Effect of Ag on the Sn-Cu Lead-Free Material

2014 ◽  
Vol 687-691 ◽  
pp. 4291-4294
Author(s):  
Zhi Gang Kong ◽  
Feng Min Shi
Keyword(s):  
Mechanical Performance ◽  
Environmentally Benign ◽  
Lead Free ◽  
Electronic Packages ◽  
Cu Alloy ◽  
Wetting Property ◽  
Analytical Research ◽  
Free Solder ◽  
Free Material ◽  
Better Than

With the increasing focus on developing environmentally benign electronic packages, Pb-free alloys have received a great deal of attention. Among the lead-free solder materials, Sn–Ag–Cu alloy has advantages of good wetting property, superior interfacial properties, high creep resistance and low coarsening rate. In this article, the organization and mechanical performance of Sn-Ag-Cu Material are investigated. Series of inspections and analytical research methods are introduced. Experimental results show that Sn-Cu solder organization contains a large number of Cu6Sn5graphic, while Sn-Ag-Cu graphic is IMC Ag3Sn graphic. The mechanical propersity of Sn-Ag-Cu alloy is better than the Sn-Cu alloy. Fracture surfaces of the Sn-Ag3.0-Cu0.5 alloys specimen have many small size and homogeneously distributed dimples.

Wettability of Sn-Zn Lead-Free Solder on Aluminum Substrate

2013 ◽  
Vol 815 ◽  
pp. 48-54 ◽  
Author(s):  
Xiao Yan Xu ◽  
Guo Tong Qian ◽  
Jian Zhou ◽  
Yao Yao ◽  
Xu Chen
Keyword(s):  
Lead Free ◽  
Aluminum Substrate ◽  
Aluminum Surface ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Spreading Area ◽  
Trace Addition ◽  
Free Solder ◽  
Zn Alloys ◽  
Better Than

The effects of flux components and compositions of solder alloys on the wettability of the Sn-Zn alloys on aluminum surface was investigated. The results show that the wettability of the Sn-9Zn solder on aluminum substrate improved with flux of double solvents composed of diethanolamine and triethanolamine, which is better than single solvent. When flux is composed of 3% zinc fluoborate as activator and 30% triethanolamine plus 67% diethanolamine as double solvents, the spreading area of the Sn-9Zn solder reaches to 75%. Trace addition (0.002%-0.005%) of Al results in significant improvement of the wettability of the Sn-9Zn based solder. However, additions of Bi or Sb are not beneficial to the wettability of the solder on aluminum substrate.

IMC and creep behavior in Lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method

2014 ◽  
Vol 15 (7) ◽  
pp. 1137-1142 ◽  
Author(s):  
Z. J. Yang ◽  
S. M. Yang ◽  
H. S. Yu ◽  
S. J. Kang ◽  
J. H. Song ◽  
...  
Keyword(s):  
Creep Behavior ◽  
Solder Joints ◽  
Alloy System ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Alloy ◽  
Free Solder

scholarly journals Effect of rare earth Ce on the microstructure, physical properties and thermal stability of a new lead-free solder

2011 ◽  
Vol 47 (1) ◽  
pp. 11-21 ◽  
Author(s):  
W. Chen ◽  
J. Kong ◽  
W.J. Chen
Keyword(s):  
Rare Earth ◽  
Melting Temperature ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Wetting Properties ◽  
Wetting Property ◽  
Cast Alloys ◽  
Free Solder ◽  
Induced Aggregation

In this paper, in order to develop a low silver content lead-free solder with good overall properties, a newly designed solder alloys of Sn-0.3Ag-0.7Cu-20Bi-xCe type, with addition of varying amounts of rare earth Ce (0.05 mass%, 0.1 mass% and 0.2 mass%) were studied. The melting temperature of Sn-0.3Ag- 0.7Cu can be decreased substantially through addition of 20 mass% Bi; while the segregation of Bi element in the microstructure of the as-cast alloys can be relieved by micro-alloying with trace amount of rare earth Ce. Besides, aging treatments (160?C held for 6 h) of these solder alloys imply that appropriate amount of Ce addition can not only depress the diffusion induced aggregation of Bi in the microstructure but promote the homogenization during annealing. Compared with Bi-free Sn-0.3Ag-0.7Cu solder, Sn-0.3Ag-0.7Cu- 20Bi exhibits better wettability. More excitingly, the wetting property of Sn-0.3Ag-0.7Cu-20Bi can be further improved by doping little amounts of Ce, especially 0.5 mass%, in which case the spreading area of the solder can be increased to the largest extent. On the whole, the present study reveals that Sn-0.3Ag-0.7Cu- 20Bi-xCe (x=0.05-0.1) is a promising lead-free solder candidate considering the microstructure, melting temperature and wetting properties.

Effects of Different Solder Alloys on Reliability of 3D PLUS Solder Joint

2011 ◽  
Vol 314-316 ◽  
pp. 1038-1042 ◽  
Author(s):  
Nuo Bao ◽  
Chun Jie Wang ◽  
Lin Zhu ◽  
Shun Guang Song
Keyword(s):  
Plastic Strain ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Equivalent Stress ◽  
Lead Free ◽  
Stress And Strain ◽  
Free Solder ◽  
Stress And Strain Distribution ◽  
Better Than ◽  
Cycling Condition

Thermal cycling was applied to assess the effect of tin-lead solder 63Sn37Pb and lead-free solder 95.5Sn3.8Ag0.7Cu on the reliability of 3D PLUS solder joints. Nonlinear finite element method and viscoplastic Anand model were used to evaluate the stress and strain distribution and dangerous position of solders under the thermal cycling condition. The law of solder joints stress and plastic strain were finally obtained and showed significant cyclical changes. The stress and strain emerged the trend of accumulated enhancement with the process of time, then ultimately stabilized. Comparing two curves of equivalent stress and plastic strain obtained from lead-free and tin-lead solder, it was found that the reliability of 95.5Sn3.8Ag0.7Cu was better than that of 63Sn37Pb.

scholarly journals Issues on Viscoplastic Characterization of Lead-Free Solder for Drop Test Simulations

2011 ◽  
Vol 133 (4) ◽  
Author(s):  
Etienne L. Bonnaud
Keyword(s):  
Material Behavior ◽  
Drop Test ◽  
Lead Free ◽  
Strain Rates ◽  
Electronic Packages ◽  
Lead Free Solder ◽  
Mixed Hardening ◽  
Drop Tests ◽  
Free Solder

Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards to the observed complex material behavior, the nonlinear mixed hardening Armstrong and Frederick model combined with the Perzyna viscoplastic law was chosen to fit the experimental data. This model was subsequently implemented into a commercial finite element code and used to simulate drop tests. Actual drop test experiments were conducted in parallel and experimental results were compared to simulations. Prediction discrepancies were analyzed and explanations suggested.

scholarly journals Sn-Cu Alloy Electrodeposition for Lead-Free Solder.

1999 ◽  
Vol 50 (12) ◽  
pp. 1125-1129 ◽  
Author(s):  
Mitsunobu FUKUDA ◽  
Koichi HIRAKAWA ◽  
Yasumichi MATSUMOTO
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Alloy Electrodeposition ◽  
Cu Alloy ◽  
Free Solder

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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