scholarly journals Optimization of a Wavy Microchannel Heat Sink with Grooves

Processes ◽  
2021 ◽  
Vol 9 (2) ◽  
pp. 373
Author(s):  
Min-Cheol Park ◽  
Sang-Bum Ma ◽  
Kwang-Yong Kim
Keyword(s):  
Thermal Resistance ◽  
Friction Factor ◽  
Heat Sink ◽  
Latin Hypercube Sampling ◽  
Groove Depth ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Factorial Method ◽  
Design Variables ◽  
Full Factorial

In this study, a wavy microchannel heat sink with grooves using water as the working fluid is proposed for application to cooling microprocessors. The geometry of the heat sink was optimized to improve heat transfer and pressure loss simultaneously. To achieve optimization goals, the average friction factor and thermal resistance were used as the objective functions. Three dimensionless parameters were selected as design variables: the distance between staggered grooves, groove width, and groove depth. A modified Latin hypercube sampling (LHS) method that combines the advantages of conventional LHS and a three-level full factorial method is also proposed. Response surface approximation was used to construct surrogate models, and Pareto-optimal solutions were obtained with a multi-objective genetic algorithm. The modified LHS was proven to have better performance than the conventional LHS and full factorial methods in the present optimization problem. A representative optimal design showed that both the thermal resistance and friction factor improved by 1.55% and 3.00%, compared to a reference design, respectively.

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

2009 ◽  
Vol 131 (2) ◽  
Author(s):  
Afzal Husain ◽  
Kwang-Yong Kim
Keyword(s):  
Shape Optimization ◽  
Thermal Resistance ◽  
Objective Function ◽  
Response Surface ◽  
Heat Sink ◽  
Fractional Factorial ◽  
Surface Model ◽  
Microchannel Heat Sink ◽  
Reference Shape ◽  
Design Variables

A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.

scholarly journals Thermal–Hydraulic Performance in a Microchannel Heat Sink Equipped with Longitudinal Vortex Generators (LVGs) and Nanofluid

Processes ◽  
2020 ◽  
Vol 8 (2) ◽  
pp. 231
Author(s):  
Basel AL Muallim ◽  
Mazlan A. Wahid ◽  
Hussein A. Mohammed ◽  
Mohammed Kamil ◽  
Daryoush Habibi
Keyword(s):  
Nusselt Number ◽  
Friction Factor ◽  
Heat Sink ◽  
Pure Water ◽  
Hydraulic Performance ◽  
Vortex Generators ◽  
Longitudinal Vortex ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Fanning Friction Factor

In this study, the numerical conjugate heat transfer and hydraulic performance of nanofluids flow in a rectangular microchannel heat sink (RMCHS) with longitudinal vortex generators (LVGs) was investigated at different Reynolds numbers (200–1200). Three-dimensional simulations are performed on a microchannel heated by a constant temperature with five different configurations with different angles of attack for the LVGs under laminar flow conditions. The study uses five different nanofluid combinations of Al2O3 or CuO, containing low volume fractions in the range of 0.5% to 3.0% with various nanoparticle sizes that are dispersed in pure water, PAO (Polyalphaolefin) or ethylene glycol. The results show that for Reynolds number ranging from 100 to 1100, Al2O3–water has the best performance compared with CuO nanofluid with Nusselt number values between 7.67 and 14.7, with an associated increase in Fanning friction factor by values of 0.0219–0.095. For the case of different base fluids, the results show that CuO–PAO has the best performance with Nusselt number values between 9.57 and 15.88, with an associated increase in Fanning friction factor by 0.022–0.096. The overall performance of all configurations of microchannels equipped with LVGs and nanofluid showed higher values than the ones without LVG and water as a working fluid.

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

2015 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Navid Saneie ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Specific Heat ◽  
Thermal Management ◽  
Heat Sink ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Pumping Power

We numerically investigated a novel galinstan-based microfluidic heat-sink. Galinstan is an eutectic alloys of gallium, indium, and tin. The thermal conductivity of galinstan is ∼27 times that of water, while the dynamic viscosity is only twice of water. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the specific heat of galinstan is significantly lower than that of water, which will inevitably undermine the cooling capability by increasing fluid outlet temperature (i.e., increase of caloric thermal management) and/or flow rate. As an alternative, therefore, galinstan/water heterogeneous mixture was proposed as a working fluid and the cooling performance was numerically explored with varying volume composition of galinstan. Effective medium theory for heterogeneous medium was used to evaluate the thermal conductivity of the mixture. The viscosity change with respect to the volume composition was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Classical models were used for the mixture density and specific heat calculations. Heat transfer and pressure drop characteristics of laminar flow through a silicon microchannel heat-sink was simulated using Fluent. The length and width of the channel array are 10 mm and 9.5 mm, respectively. The cross-sectional area of each channel is 300 μm × 300 μm and the spacing between channels is 100 μm. The heat dissipation was 50 W and the pumping power was fixed at 5 mW for the comparison between the varying galinstan/water compositions. The results showed that more than 30% of the thermal resistance enhancement was attainable using the novel working fluid. Due to the compromise between the convective thermal resistance (effect of thermal conductivity) and the caloric thermal resistance (effect of viscosity and specific heat), the lowest junction temperature was marked at the galinstan composition of ∼35% by volume.

