SiCOI Structure Fabricated by Hot-Mesh Chemical Vapor Deposition

2006 ◽  
Vol 11-12 ◽  
pp. 257-260
Author(s):  
Kanji Yasui ◽  
T. Kurimoto ◽  
Masasuke Takata ◽  
Tadashi Akahane

The growth of 3C-SiC on thermal oxide layer of Si (SiO2) was investigated by hot-mesh (HM) chemical vapor deposition (CVD), which utilizes hot tungsten (W) wires of a mesh structure as a catalyzer. The SiC films were characterized by Fourier transform infrared spectroscopy (FT-IR), X-ray diffraction (XRD) and cross sectional transmission electron microscopy (TEM). From the XRD spectra of SiC films grown on SiO2 layer, (100) oriented SiC films were grown at the substrate temperatures of 750-800°C and the mesh temperature of 1600°C, while polycrystalline SiC films were grown at the substrate temperature above 900°C. From the data of FT-IR, TEM and the growth rate, the growth characteristics of SiC crystal by HMCVD were discussed.

2005 ◽  
Vol 862 ◽  
Author(s):  
Kanji Yasui ◽  
Jyunpei Eto ◽  
Yuzuru Narita ◽  
Masasuke Takata ◽  
Tadashi Akahane

AbstractThe crystal growth of SiC films on (100) Si and thermally oxidized Si (SiO2/Si) substrates by hot-mesh chemical vapor deposition (HMCVD) using monomethylsilane as a source gas was investigated. A mesh structure of hot tungsten (W) wire was used as a catalyzer. At substrate temperatures above 750°C and at a mesh temperature of 1600°C, 3C-SiC crystal was epitaxially grown on (100) Si substrates. From the X-ray rocking curve spectra of the (311) peak, SiC was also epitaxially grown in the substrate plane. On the basis of the X-ray diffraction (XRD) measurements, on the other hand, the growth of (100)-oriented 3C-SiC films on SiO2/Si substrates was determined to be achieved at substrate temperatures of 750-800°C, while polycrystalline SiC films, at substrate temperatures above 850°C. From the dependence of growth rate on substrate temperature and W-mesh temperature, the growth mechanism of SiC crystal by HMCVD was discussed.


1990 ◽  
Vol 5 (8) ◽  
pp. 1595-1598 ◽  
Author(s):  
M. Iqbal Chaudhry ◽  
Robert L. Wright

In this paper we report the growth of β–SiC films on Si(100) substrates by low-temperature chemical vapor deposition. Single crystals of β–SiC are grown at temperatures as low as 1150 °C. Low-temperature growth β–SiC is achieved using a SiH4–C3H8–H2–Ar gas system. The growth rate of films grown at 1150 °C is 1 μm/h. Transmission electron microscopy and x-ray diffraction results indicate that the β-SiC films grown at and above 1150 °C are single crystals. Films grown at temperatures lower than 1150 °C are polycrystalline.


2021 ◽  
Vol 21 (4) ◽  
pp. 2538-2544
Author(s):  
Nguyen Minh Hieu ◽  
Nguyen Hoang Hai ◽  
Mai Anh Tuan

Tin oxides nanowires were prepared by chemical vapor deposition using shadow mask. X-ray diffraction indicated that the products were tetragonal having crystalline structure with lattice constants a = 0.474 nm and c = 0.318 nm. The high-resolution transmission electron microscopy revealed that inter planar spacing is 0.25 nm. The results chemical mapping in scanning transmission electron microscopy so that the two elements of Oxygen and Tin are distributed very homogeneously in nanowires and exhibit no apparent elements separation. A bottom-up mechanism for SnO2 growth process has been proposed to explain the morphology of SnO2 nanowires.


1991 ◽  
Vol 235 ◽  
Author(s):  
Yung-Jen Lin ◽  
Ming-Deng Shieh ◽  
Chiapying Lee ◽  
Tri-Rung Yew

ABSTRACTSilicon epitaxial growth on silicon wafers were investigated by using plasma enhanced chemical vapor deposition from SiH4/He/H2. The epitaxial layers were growm at temperatures of 350°C or lower. The base pressure of the chamber was greater than 2 × 10−5 Torr. Prior to epitaxial growth, the wafer was in-situ cleaned by H2 baking for 30 min. The epi/substrate interface and epitaxial layers were observed by cross-sectional transmission electron microscopy (XTEM). Finally, the influence of the ex-situ and in-situ cleaning processes on the qualities of the interface and epitaxial layers was discussed in detail.


