Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays

With an urgent need for energy conservation and pollution reduction, the trend of replacing traditional incandescent or fluorescent lamps with high-power LEDs is growing more and more popular. However, heat dissipation of high-power LED is the main bottleneck for its application. In this research, a kind of automotive headlamp low beam system model is designed with high power LED chips. Several different cooling devices are designed for headlamp cooling, the heat dissipation performances are simulated and analyzed both by the finite volume method (FVM) in FloEFD and experimental measurements. The obtained results indicate that loop heat pipe combined with fined heat sink is the most effective way for heat dissipation in the designed automotive low beam system, even in 80¡æ environmental temperature can ensure the LED headlamp system working stability. The research lays a theoretical basis for the follow-up study.

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Based on Taguchi Analysis for High Power LED Liquid-Cooling System Design

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.130-134.3967 ◽

2011 ◽

Vol 130-134 ◽

pp. 3967-3971

Author(s):

San Shan Hung ◽

Hsing Cheng Chang ◽

Jhih Wei Huang

Keyword(s):

High Power ◽

Heat Dissipation ◽

Cooling System ◽

Thermal Dissipation ◽

Liquid Cooling ◽

K Value ◽

Control Factors ◽

Pump Flow Rate ◽

High Power Led ◽

Liquid Cooling System

The main result of this study is to propose a liquid-cooling system for high power LED heat dissipation treatment. By using thermal dissipation mechanism and based on ANSYS CFX numerical analysis of change the parameters of cold plat. We will get the optimal heat dissipation structure. The experimental results show that the Taguchi method of thermal mechanisms in this study of the four control factors affecting the order: k value of thermal compound > fan power > liquid type > pump flow rate, and to identify the best combination of factor levels. When the heat source is 90 W, the best factor of the experimental cooling system thermal resistance is 0.563K/W. Nomenclature

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Thermal management of high-power LED module with single-phase liquid jet array

Applied Thermal Engineering ◽

10.1016/j.applthermaleng.2020.116270 ◽

2020 ◽

pp. 116270 ◽

Cited By ~ 2

Author(s):

Elizaveta Ya Gatapova ◽

Gopinath Sahu ◽

Sameer Khandekar ◽

Run Hu

Keyword(s):

Thermal Management ◽

High Power ◽

Single Phase ◽

Liquid Jet ◽

High Power Led ◽

Phase Liquid ◽

Jet Array

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Application of Multiwalled Carbon Nanotube Nanofluid for 450 W LED Floodlight

Journal of Nanomaterials ◽

10.1155/2014/347909 ◽

2014 ◽

Vol 2014 ◽

pp. 1-6 ◽

Cited By ~ 4

Author(s):

Bui Hung Thang ◽

Le Dinh Quang ◽

Nguyen Manh Hong ◽

Phan Hong Khoi ◽

Phan Ngoc Minh

Keyword(s):

Thermal Conductivity ◽

Carbon Nanotubes ◽

Ethylene Glycol ◽

High Power ◽

Heat Dissipation ◽

Air Cooling ◽

Liquid Cooling ◽

Multiwalled Carbon ◽

Cooling Method ◽

High Power Led

Overheating of the high-power light emitting diode (LED) has a dramatic effect on the chip’s lifetime. Heat dissipation for high-power LED is becoming a major challenge for researchers and technicians. Compared with the air cooling method, the liquid cooling method has many advantages and high efficiency because of higher specific heat capacity, density, and thermal conductivity. Carbon nanotubes with remarkable thermal properties have been used as additives in liquids to increase the thermal conductivity. In this work, multiwalled carbon nanotubes nanofluid (MWCNTs nanofluid) was used to enhance heat dissipation for 450 W LED floodlight. MWCNTs nanofluid was made by dispersing the OH functionalized MWCNTs in ethylene glycol/water solution. The concentration of MWCNTs in fluid was in the range between 0.1 and 1.3 gram/liter. The experimental results showed that the saturated temperature of 450 W LED chip was 55°C when using water/ethylene glycol solution in liquid cooling system. In the case of using MWCNTs nanofluid with 1.2 gram/liter of MWCNTs’ concentration, the saturated temperature of LED chip was 50.6°C. The results have confirmed the advantages of the MWCNTs for heat dissipation systems for high-power LED floodlight and other high power electronic devices.

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An efficient single phase liquid cooling system for microelectronic devices with high power chip

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) ◽

10.1109/eptc.2015.7412300 ◽

2015 ◽

Cited By ~ 3

Author(s):

Gongyue Tang ◽

Yong Han ◽

Boon Long Lau ◽

Xiaowu Zhang ◽

Daniel MinWoo Rhee

Keyword(s):

High Power ◽

Single Phase ◽

Cooling System ◽

Liquid Cooling ◽

Microelectronic Devices ◽

Phase Liquid ◽

Liquid Cooling System

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Single-Phase Liquid Cooling of a Quad-Core Processor

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 ◽

10.1115/ipack2011-52139 ◽

2011 ◽

Cited By ~ 1

Author(s):

Anjali Chauhan ◽

Bahgat Sammakia ◽

Furat F. Afram ◽

Kanad Ghose ◽

Gamal Refai-Ahmed ◽

...

Keyword(s):

Single Phase ◽

Heat Dissipation ◽

Cooling System ◽

Hot Spot ◽

Floor Plan ◽

Liquid Cooling ◽

Uniform Heat ◽

Phase Liquid ◽

Liquid Cooling System ◽

Planar Flows

Multicore microprocessor chips have emerged as an industry standard in recent years and have enabled Moore’s Law to be sustained when one considers the collective performance achieved by multiple cores. The industry has favored floor plans that use identical or symmetric layouts of individual cores in a linear array or a two-dimensional (2D) array, oblivious to the non-uniform heat dissipation within each core. Such non-uniform heat dissipations have hot spots within each core that must be aggressively cooled to avoid temporary or permanent device failures that can result from high temperature gradients. This paper evaluates alternative core layouts and microchannel configurations of a single-phase liquid cooling system for multi-core chips. We first examine the use of different planar flow patterns in microchannels for a realistic quad-core processor with non-uniform energy dissipation within each core. The direction of the flows in the microchannels is varied to achieve minimum hot spot temperatures on the die. A symmetric layout of the four cores with minimum achievable hot spot temperature is then selected and subjected to impingement flow. We establish the thermal efficiency of the optimized core floor plan compared to the traditional floor plan in a quad-core design and show that impingement provides the most efficient cooling solution compared to microchannels with planar flows for the same pressure difference.

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Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

Applied Sciences ◽

10.3390/app11094035 ◽

2021 ◽

Vol 11 (9) ◽

pp. 4035

Author(s):

Jinsheon Kim ◽

Jeungmo Kang ◽

Woojin Jang

Keyword(s):

Light Source ◽

High Power ◽

Heat Dissipation ◽

Light Emitting Diode ◽

Light Distribution ◽

Light Sources ◽

Led Light ◽

High Power Led ◽

Distribution Requirement ◽

Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

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