Fully Flexible, Polymer based Microwave Devices Part II: Flexible Antennas and Performance Evaluation

10.36227/techrxiv.13712953 ◽

2021 ◽

Author(s):

Iurii Cherukhin

Keyword(s):

Mechanical Performance ◽

Dielectric Materials ◽

Low Loss ◽

Performance Improvements ◽

Flexible Polymer ◽

Modified Polymers ◽

Flexible Antennas ◽

And Performance ◽

Fringing Fields ◽

Bow Tie

In this work, we have investigated polymer-based flexible antennas from commercial and modified polymers, which are competitive to rigid PCB technology. Classical designs of the patch and bow-tie antennas have been realized and showed that the realized gain can get up to 9.16dBi for the patch and 7.9dBi for the bow-tie antennas. The effects of the dielectric loss and conductivity on the antennas’ performance in S-band have been analyzed in order to find limits for further material engineering and the optimum trade-off between microwave and mechanical performance. The bending effects have been investigated, and it has been found that E-plane bend inside can boost the antenna gain from 8.6dBi to 10.1dBi with the frequency shift from 2.5 GHz to 2.4 GHz for the patch and 7.9dBi to 11.3dBi at 3.1 GHz for the bow-tie antennas. The non-classical π-shaped conductors’ edges lead to additional fringing fields, which have an effect on the antenna’s gain and can be explored and exploited for further performance improvements. The new recipes for low-loss, low-Dk dielectric materials, and chemical integration between conducting

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Materials Issues and Characterization of Low-k Dielectric Materials

MRS Bulletin ◽

10.1557/s0883769400034205 ◽

1997 ◽

Vol 22 (10) ◽

pp. 49-54 ◽

Cited By ~ 15

Author(s):

E. Todd Ryan ◽

Andrew J. McKerrow ◽

Jihperng Leu ◽

Paul S. Ho

Keyword(s):

Process Integration ◽

Dielectric Materials ◽

Propagation Delay ◽

Thermomechanical Properties ◽

General Criterion ◽

Crosstalk Noise ◽

Total Delay ◽

Interlayer Dielectrics ◽

Performance Improvements ◽

And Performance

Continuing improvement in device density and performance has significantly affected the dimensions and complexity of the wiring structure for on-chip interconnects. These enhancements have led to a reduction in the wiring pitch and an increase in the number of wiring levels to fulfill demands for density and performance improvements. As device dimensions shrink to less than 0.25 μm, the propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance (RC) coupling become significant. Accordingly the interconnect delay now constitutes a major fraction of the total delay limiting the overall chip performance. Equally important is the processing complexity due to an increase in the number of wiring levels. This inevitably drives cost up by lowering the manufacturing yield due to an increase in defects and processing complexity.To address these problems, new materials for use as metal lines and interlayer dielectrics (ILDs) and alternative architectures have surfaced to replace the current Al(Cu)/SiO2 interconnect technology. These alternative architectures will require the introduction of low-dielectric-constant k materials as the interlayer dielectrics and/or low-resistivity conductors such as copper. The electrical and thermomechanical properties of SiO2 are ideal for ILD applications, and a change to material with different properties has important process-integration implications. To facilitate the choice of an alternative ILD, it is necessary to establish general criterion for evaluating thin-film properties of candidate low-k materials, which can be later correlated with process-integration problems.

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Fully Flexible, Polymer based Microwave Devices Part I: Materials, Fabrication Technique, and Application to Transmission Lines

10.36227/techrxiv.13712905.v1 ◽

2021 ◽

Author(s):

Iurii Cherukhin

Keyword(s):

