Design and Simulation of Piezoresistive Pressure Sensor for Ocean Depth Measurements

2013 ◽  
Vol 411-414 ◽  
pp. 1552-1558
Author(s):  
Guan Rong Tang ◽  
Si Di ◽  
Xin Xu ◽  
Qiu Lan Chen

This paper presents the design and simulation of a piezoresistive pressure sensor with wide operation range (up to the pressure of 1000 m-deep water). Structural and electrical simulations were carried out using COMSOL Multiphysics 4.3. The dimension of the membrane, and the geometry and placement of piezoresistors, were optimized through structural simulations. Electrical simulations were used to evaluate the performance of selected sensors. The output characteristics revealed good linearity throughout the measurement range with sensitivities of 0.4500~0.8964 mV/V/MPa. The optimum design of sensor was determined according to the simulation results.

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000373-000378
Author(s):  
R. Otmani ◽  
N. Benmoussa ◽  
K. Ghaffour

Piezoresistive pressure sensors based on Silicon have a large thermal drift because of their high sensitivity to temperature (ten times more sensitive to temperature than metals). So the study of the thermal behavior of these sensors is essential to define the parameters that cause the drift of the output characteristics. In this study, we adopted the behavior of 2nd degree gauges depending on the temperature. Then we model the thermal behavior of the sensor and its characteristics.


Author(s):  
Chih-Tang Peng ◽  
Ji-Cheng Lin ◽  
Chun-Te Lin ◽  
Kuo-Ning Chiang

In this study, a packaged silicon base piezoresistive pressure sensor with thermal stress buffer is designed, fabricated, and measured. A finite element method (FEM) is adopted for design and experimental validation of the sensor performance. Thermal and pressure loading on the sensor is applied to make a comparison between sensor experimental and simulation results. Furthermore, a method that transfers simulation stress data into output voltage is proposed in this study, the results indicate that the experimental result coincides with simulation data.


Sensor Review ◽  
2019 ◽  
Vol 39 (4) ◽  
pp. 586-597 ◽  
Author(s):  
Manjunath Manuvinakurake ◽  
Uma Gandhi ◽  
Mangalanathan Umapathy ◽  
Manjunatha M. Nayak

Purpose Structures play a very important role in developing pressure sensors with good sensitivity and linearity, as they undergo deformation to the input pressure and function as the primary sensing element of the sensor. To achieve high sensitivity, thinner diaphragms are required; however, excessively thin diaphragms may induce large deflection and instability, leading to the unfavorable performances of a sensor in terms of linearity and repeatability. Thereby, importance is given to the development of innovative structures that offer good linearity and sensitivity. This paper aims to investigate the sensitivity of a bossed diaphragm coupled fixed guided beam three-dimensional (3D) structure for pressure sensor applications. Design/methodology/approach The proposed sensor comprises of mainly two sensing elements: the first being the 3D mechanical structure made of bulk silicon consisting of boss square diaphragm along with a fixed guided beam landing on to its center, forming the primary sensing element, and the diffused piezoresistors, which form the secondary sensing element, are embedded in the tensile and compression regions of the fixed guided beam. This micro mechanical 3 D structure is packaged for applying input pressure to the bottom of boss diaphragm. The sensor without pressure load has no deflection of the diaphragm; hence, no strain is observed on the fixed guided beam and also there is no change in the output voltage. When an input pressure P is applied through the pressure port, there is a deformation in the diaphragm causing a deflection, which displaces the mass and the fixed guided beam vertically, causing strain on the fixed guided beam, with tensile strain toward the guided end and compressive strain toward the fixed end of the close magnitudes. The geometrical dimensions of the structure, such as the diaphragm, boss and fixed guided beam, are optimized for linearity and maximum strain for an applied input pressure range of 0 to 10 bar. The structure is also analyzed analytically, numerically and experimentally, and the results are compared. Findings The structure offers equal magnitudes of tensile and compressive stresses on the surface of the fixed guided beam. It also offers good linearity and sensitivity. The analytical, simulation and experimental studies of this sensor are introduced and the results correlate with each other. Customized process steps are followed wherein two silicon-on-insulator (SOI) wafers are fusion bonded together, with SOI-1 wafer used to realize the diaphragm along with the boss and SOI-2 wafer to realize the fixed guided beam, leading to formation of a 3D structure. The geometrical dimensions of the structure, such as the diaphragm, boss and fixed guided beam, are optimized for linearity and maximum strain for an applied input pressure range of 0 to10 bar. Originality/value This paper presents a unique and compact 3D micro-mechanical structure pressure sensor with a rigid center square diaphragm (boss diaphragm) and a fixed guided beam landing at its center, with diffused piezoresistors embedded in the tensile and compression regions of the fixed guided beam. A total of six masks were involved to realize and fabricate the 3D structure and the sensor, which is presumed to be the first of its kind in the fabrication of MEMS-based piezoresistive pressure sensor.


