EXPERIMENTAL STUDY ON CHIP FORMATION MECHANISM DUE TO SHOCK OF ULTRA-HIGH SPEED GRINDING

2006 ◽  
Vol 42 (09) ◽  
pp. 43 ◽  
Author(s):  
Henghua ZHAO
2006 ◽  
Vol 304-305 ◽  
pp. 246-250 ◽  
Author(s):  
H.H. Zhao ◽  
Guang Qi Cai ◽  
X.J. Gao

The theory model of the indent experiment of the brittle material was established, its specific energy was analyzed, and the calculation expression of the total specific energy for a single grain was given. Experiment process and results were given. Ultra-high speed grinding experiment was done, and its results were obtained. After the results were analyzed, the conclusions were gained that brittle materials could produce ductile-regime grinding under ultra-high speed shock. The model of mechanism of chip-formation due to shock in quasi-fluid phase on super-high speed grinding was established, and the chip formation hypothesis for the chip formation mechanism on ultra high speed grinding was produced.


1970 ◽  
Vol 36 (429) ◽  
pp. 663-668
Author(s):  
Akira YAMAMOTO ◽  
Shimesu NAKAMURA ◽  
Motosada KANDA

Author(s):  
Pengfei Pan ◽  
Huawei Song ◽  
Junfeng Xiao ◽  
Zuohui Yang ◽  
Guoqi Ren ◽  
...  

Abstract Laser-assisted machining (LAM) is a promising technology for improving the machinability of hard-to-cut materials. In this study, based on the finite element method (FEM), a cutting model of thermally coupled non-uniform temperature field is established. The chip formation mechanism of fused silica during the laser-assisted machining process is explored from the aspects of laser power and laser incident angle. The results show that as the laser incident angle increases, the continuity of the chip increases gradually. An annular tool holder that can adjust the angle between the laser beam and the tool was designed. And the similar chip morphology obtained by variable-angle cutting experiments verified the effectiveness of the cutting model. Moreover, fracture chips and continuous banded chips are found in both simulation and experiment, which implies that the cutting mechanism works under a hybrid mode of brittle fracture and plastic deformation in the LAM process.


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