Transmission Lines ◽

Elevated Temperatures ◽

Transmission Loss ◽

Dielectric Materials ◽

Microwave Devices ◽

Molding Process ◽

Performance Improvements ◽

Microwave Electronics ◽

Flexible Polymer ◽

Significant Performance

To achieve fully flexible microwave devices, we investigated flexible polymers in terms of chemical, mechanical, and electrical properties. Moreover, the fabrication techniques for polymer-based microwave devices have been developed to address chemical adhesion and demolding issues. Finally, based on formulated criteria, we have developed recipes for low-loss (0.001), low-Dk (1.73) flexible dielectric materials and applied them to the microstrip and CPW transmission lines. The microstrip and CPW lines' transmission loss is as low as 0.065 and 0.034 dB/cm at 2.5 GHz, respectively. The effects of various materials on microwave performance have been analyzed, from which we show acceptable limits for fully flexible microwave devices in S and L bands. The proposed molding process allows us to step out from 2D PCB designs and build 3D structures or hybrid PCB-3D components with a certain freedom in material properties. Additionally, the new material exhibits unique mechanical properties, which extends the material application to other fields. This work demonstrates that polymer-based flexible microwave electronics can have a competitive performance compared to rigid PCB technology. Additionally, it has been found that the polymer-based devices have significant performance improvements at elevated temperatures, which can be exploited in a high-temperature application.

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Reliability and Performance Improvements of 3D System-in-Packages in Fan-Out Wafer Level Packaging

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2013dpc-wp22 ◽

2013 ◽

Vol 2013 (DPC) ◽

pp. 001458-001485

Author(s):

Scott Hayes ◽

Tony Gong ◽

Doug Mitchell ◽

Michael Vincent ◽

Jason Wright ◽

...

Keyword(s):

Wafer Level ◽

Low Loss ◽

3D Integration ◽

Performance Improvements ◽

Wafer Level Packaging ◽

Effective System ◽

3D Packaging ◽

And Performance ◽

Imaging Sensors ◽

2D And 3D

Recent development efforts for fan-out wafer level packaging (FO-WLP) have focused on system-in-package (SiP) solutions using both 2D and 3D packaging structures. Creating connections between the various elements of the system is one of the critical requirements of the packaging technology. The connections must provide a low loss pathway, exhibit manufacturability and prove reliable. Effective system connections enable complex yet volumetrically and electrically efficient systems to be constructed. The combination of various system elements including, but not limited to, SMDs, CMOS, GaAs, MEMS, power devices, imaging sensors or IPDs gives system designers the capability to generate novel systems and differentiating solutions. Both 2D and 3D SiPs based upon the Redistributed Chi Package (RCP) have been developed for consumer, defense and medical applications. In RCP (i.e. FO-WLP), 2D systems are readily achieved through the use of existing packaging processes, materials and structures. For 3D embodiments, the FO-WLP technology must be expanded. 3D integration in FO-WLP can be achieved with the use of package-on-package (PoP), embedded substrates, package edge connections, die stacking or even TSV approaches. However, a more typical solution to the 3D integration challenge is the through package via (TPV). TPVs can resemble substrate vias but their construction is typically different. Regardless of materials selected or processes used to create the TPV, system connections using a TPV will require a certain level of performance and reliability. Reliability and performance improvements to the 3D RCP technology will be presented.

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Fully Flexible, Polymer based Microwave Devices Part I: Materials, Fabrication Technique, and Application to Transmission Lines

10.36227/techrxiv.13712905 ◽

2021 ◽

Author(s):

Iurii Cherukhin

Keyword(s):

Transmission Lines ◽

Elevated Temperatures ◽

Transmission Loss ◽

Dielectric Materials ◽

Microwave Devices ◽

Molding Process ◽

Performance Improvements ◽

Microwave Electronics ◽

Flexible Polymer ◽

Significant Performance

To achieve fully flexible microwave devices, we investigated flexible polymers in terms of chemical, mechanical, and electrical properties. Moreover, the fabrication techniques for polymer-based microwave devices have been developed to address chemical adhesion and demolding issues. Finally, based on formulated criteria, we have developed recipes for low-loss (0.001), low-Dk (1.73) flexible dielectric materials and applied them to the microstrip and CPW transmission lines. The microstrip and CPW lines' transmission loss is as low as 0.065 and 0.034 dB/cm at 2.5 GHz, respectively. The effects of various materials on microwave performance have been analyzed, from which we show acceptable limits for fully flexible microwave devices in S and L bands. The proposed molding process allows us to step out from 2D PCB designs and build 3D structures or hybrid PCB-3D components with a certain freedom in material properties. Additionally, the new material exhibits unique mechanical properties, which extends the material application to other fields. This work demonstrates that polymer-based flexible microwave electronics can have a competitive performance compared to rigid PCB technology. Additionally, it has been found that the polymer-based devices have significant performance improvements at elevated temperatures, which can be exploited in a high-temperature application.

