high heat flux (transition/mutability) is being generated during the working process. The main contribution of this study is to investigate thermal solutions using four cooling tools and to compare to each other and consider thermal design guidelines and factors as well. Furthermore, we review the appropriate thermal solutions for the produced heat from the electronic equipment and we present the effective and suitable tools which used to dissipate this heat. A heat sink, heat pipe, and vapor chamber are reviewed and compared depending on the previous studies that have implemented them.

scholarly journals Visualization Study of Startup Modes and Operating States of a Flat Two-Phase Micro Thermosyphon

Energies ◽  
2018 ◽  
Vol 11 (9) ◽  
pp. 2291 ◽  
Author(s):  
Liangyu Wu ◽  
Yingying Chen ◽  
Suchen Wu ◽  
Mengchen Zhang ◽  
Weibo Yang ◽  
...  
Keyword(s):  
Wall Temperature ◽  
Large Amplitude ◽  
Small Amplitude ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Interface Evolution ◽  
Visualization Experiment

The flat two-phase thermosyphon has been recognized as a promising technique to realize uniform heat dissipation for high-heat-flux electronic devices. In this paper, a visualization experiment is designed and conducted to study the startup modes and operating states in a flat two-phase thermosyphon. The dynamic wall temperatures and gas–liquid interface evolution are observed and analyzed. From the results, the sudden startup and gradual startup modes and three quasi-steady operating states are identified. As the heat load increases, the continuous large-amplitude pulsation, alternate pulsation, and continuous small-amplitude pulsation states are experienced in sequence for the evaporator wall temperature. The alternate pulsation state can be divided into two types of alternate pulsation: lengthy single-large-amplitude-pulsation alternated with short multiple-small-amplitude-pulsation, and short single-large-amplitude-pulsation alternated with lengthy multiple-small-amplitude alternate pulsation state. During the continuous large-amplitude pulsation state, the bubbles were generated intermittently and the wall temperature fluctuated cyclically with a continuous large amplitude. In the alternate pulsation state, the duration of boiling became longer compared to the continuous large-amplitude pulsation state, and the wall temperature of the evaporator section exhibited small fluctuations. In addition, there was no large-amplitude wall temperature pulsation in the continuous small-amplitude pulsation state, and the boiling occurred continuously. The thermal performance of the alternate pulsation state in a flat two-phase thermosyphon is inferior to the continuous small-amplitude pulsation state but superior to the continuous large-amplitude pulsation state.

Effective Parameters on Increasing Efficiency of Microscale Heat Sinks and Application of Liquid Cooling in Real Life

2021 ◽  
Author(s):  
Yousef Alihosseini ◽  
Amir Rezazad Bari ◽  
Mehdi Mohammadi
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Academic Research ◽  
Real Life ◽  
Critical Issue ◽  
Heat Sinks ◽  
Effective Parameters ◽  
Liquid Cooling ◽  
Flow Parameters

Over the past two decades, electronic technology and miniaturization of electronic devices continue to grow exponentially, and heat dissipation becomes a critical issue for electronic devices due to larger heat generation. So, the need to cool down electronic components has led to the development of multiple cooling methods and microscale heat sinks. This chapter reviewed recent advances in developing an efficient heat sink, including (1) geometry parameters, (2) flow parameters that affect the hydraulic–thermal performance of the heat sink. Also, the main goal of this chapter is to address the current gap between academic research and industry. Furthermore, commercialized electronic cooling devices for various applications are highlighted, and their operating functions are discussed, which has not been presented before.

Proposal of a Micro/Mini Cooling Device Using Fins-Installed Porous Media for High Heat Flux Removal Exceeding 1000W/cm2

2009 ◽  
Author(s):  
Kazuhisa Yuki ◽  
Akira Matsui ◽  
Hidetoshi Hashizume ◽  
Koichi Suzuki
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Transfer Performance ◽  
Cooling Device ◽  
Fin Thickness

Heat transfer characteristics of micro-sized bronze particle-sintered porous heat sinks and copper minichannel-fins heat sinks are experimentally investigated in order to clarify the feasibility of a newly proposed micro/mini cooling device using fins-installed porous media. Regarding the porous heat sinks, fin effect toward more inside of the porous medium is promoted by sintering the porous heat sink on the heat transfer surface, which results in increasing the heat transfer performance up to 0.8MW/m2K at heat flux of 8.2MW/m2 though there still remains a large pressure loss issue. In addition, the results clarify that the heat exchanging area exists only in the vicinity of the heat transfer surface. As to the minichannel-fins heat sinks, the influence of the channel width and the fin thickness are evaluated in detail. As a result, the minichannel-fins heat sink having the narrower channel width (i.e. scale effect) and lower porosity (i.e. thicker fin thickness with larger heat capacity) achieves higher heat transfer performance up to 0.10MW/m2K at 8.3MW/m2. However, rapid increase of pressure loss, which is occasionally observed in a microchannel due to vapor bubbles choking the narrow channel, still remains as an issue under flow boiling conditions in the minichannel. Finally, heat transfer performance of the fin-installed porous heat sink is numerically predicted by the control volume method. The simulation confirms that the heat transfer coefficient at each wall superheat of 0 and 30 degrees has performance 2.5 times and 2.0 times higher than that of the normal fins, which indicates that this heat sink coupling the micro and mini channels has high potential as efficient cooling method under high heat flux conditions exceeding 10MW/m2.

Fast Transient and Intensified Heat Dissipation Applicable to High Heat Flux Density

2011 ◽  
Author(s):  
Jing Li ◽  
Shuanshi Fan ◽  
Zemin Yao ◽  
Jing Li ◽  
Xinli Wei
Keyword(s):  
Heat Flux ◽  
Flux Density ◽  
Heat Flux Density ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Spray Cooling ◽  
High Heat ◽  
High Heat Flux ◽  
Power Electronic ◽  
Fast Transient

In this paper, in order to solve the problem of intensified heat dissipation in high power electronic devices, a fast transient and intensified heat dissipation technology was put forward by comparing many heat transfer modes based on the analytical study on the existing technologies about heat dissipation at high heat flux density and about fast heat transport. This technology combined spray cooling technology with fast endothermic chemical reaction processes; we summarized the characteristics of media applicable to an environment with transient high heat flux density by comparing various parameters of many sprayed media in the spray cooling process. According to the energy balance of endothermic chemical reactions of relevant media, we determined the media (mainly carbon dioxide hydrate) applicable to the fast transient and intensified heat dissipation technology and presented the conditions for the chemical reactions. We analyzed the methods controlling the instantaneous chemical reaction rate and proposed the structural characteristics of the chemical reactor so as to ensure that the time for heat removal will be control to around 0.01 second. Thus, the problem of fast transient heat dissipation in high power electronic devices, etc. would be radically solved.

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