Thermal characterization of high power LED with ceramic particles filled thermal paste for effective heat dissipation

2015 ◽  
Vol 55 (2) ◽  
pp. 383-388 ◽  
Author(s):  
Nur Hasyimah Hashim ◽  
P. Anithambigai ◽  
D. Mutharasu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Thermal Characterization ◽  
Ceramic Particles ◽  
Thermal Paste ◽  
Effective Heat ◽  
High Power Led

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Analysis and Optimization of Heat Dissipation Characteristics of High-power LED

2021 ◽  
Author(s):  
Pingfeng Wu ◽  
Runji Fang ◽  
Xuanjun Dai ◽  
Anak Agung Ayu Putri
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
High Power Led

scholarly journals Systematic Research on the Heat Dissipation Channel of High Power LED Street Lamps

2021 ◽  
Vol 1952 (3) ◽  
pp. 032003
Author(s):  
Zhao Wang ◽  
Qijun Bao ◽  
Yuefeng Li ◽  
Jun Zou ◽  
Hao Zheng ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Systematic Research ◽  
High Power Led

A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement

2018 ◽  
Vol 15 (3) ◽  
pp. 117-125 ◽  
Author(s):  
Bharath R. Bharadwaj ◽  
SriNithish Kandagadla ◽  
Praveen J. Nadkarni ◽  
V. Krishna ◽  
T. R. Seetharam ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Superposition Principle ◽  
Thermal Characterization ◽  
Electronic Packages ◽  
Heat Sources ◽  
Linear Superposition ◽  
Simple Method ◽  
Ansys Simulation ◽  
Staggered Arrangement

Abstract The need for compactness and efficiency of processing devices has kept increasing rapidly over the past few years. This need for compactness has driven the dice to be stacked one above the other. But with this come the difficulty of heat dissipation and its characterization because there are multiple heat sources and a single effective heat-conductive path. Hence, it becomes important to know the distribution and characterization of heat and temperature to provide effective cooling systems. In this article, we discuss the temperature distribution of various power configurations on stacked dice with five dice, when the dice are in staggered arrangement. The simulations have been carried out for both free convection and forced convection conditions using the ANSYS commercial software. The linear Superposition principle (LSP) is demonstrated on these configurations and validated with the results obtained from ANSYS simulation. LSP can be applied for the quick estimation of die temperatures with negligible error.

The Accelerated Aging Characterization of High Power LED

2012 ◽  
Vol 33 (11) ◽  
pp. 1236-1240 ◽  
Author(s):  
李艳菲 LI Yan-fei ◽  
张方辉 ZHANG Fang-hui ◽  
张静 ZHANG Jing
Keyword(s):  
High Power ◽  
Accelerated Aging ◽  
High Power Led

Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

2011 ◽  
Vol 32 (11) ◽  
pp. 1171-1175 ◽  
Author(s):  
柴伟伟 CHAI Wei-wei ◽  
陈清华 CHEN Qing-hua ◽  
李琳红 LI Ling-hong ◽  
唐文勇 TANG Wen-yong ◽  
张学清 ZHANG Xue-qing ◽  
...  
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
High Power Led

Heat Dissipation Simulation Analysis of High Power LED via Heat Slug Geometry Variation

2014 ◽  
Vol 1082 ◽  
pp. 344-347
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Hussin Kamarudin ◽  
Mukhzeer Mohamad Shahimin ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Life Time ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Potential Development ◽  
High Power Led ◽  
Superior Surface ◽  
Von Mises

High power LEDs are currently being plagued by heat dissipation challenges due to its high power density thus limiting its further potential development and fulfillment. Exercising proper selection of packaging component could improve the life time of high power LED. In this work, the significance of the heat slug geometry on the heat dissipation of high power LED was addressed through simulation analysis. The heat slug geometries were varied in order to compare the heat dissipation of the high power LED. Ansys version 11 was utilized for the simulation. The heat dissipation of the high power LED was evaluated in terms of junction temperature, von Mises stress and thermal resistance. The key results of the analysis showed that a superior surface area is preferred for an enhanced heat dissipation of high power LED

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