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Remote Thermal Performance Monitoring and Diagnostics: Turning Data Into Knowledge

Volume 2: Reliability, Availability and Maintainability (RAM); Plant Systems, Structures, Components and Materials Issues; Simple and Combined Cycles; Advanced Energy Systems and Renewables (Wind, Solar and Geothermal); Energy Water Nexus; Thermal Hydraulics and CFD; Nuclear Plant Design, Licensing and Construction; Performance Testing and Performance Test Codes ◽

10.1115/power2013-98246 ◽

2013 ◽

Cited By ~ 4

Author(s):

Xiaomo Jiang ◽

Craig Foster

Keyword(s):

Anomaly Detection ◽

Gas Turbines ◽

Performance Monitoring ◽

Combined Cycle ◽

Integrated System ◽

Site Specific ◽

Performance Improvements ◽

Maintenance Schedule ◽

Effectiveness Monitoring ◽

And Performance

Gas turbine simple or combined cycle plants are built and operated with higher availability, reliability, and performance in order to provide the customer with sufficient operating revenues and reduced fuel costs meanwhile enhancing customer dispatch competitiveness. A tremendous amount of operational data is usually collected from the everyday operation of a power plant. It has become an increasingly important but challenging issue about how to turn this data into knowledge and further solutions via developing advanced state-of-the-art analytics. This paper presents an integrated system and methodology to pursue this purpose by automating multi-level, multi-paradigm, multi-facet performance monitoring and anomaly detection for heavy duty gas turbines. The system provides an intelligent platform to drive site-specific performance improvements, mitigate outage risk, rationalize operational pattern, and enhance maintenance schedule and service offerings via taking appropriate proactive actions. In addition, the paper also presents the components in the system, including data sensing, hardware, and operational anomaly detection, expertise proactive act of company, site specific degradation assessment, and water wash effectiveness monitoring and analytics. As demonstrated in two examples, this remote performance monitoring aims to improve equipment efficiency by converting data into knowledge and solutions in order to drive value for customers including lowering operating fuel cost and increasing customer power sales and life cycle value.

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Preparation and Performance Evaluation of Duotone 3D-Printed Polyetheretherketone as Oral Prosthetic Materials: A Proof-of-Concept Study

Polymers ◽

10.3390/polym13121949 ◽

2021 ◽

Vol 13 (12) ◽

pp. 1949

Author(s):

Ling Ding ◽

Wei Lu ◽

Jiaqi Zhang ◽

Chuncheng Yang ◽

Guofeng Wu

Keyword(s):

Titanium Dioxide ◽

Performance Evaluation ◽

Mechanical Performance ◽

Mechanical Tests ◽

Flexural Properties ◽

Proof Of Concept ◽

Tooth Color ◽

Dental Application ◽

3D Printed ◽

And Performance

Literature has reported the successful use of 3D printed polyetheretherketone (PEEK) to fabricate human body implants and oral prostheses. However, the current 3D printed PEEK (brown color) cannot mimic the vivid color of oral tissues and thus cannot meet the esthetical need for dental application. Therefore, titanium dioxide (TiO2) and ferric oxide (Fe2O3) were incorporated into PEEK to prepare a series of tooth-color and gingival-color PEEK composites in this study. Through color measurements and mechanical tests, the color value and mechanical performance of the 3D printed PEEK composites were evaluated. In addition, duotone PEEK specimens were printed by a double nozzle with an interface between tooth-color and gingival-color parts. The mechanical performance of duotone PEEK with two different interfaces (horizontal and vertical) was investigated. With the addition of TiO2 and Fe2O3, the colors of 3D printed PEEK composites become closer to that of dental shade guides. 3D printed PEEK composites generally demonstrated superior tensile and flexural properties and hence have great potential in the dental application. In addition, duotone 3D printed PEEK with a horizontal interfacial orientation presented better mechanical performance than that with a vertical one.

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