Micromachining of Silicon - Study on the Material Removal Mechanism

2014 ◽  
Vol 1018 ◽  
pp. 167-174 ◽  
Author(s):  
Marina Carrella ◽  
Jan C. Aurich
Keyword(s):  
Process Parameters ◽  
Material Removal ◽  
Brittle Materials ◽  
Cutting Speed ◽  
Tool Geometry ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Structure Quality ◽  
Hard And Brittle Materials ◽  
High Structure

The growing demand for micro products of hard and brittle materials requires suitable manufacturing processes, which serve high structure quality and accuracy. Therefore, micro pencil grinding tools are used. While grinding hard and brittle materials the structure quality and accuracy depends on the material removal mechanism. This mechanism is a complex interaction between the process parameters, the material response and the tool geometry. In this paper the influence of the process parameters, particularly the cutting speed and the feed rate, on the material removal mechanism are discussed. Furthermore, a method for the analysis of the structure quality and accuracy and within the material removal mechanism is shown.

Study on Polishing Technology for Hard-Brittle Materials by a Micro Abrasive Water Jet

2014 ◽  
Vol 1027 ◽  
pp. 52-57 ◽  
Author(s):  
Zeng Wen Liu ◽  
R.Y. Liu
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicate Glass ◽  
Material Removal ◽  
Brittle Materials ◽  
Material Surface ◽  
Abrasive Water Jet ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Average Roughness

s: Abrasive jet micromachining is considered as a promising precision processing technology for brittle materials such as silicate glass and silicon nitride that are increasingly used in various applications. In this study, some polishing experiments are conducted for hard-brittle materials by a micro slurry jet. The results show that the morphology and the integrity of the material surface are improved greatly after polishing. The average roughness (Ra) value of the silicate glass decrease from 2.32μm to 0.35μm and the average roughness (Ra) value of the Si3N4 decrease from 2.63μm to 0.34μm. The material removal mechanism and the surface formation mechanism are studied. The factors to influence the surface morphology, the surface quality and the surface roughness are analyzed in order to take measures to improve the surface quality and reduce the surface roughness value.

Experimental Investigation of Material Removal Mechanism in Grinding of Alumina by Single Grain Scratch Test

2013 ◽  
Vol 797 ◽  
pp. 96-102 ◽  
Author(s):  
Taghi Tawakoli ◽  
H. Kitzig ◽  
R. D. Lohner
Keyword(s):  
Material Removal ◽  
High Performance ◽  
Great Influence ◽  
Cutting Speed ◽  
Chip Thickness ◽  
Scratch Test ◽  
Ultrasonic Vibrations ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Pile Up

Alumina is a material that is frequently used in high performance applications. Grinding of alumina is usually associated with micro-cracks which deteriorate surface quality. In order to get a deeper knowledge of the characteristics of material removal mechanisms in alumina during grinding with and without ultrasonic vibration of the workpiece, single grit scratch tests were performed in this research. The effect of the ultrasonic vibrations and cutting speed on the material removal mechanism of alumina was investigated in the chip thickness range of 0.53 μm which is common in precision grinding operations. It was shown that the material pile-up decrease with higher cutting speed. On the other hand, the transition from ductile to brittle mode of material removal occurs earlier in higher cutting speeds. The ultrasonic vibrations showed great influence in the cutting speed 30 m/s in reducing the pile-up values.

scholarly journals Experimental and Numerical Investigation on the Effect of Scratch Direction on Material Removal and Friction Characteristic in BK7 Scratching

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1842
Author(s):  
Wei Wang ◽  
Zhenping Wan ◽  
Shu Yang ◽  
Junyuan Feng ◽  
Liujie Dong ◽  
...  
Keyword(s):  
Recovery Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Elastic Recovery ◽  
Field Analysis ◽  
Tool Geometry ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Initiation And Propagation ◽  
The Face

