scholarly journals Central Processing Unit Binary Cooling System using Tetrafluoroethane as Refrigerant

2019 ◽  
Vol 9 (2) ◽  
pp. 1607-1612
Keyword(s):  
Performance Index ◽  
Heat Dissipation ◽  
Cooling System ◽  
Electronic Devices ◽  
Processing Unit ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Desktop Computer ◽  
Central Processing ◽  
Vapor Compression Refrigeration

Electronic devices and instruments generate heat that can cause serious damage and low efficiency towards its components. The heat that the different electronic elements and components emit can decrease both efficiency and life capacity of the device. And with the increase of use of electronic devices in industries and processes, heat dissipation in electronic devices should be taken into strict consideration. This study aims to develop a cooling system under vapor compression refrigeration system. The prototype fabricated was designed for the cooling system of two Central Processing Units of desktop computer which can be as good equivalent for the electronic devices in industries. Though ventilation was present in the processing units, certain condition such as condition in surroundings can be of great help to improve the device efficiency. This study also aims to analyze the CPU’s efficiency in relation to lowering ventilation temperatures. The vapor compression refrigeration system will be the main device used for lowering and maintaining a suitable temperature inside the CPU casing. The system works like a centralized air-conditioning system wherein the air from the surroundings will be cooled down by the evaporator in the vapor compression refrigeration system. The cooled air will then be delivered to the CPU through the installed air ducting connections. The recording of CPU’s efficiency is provided by the installed software. It also measures the air conditioned parameters and computation of the CPU power consumption. The results from the test and the analysis of the gathered data showed that 165 watts of heat dissipated was removed by the cooling system and the CPU performance index rose up from 424 to 446 with a discharge air temperature of 29.67 oC. Based from the result, the fabricated binary cooling system is efficient enough to increase the performance index of the CPU and absorbing heat dissipated by the device

Performance of Thermoelectrics and Heat Pipes Refrigerator

2013 ◽  
Vol 388 ◽  
pp. 52-57 ◽  
Author(s):  
Ali A. Sungkar ◽  
Firman Ikhsan ◽  
M. Afin Faisol ◽  
Nandy Putra
Keyword(s):  
Ambient Temperature ◽  
Cooling System ◽  
Heat Pipes ◽  
Input Power ◽  
Cooling Load ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Cabin Temperature ◽  
Effective Performance ◽  
Vapor Compression Refrigeration

Most of refrigerators commonly use the conventional refrigeration system known as Vapor Compression Refrigeration System becoming a big issue lately due to ozone depleting substance it uses as the refrigerant. This paper will shows step by step of an experiment with the objective of constructing a refrigeration system based on thermoelectric which is reliable and compete able with the Vapor Compression Refrigeration System. The designing of this refrigeration system shows attention to the environment that is combined with the knowledge so the environmental friendly technology can be applied. The performance of thermoelectric refrigerator was conducted under variation of input power (40W, 72W, and 120W) and operated in ambient temperature and cooling load of water 1000mL to investigate the characteristic of system, the performance, and also the COP. The COP is decrease by increasing of cooling load, QL. The best actual COP is 0.182 reached when the refrigerator operated at input power 40W. The result, it shows that decreasing of ambient temperature affects the decreasing of cabin temperature. Thermoelectric and heat pipe refrigerator cooling system can reach cabin temperature with power 120Watt (8.73A, 14V) produces temperature of compartment is 10.63°C indicates effective performance work-based thermoelectric applications.

scholarly journals A Review of Literature on Various Techniques of COP Improvement in Vapor Compression Refrigeration System

2021 ◽  
Vol 9 (11) ◽  
pp. 1753-1759
Author(s):  
Anupam Mishra
Keyword(s):  
Power Consumption ◽  
Heat Dissipation ◽  
Water Mist ◽  
Nano Particles ◽  
Coefficient Of Performance ◽  
Small Scale ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Nano Fluid ◽  
Vapor Compression Refrigeration

