Creep rupture and enhancement mechanism of Cu particle enhancement composite solder joints

2007 ◽  
Vol 43 (10) ◽  
pp. 201
Author(s):  
Yanfu YAN
Keyword(s):  
Composite Solder ◽  
Solder Joints ◽  
Creep Rupture ◽  
Enhancement Mechanism

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C

2009 ◽  
Vol 38 (6) ◽  
pp. 843-851 ◽  
Author(s):  
Olli Nousiainen ◽  
Tero Kangasvieri ◽  
Risto Rautioaho ◽  
Jouko Vähäkangas
Keyword(s):  
Thermal Fatigue ◽  
Composite Solder ◽  
Solder Joints ◽  
Lead Free ◽  
Temperature Range ◽  
Fatigue Endurance

Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

2011 ◽  
Vol 687 ◽  
pp. 39-43
Author(s):  
Yao Li Wang ◽  
Gai Hong Dong ◽  
Chen Yang Li ◽  
Zhi Wei Wu ◽  
Jing Sun
Keyword(s):  
Rare Earth ◽  
Solder Alloy ◽  
Interfacial Layer ◽  
Solder Joints ◽  
Rupture Life ◽  
Creep Property ◽  
Creep Rupture ◽  
Sectional Area ◽  
Cross Sectional ◽  
Snagcu Solder

Creep property is one of the most important factors to affect the reliability of soldered joints. The effect of rare earth(RE) on the creep rupture life of Sn2.5Ag0.7Cu solder joints were investigated under constant temperature and stress using creep specimens with a 1mm2cross sectional area. The results show that adding tiny RE in Sn2.5Ag0.7Cu solder alloy can effectually affect the size and configuration of the intermetallic compound (IMC) of interfacial layer. The IMC of Sn2.5Ag0.7Cu interfacial layer is thinner and its thickness is homogeneous with adding 0.1% RE, and the creep rupture life of solder joints is longest, which is apparently superior to that of Sn2.5Ag0.7Cu and commercial used Sn3.8Ag0.7Cu solder alloy.

Electromigration reliability for Al2O3-reinforced Cu/Sn–58Bi/Cu composite solder joints

2016 ◽  
Vol 28 (3) ◽  
pp. 3004-3012 ◽  
Author(s):  
Li Yang ◽  
Jinguo Ge ◽  
Yaocheng Zhang ◽  
Jun Dai ◽  
Yanfeng Jing
Keyword(s):  
Composite Solder ◽  
Solder Joints

Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders

2010 ◽  
Vol 650 ◽  
pp. 78-84 ◽  
Author(s):  
Yan Fu Yan ◽  
Guo Xin Wang ◽  
Ke Xing Song ◽  
Kuai Le Zhao
Keyword(s):  
Composite Solder ◽  
Rupture Life ◽  
Creep Rupture ◽  
Solder Alloys ◽  
Minute Amount ◽  
Eutectic Solder ◽  
Ag Particles ◽  
Ag Particle ◽  
The Way

Particle-enhanced is the way to improve properties of solder alloys. In the present work, the influence of Ag particle-enhanced on the wettability and creep rupture life of 99.3Sn0.7Cu eutectic solder with Ag content of 1vol% to 10vol% were investigated. It was indicated that the wettability of the composite solders could be improved by adding minute amount of Ag particles. With increasing the amount of Ag particles, the spreading areas of the composite solders increased when Ag was below 5vol%. When Ag was above 5vol%, the spreading areas started decreasing. When Ag content was up to 10vol%, the wettability of the composite solder sharply deteriorated. In addition, the creep rupture lives of the composite solders were longer than that of 99.3Sn0.7Cu eutectic solder at the same condition. When Ag content was 5vol%, the creep rupture life of the composite solder was the longest among the investigated composite solders and about 23 times of that of 99.3Sn0.7Cu eutectic solder.

Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

Rare Metals ◽  
2007 ◽  
Vol 26 (1) ◽  
pp. 51-55 ◽  
Author(s):  
Y YANFU ◽  
Y HONGXING ◽  
C FUXIAO ◽  
Z KEKE ◽  
Z JINHONG
Keyword(s):  
Creep Behavior ◽  
Composite Solder ◽  
Solder Joints
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