Author(s):  
Preedipat Sattayasoonthorn ◽  
Jackrit Suthakorn ◽  
Sorayouth Chamnanvej

A biocompatible liquid crystal polymer (LCP) pressure sensor is proposed for measuring intracranial pressure (ICP) in Traumatic Brain Injury (TBI) patients. Finite element method using COMSOL multiphysics is employed to study the mechanical behavior of the packaged LCP pressure sensor in order to optimize the sensor design. A 3D model of the 8x8x0.2 mm LCP pressure sensor is simulated to investigate the parameters that significantly influence the sensor characteristics under the uniform pressure range of 0 to 50 mmHg. The simulation results of the new design are compared to the experimental results from a previous design. The result shows that reducing the thickness of the sensing membrane can increase the sensitivity up to six times of that previously reported. An improvement of fabrication methodology is proposed to complete the LCP packaging.


2021 ◽  
Vol 11 (2) ◽  
pp. 1629-1640
Author(s):  
Kavitha K

This paper mainly focuses on to get high displacement from polymer based piezoresistive cantilever for MEMS/NEMS pressure sensor applications. The displacement has been analyzed and compared with three different cantilever using PDMS (Poly dimethyl siloxane) and PMMA (Poly methyl methacrylate) materials. The p-type silicon piezoresistors connected the form based on wheat stone bridge to get high sensible pressure sensor with respect to low response. An according to get high displacement, obviously the other performance of parameters such as stress, strain gets high range. So, this analyzed cantilever structure used to design a pressure sensor with high sensitivity. The design and simulation are done by using COMSOL Multiphysics.


This paper presents an overview of design, modeling and simulation of MEMS pressure sensor is using COMSOL Multiphysics V4.3b. An attempt has been made to achieve high sensitivity by providing different structures for membrane (Circular, square, rectangle & triangle) with uniform surface area and thickness. Further, simulations have been carried out with various loads ranging from 0.1 to 1MPa assigning three materials viz., InP, GaAs and Silicon. From the analyses of simulation results, it has been observed that the pressure sensor with circular membrane provided InP material found to exhibit more deformation and high sensitivity of 17.3×10-12 for 10 µm thickness and 50.8×10-12 for 7 µm thickness. The reasons for enhancement in the sensitivity are discussed in detail as function of input load, dimensional changes of diaphragm and materials addition. These studies are highly useful to check and compute pressure in various industrial and environmental conditions.


Sensors ◽  
2020 ◽  
Vol 20 (16) ◽  
pp. 4419
Author(s):  
Ting Li ◽  
Haiping Shang ◽  
Weibing Wang

A pressure sensor in the range of 0–120 MPa with a square diaphragm was designed and fabricated, which was isolated by the oil-filled package. The nonlinearity of the device without circuit compensation is better than 0.4%, and the accuracy is 0.43%. This sensor model was simulated by ANSYS software. Based on this model, we simulated the output voltage and nonlinearity when piezoresistors locations change. The simulation results showed that as the stress of the longitudinal resistor (RL) was increased compared to the transverse resistor (RT), the nonlinear error of the pressure sensor would first decrease to about 0 and then increase. The theoretical calculation and mathematical fitting were given to this phenomenon. Based on this discovery, a method for optimizing the nonlinearity of high-pressure sensors while ensuring the maximum sensitivity was proposed. In the simulation, the output of the optimized model had a significant improvement over the original model, and the nonlinear error significantly decreased from 0.106% to 0.0000713%.


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