Abstract: This review paper is a study on various methods of performance improvement in domestic refrigeration systems, based on the vapor compression refrigeration VCRS cycle. Here air-cooled, water-cooled, fog cooled, evaporatively cooled condensers and nano-fluid lubricant /coolant methods their working and efficiency are reviewed, compared, analyzed and presented. The paper inspects the work done by different researchers for the maximization of heat loss from condenser & compressor and bringing about necessary modifications to reduce the overall power consumption of domestic refrigerators by improving Coefficient of Performance (COP). Numerous works have been done on improving the heat dissipation capacity of condenser but using nano-fluid in lubricant base as refrigerant and in the compressor shell as coolant is a new technology. Nano-fluid increase heat transfer due the high conductivity nano particles. It has been observed that water cooled condensers and compressors with nano-lubricants/coolants give the best performance improvements but they suit better for big or large refrigeration systems like centralized air conditioning systems or cold storage warehousing, whereas air cooled and evaporative condensers are optimal for small scale or low power appliances like domestic refrigerators, water coolers or split air conditioners to reduce overall power consumption by increasing the COP. Keywords: Refrigeration system, COP improvement, Condenser, Water mist, Evaporative cooling, Nano-fluid coolant, VCRS cycle.

Development of a Miniature Vapor-Compression Refrigeration System for Computer CPU Cooling

2013 ◽  
Vol 321-324 ◽  
pp. 383-386
Author(s):  
Yu Fei Yang ◽  
Wei Xing Yuan ◽  
Yi Bin Liao
Keyword(s):  
Core Temperature ◽  
Heat Dissipation ◽  
High Heat ◽  
High Heat Flux ◽  
Cold Plate ◽  
Vapor Compression ◽  
Refrigeration System ◽  
The Core ◽  
Vapor Compression Refrigeration ◽  
R 134A

A miniature vapor-compression refrigeration system for cooling high power CPUs has been developed and tested. The refrigeration system is so small that it can be embedded into the computer case. The refrigerant used in the system is R-134a. The system consists of a miniature rotary DC compressor, a micro-channel condenser, a specially designed cold plate, a short tube restrictor, and related controlling electronics. The compressor is powered directly by the 12V DC power supply of the computer. The cold plate contacts the CPU surface directly and carries away the heat dissipation by conductivity. In a series of tests to cool an Intel Core i7-990X CPU that has 12 cores inside with the refrigeration system, the CPU core temperature can be kept at 23°C in default frequency 3.5GHz and 100% of workload. When the CPU is overclocked to 4.8GHz, the core temperature can be maintained at 59°C. Even when overclocked to 5.0GHz, the core temperature does not exceed 78°C. The test results validate the ability and potential of using vapor-compression refrigeration technology in high heat flux CPU cooling.

scholarly journals New HFC/HFO Blends as Refrigerants for the Vapor-Compression Refrigeration System (VCRS)

Energies ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 946
Author(s):  
Bartosz Gil ◽  
Anna Szczepanowska ◽  
Sabina Rosiek
Keyword(s):  
Global Warming ◽  
Global Warming Potential ◽  
Mass Fraction ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Operational Parameters ◽  
Vapor Compression Refrigeration ◽  
Low Global Warming Potential ◽  
Triangular Design

In this work, which is related to the current European Parliament Regulation on restrictions affecting refrigeration, four new three-component refrigerants have been proposed; all were created using low Global Warming Potential(GWP) synthetic and natural refrigerants. The considered mixtures consisted of R32, R41, R161, R152a, R1234ze (E), R1234yf, R1243zf, and RE170. These mixtures were theoretically tested with a 10% step in mass fraction using a triangular design. The analysis covered two theoretical cooling cycles at evaporating temperatures of 0 and −30 °C, and a 30 °C constant condensing temperature. The final stage of the work was the determination of the best mixture compositions by thermodynamic and operational parameters. R1234yf–R152a–RE170 with a weight share of 0.1/0.5/0.4 was determined to be the optimal mixture for potentially replacing the existing refrigerants.

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