In order to study the influence of scratch direction on the deformation characteristics and material removal mechanism of optical glass BK7, nanoscratching experiments were conducted on a Nano indenter using Vickers indenter. Results indicate that the face-forward scratch is more likely to induce the initiation and propagation of lateral cracks, which is found to be more beneficial to material removal processes; in contrast, small chips and debris are released from the machined grooves without introducing lateral cracks in the edge-forward condition, leading to poor material removal efficiency. In addition, the choice of scratch direction can make differences to the elastic recovery rate of optical glass BK7. The results revealed that both the elastic recovery rate and the residual stresses of the material under the face-forward scratching are greater than those of the edge-forward scratching. A theoretical model for coefficient of friction (COF) under different scratch directions was established. It is found that the COF between indenter and workpiece in the edge-forward scratching is larger than the face-forward scratching under otherwise identical conditions, this finding is consistent with experimental results. A stress field analysis using finite element method (FEM) was conducted to understand the different crack initiation and propagation behaviors from different scratch directions. The current study discusses the significance of scratch direction on material removal behavior of optical glass BK7, and the results would encourage further research on investigating the connections between tool geometry and material removal mechanism.

Modeling and Analyzing on Nonuniformity of Material Removal in Chemical Mechanical Polishing of Silicon Wafer

2004 ◽  
Vol 471-472 ◽  
pp. 26-31 ◽  
Author(s):  
Jian Xiu Su ◽  
Dong Ming Guo ◽  
Ren Ke Kang ◽  
Zhu Ji Jin ◽  
X.J. Li ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Removal Mechanism ◽  
Particle Movement ◽  
Material Removal Mechanism ◽  
The Relationship ◽  
Nonuniform Material

Chemical mechanical polishing (CMP) has already become a mainstream technology in global planarization of wafer, but the mechanism of nonuniform material removal has not been revealed. In this paper, the calculation of particle movement tracks on wafer surface was conducted by the motion relationship between the wafer and the polishing pad on a large-sized single head CMP machine. Based on the distribution of particle tracks on wafer surface, the model for the within-wafer-nonuniformity (WIWNU) of material removal was put forward. By the calculation and analysis, the relationship between the motion variables of the CMP machine and the WIWNU of material removal on wafer surface had been derived. This model can be used not only for predicting the WIWNU, but also for providing theoretical guide to the design of CMP equipment, selecting the motion variables of CMP and further understanding the material removal mechanism in wafer CMP.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Microgrinding of Nanostructured Carbide Coatings: Ground Surface and Subsurface Damage Observations

2006 ◽  
Vol 304-305 ◽  
pp. 276-280 ◽  
Author(s):  
Y.H. Ren ◽  
Zhi Xiong Zhou ◽  
Zhao Hui Deng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Material Removal ◽  
Ground Surface ◽  
Subsurface Damage ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Carbide Coatings ◽  
Subsurface Layers ◽  
Scanning Electron

Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions. Nondestructive and destructive approaches were utilized to assess damage in ground nanostructured coatings. Different surface and subsurface configurations were observed by scanning electron microscopy. This paper investigates the effects of microgrinding conditions on damage formation in the surface and subsurface layers of the ground nanostructured WC/12Co coatings. And the material-removal mechanism has been discussed.

The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting

2014 ◽  
Vol 1027 ◽  
pp. 40-43
Author(s):  
Yan Yan Lou ◽  
Yan Zhang ◽  
Ying Gao ◽  
Jia Chen Zhang ◽  
Yan Zhou Sun
Keyword(s):  
Material Removal ◽  
Development Trend ◽  
Ultrasonic Machining ◽  
Removal Mechanism ◽  
Rotary Ultrasonic Machining ◽  
Material Removal Mechanism ◽  
Material Removal Model ◽  
The Development Trend ◽  
Removal Model ◽  
Ultrasonic Cutting

Ultrasonic machining is an important part of modern processing technology which is adapt to all kinds of hard brittle materials processing. This paper reviews the latest progress of the material removal mechanism on one-dimensional ultrasonic machining, two-dimensional ultrasonic machining and rotary ultrasonic machining, and expounds the development trend of establishing the material removal model of the ultrasonic machining.

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