Specification for starter motor electrical connections for passenger cars

2015 ◽  
Keyword(s):  
Passenger Cars ◽  
Starter Motor ◽  
Electrical Connections

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Tire Vibration Modes and Effects on Vehicle Ride Quality

1993 ◽  
Vol 21 (1) ◽  
pp. 23-39 ◽  
Author(s):  
R. W. Scavuzzo ◽  
T. R. Richards ◽  
L. T. Charek
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Operating Conditions ◽  
Modal Testing ◽  
Ride Quality ◽  
Vibration Modes ◽  
Inflation Pressure ◽  
Passenger Cars ◽  
Element Modeling ◽  
Road Surfaces

Abstract Tire vibration modes are known to play a key role in vehicle ride, for applications ranging from passenger cars to earthmover equipment. Inputs to the tire such as discrete impacts (harshness), rough road surfaces, tire nonuniformities, and tread patterns can potentially excite tire vibration modes. Many parameters affect the frequency of tire vibration modes: tire size, tire construction, inflation pressure, and operating conditions such as speed, load, and temperature. This paper discusses the influence of these parameters on tire vibration modes and describes how these tire modes influence vehicle ride quality. Results from both finite element modeling and modal testing are discussed.

PROJECT ON ELECTRONIC STEERING SYSYTEM

2018 ◽  
Vol 4 (5) ◽  
pp. 7
Author(s):  
Shivam Dwivedi ◽  
Prof. Vikas Gupta
Keyword(s):  
Steering System ◽  
Essential Elements ◽  
Variable Pressure ◽  
Passenger Cars ◽  
Control Techniques ◽  
Steering Mechanism ◽  
Dynamics And Control ◽  
Active Research ◽  
Electronic Steering ◽  
And Control

As the four-wheel steering (4WS) system has great potentials, many researchers' attention was attracted to this technique and active research was made. As a result, passenger cars equipped with 4WS systems were put on the market a few years ago. This report tries to identify the essential elements of the 4WS technology in terms of vehicle dynamics and control techniques. Based on the findings of this investigation, the report gives a mechanism of electronically controlling the steering system depending on the variable pressure applied on it. This enhances the controlling and smoothens the operation of steering mechanism.

Demand for Passenger Cars

1950 ◽  
Vol 6 (2) ◽  
pp. 69-71
Author(s):  
Stephen M. DuBrule
Keyword(s):  
Passenger Cars

On-Road Exhaust Emissions from Passenger Cars Fitted with a Start-Stop System

2011 ◽  
Vol 23 (1) ◽  
Author(s):  
Jerzy Merkisz ◽  
Ireneusz Pielecha ◽  
Jacek Pielecha ◽  
Kamil Brudnicki
Keyword(s):  
Exhaust Emissions ◽  
Passenger Cars

UNS A02960

Alloy Digest ◽  
1987 ◽  
Vol 36 (12) ◽  
Keyword(s):  
Heat Treatment ◽  
Tensile Properties ◽  
Heat Treating ◽  
Age Hardening ◽  
Casting Alloy ◽  
Passenger Cars ◽  
Temperature Performance ◽  
Mold Casting ◽  
Railway Passenger ◽  
Hardening Heat Treatment

Abstract UNS No. A02060 is an aluminum-mold casting alloy that responds to an age-hardening heat treatment. It is recommended for applications that require a combination of high tensile properties and good machinability. Among its many uses are fuel pump bodies, aircraft fittings and seat frames for railway passenger cars. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and compressive and shear strength as well as fatigue. It also includes information on high temperature performance as well as casting, heat treating, machining, and joining. Filing Code: Al-285. Producer or source: Various aluminum companies.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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