Two-Phase Flow in Microchannels

2001 ◽  
Author(s):  
G. Hetsroni ◽  
A. Mosyak ◽  
Z. Segal
Keyword(s):  
Heat Sink ◽  
High Speed ◽  
Single Phase ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Two Phase ◽  
Infrared Radiometry ◽  
Phase Water

Abstract Experimental investigation of a heat sink for electronics cooling is performed. The objective is to keep the operating temperature at a relatively low level of about 323–333K, while reducing the undesired temperature variation in both the streamwise and transverse directions. The experimental study is based on systematic temperature, flow and pressure measurements, infrared radiometry and high-speed digital video imaging. The heat sink has parallel triangular microchannels with a base of 250μm. According to the objectives of the present study, Vertrel XF is chosen as the working fluid. Experiments on flow boiling of Vertrel XF in the microchannel heat sink are performed to study the effect of mass velocity and vapor quality on the heat transfer, as well as to compare the two-phase results to a single-phase water flow.

THERMAL AND HYDRODYNAMIC PERFORMANCE OF A MICROCHANNEL HEAT SINK COOLED WITH CARBON NANOTUBES NANOFLUID

2016 ◽  
Vol 78 (10-2) ◽  
Author(s):  
Nik Ahmad Faiz Nik Mazlam ◽  
Normah Mohd-Ghazali ◽  
Thierry Mare ◽  
Patrice Estelle ◽  
Salma Halelfadl
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Operating Temperature ◽  
Heat Removal ◽  
Hydrodynamic Performance ◽  
Spherical Particles ◽  
Microchannel Heat Sink ◽  
Pumping Power ◽  
Rectangular Microchannel ◽  
Aspect Ratios

The microchannel heat sink (MCHS) has been established as an effective heat removal system in electronic chip packaging. With increasing power demand, research has advanced beyond the conventional coolants of air and water towards nanofluids with their enhanced heat transfer capabilities. This research had been carried out on the optimization of the thermal and hydrodynamic performance of a rectangular microchannel heat sink (MCHS) cooled with carbon nanotube (CNT) nanofluid, a coolant that has recently been discovered with improved thermal conductivity. Unlike the common nanofluids with spherical particles, nanotubes generally come in cylindrical structure characterized with different aspect ratios. A volume concentration of 0.1% of the CNT nanofluid is used here; the nanotubes have an average diameter and length of 9.2 nm and 1.5 mm respectively. The nanofluid has a density of 1800 kg/m3 with carbon purity 90% by weight having lignin as the surfactant. The approach used for the optimization process is based on the thermal resistance model and it is analyzed by using the non-dominated sorting multi-objective genetic algorithm. Optimized outcomes include the channel aspect ratio and the channel wall ratio at the optimal values of thermal resistance and pumping power. The optimized results show that, at high operating temperature of 40°C the use of CNT nanofluid reduces the total thermal resistance by 3% compared to at 20°C and consequently improve the thermal performance of the fluid. In terms of the hydrodynamic performance, the pumping power is also being reduced significantly by 35% at 40°C compared to the lower operating temperature.  

Flow Boiling Heat Transfer in a Silicon Microchannel Heat Sink Using Liquid Crystal Thermography

2008 ◽  
Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Microchannel Heat Sink

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.

scholarly journals Integration of a Pulsating Heat Pipe in a Flat Plate Heat Sink

2014 ◽  
Author(s):  
Mitchell P. Hoesing ◽  
Gregory J. Michna
Keyword(s):  
Thermal Resistance ◽  
Flat Plate ◽  
Heat Pipe ◽  
Heat Sink ◽  
New Technologies ◽  
Operating Conditions ◽  
Working Fluid ◽  
High Heat Flux ◽  
Pulsating Heat Pipe ◽  
Plate Heat

The ongoing development of faster and smaller electronic components has led to a need for new technologies to effectively dissipate waste thermal energy. The pulsating heat pipe (PHP) shows potential to meet this need, due to its high heat flux capacity, simplicity, and low cost. A 20-turn flat plate PHP was integrated into an aluminum flat plate heat sink with a simulated electronic load. The PHP heat sink used water as the working fluid and had 20 parallel channels with dimensions 2 mm × 2 mm × 119 mm. Experiments were run under various operating conditions, and thermal resistance of the PHP was calculated. The performance enhancement provided by the PHP was assessed by comparing the thermal resistance of the heat sink with no working fluid to that of it charged with water. Uncharged, the PHP was found to have a resistance of 1.97 K/W. Charged to a fill ratio of approximately 75% and oriented vertically, the PHP achieved a resistance of .49 K/W and .53 K/W when the condenser temperature was set to 20°C and 30°C, respectively. When the PHP was tilted to 45° above horizontal the PHP had a resistance of .76 K/W and .59 K/W when the condenser was set 20°C and 30°C, respectively. The PHP greatly improves the heat transfer properties of the heat sink compared to the aluminum plate alone. Additional considerations regarding flat plate PHP design are also presented.

Shape Optimization of Microchannels Using Surrogate Modelling

2018 ◽  
Author(s):  
Muhammad Ansab Ali ◽  
Tariq S. Khan ◽  
Saqib Salam ◽  
Ebrahim Al Hajri
Keyword(s):  
Shape Optimization ◽  
Heat Sink ◽  
Pareto Front ◽  
Sampling Method ◽  
Design Space ◽  
Latin Hypercube Sampling ◽  
Optimum Shape ◽  
Microchannel Heat Sink ◽  
Objective Functions ◽  
Computational Resources

To minimize the computational and optimization time, a numerical simulation of 3D microchannel heat sink was performed using surrogate model to achieve the optimum shape. Latin hypercube sampling method was used to explore the design space and to construct the model. The accuracy of the model was evaluated using statistical methods like coefficient of multiple determinations and root mean square error. Thermal resistance and pressure drop being conflicting objective functions were selected to optimize the geometric parameters of the microchannel. Multi objective shape optimization of design was conducted using genetic algorithm and the optimum design solutions are presented in the Pareto front. The application of the surrogate methods has predicted the performance of the heat sink with the sufficient accuracy employing significantly lower computational resources.

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