2007 ◽  
Vol 539-543 ◽  
pp. 1230-1235 ◽  
Author(s):  
Hyoun Woo Kim ◽  
S.H. Shim

We have synthesized the high-density Ga2O3 nanowires on gold (Au)-coated silicon substrates using metalorganic chemical vapor deposition. The nanowires exhibited one-dimensional structures having circular cross sections with diameters in the range of 30-200 nm. The energy dispersive x-ray spectroscopy revealed that the nanowires contained elements of Ga and O, without Au-related impurities. X-ray diffraction analysis and high-resolution transmission electron microscopy showed that the Ga2O3 nanowires were crystalline.


1997 ◽  
Vol 482 ◽  
Author(s):  
E. L. Piner ◽  
N. A. El-Masry ◽  
S. X. Liu ◽  
S. M. Bedair

AbstractInGaN films in the 0–50% InN composition range have been analyzed for the occurrence of phase separation. The ñ0.5 jum thick InGaN films were grown by metalorganic chemical vapor deposition (MOCVD) in the 690 to 780°C temperature range and analyzed by θ−20 x-ray diffraction (XRD), transmission electron microscopy (TEM), and selected area diffraction (SAD). As-grown films with up to 21% InN were single phase. However, for films with 28% InN and higher, the samples showed a spinodally decomposed microstructure as confirmed by TEM and extra spots in SAD patterns that corresponded to multiphase InGaN. An explanation of the data based on the GaN-InN pseudo-binary phase diagram is discussed.


1991 ◽  
Vol 236 ◽  
Author(s):  
Yung-Jen Lin ◽  
Ming-Deng Shieh ◽  
Chiapying Lee ◽  
Tri-Rung Yew

AbstractSilicon epitaxial growth on silicon wafers were investigated by using plasma enhanced chemical vapor deposition from SiH4/He/H2. The epitaxial layers were growm at temperatures of 350°C or lower. The base pressure of the chamber was greater than 2 × 10−5 Torr. Prior to epitaxial growth, the wafer was in-situ cleaned by H2 baking for 30 min. The epi/substrate interface and epitaxial layers were observed by cross-sectional transmission electron microscopy (XTEM). Finally, the influence of the ex-situ and in-situ cleaning processes on the qualities of the interface and epitaxial layers was discussed in detail.


1995 ◽  
Vol 395 ◽  
Author(s):  
R.D. Dupuis ◽  
A.L. Holmes ◽  
P.A Grudowski ◽  
K.G. Fertitta ◽  
F.A. Ponce

ABSTRACTWe report the growth of high-quality III-V nitride heteroepitaxial films on (0001) sapphire substrates by low-pressure metalorganic chemical vapor deposition (MOCVD). These films have exhibited narrow X-ray diffraction rocking curves with full-width-at-half-maximum values as low as ΔΘ∼37 arc sec. Photoluminescence and transmission electron microscopy analysis further indicate the samples to be of high quality.


1986 ◽  
Vol 1 (3) ◽  
pp. 420-424 ◽  
Author(s):  
T.R. Jervis ◽  
L.R. Newkirk

Dielectric breakdown of gas mixtures can be used to deposit thin films by chemical vapor deposition with appropriate control of flow and pressure conditions to suppress gas-phase nucleation and particle formation. Using a pulsed CO2 laser operating at 10.6 μ where there is no significant resonant absorption in any of the source gases, homogeneous films from several gas-phase precursors have been sucessfully deposited by gas-phase laser pyrolysis. Nickel and molybdenum from the respective carbonyls representing decomposition chemistry and tungsten from the hexafluoride representing reduction chemistry have been demonstrated. In each case the gas precursor is buffered with argon to reduce the partial pressure of the reactants and to induce breakdown. Films have been characterized by Auger electron spectroscopy, x-ray diffraction, transmission electron microscopy, pull tests, and resistivity measurements. The highest quality films have resulted from the nickel depositions. Detailed x-ray diffraction analysis of these films yields a very small domain size consistent with the low temperature of the substrate and the formation of metastable nickel carbide. Transmission electron microscopy supports this analysis.


2010 ◽  
Vol 97-101 ◽  
pp. 1749-1753
Author(s):  
Hao Yuan Guan ◽  
Xiao Cheng Yang ◽  
Sheng Ming Jin ◽  
Min Yang

TiO2/Ti-Al-MCM-41 (TAM) with high Ti content (Si/Ti=6.2) was prepared by chemical vapor deposition (CVD) of TiCl4 on Al-MCM-41 at low reaction temperature (423 K). The sample was characterized by X-ray diffraction (XRD), N2 adsorption/desorption, high resolution transmission electron microscopy (HRTEM) and diffuse reflectance ultraviolet-visible spectroscopy (DR UV-vis). The results showed that Ti atoms were in tetrahedral coordinated in the framework of Al-MCM-41. Meanwhile, higher Ti4+ ions coordination and bulk anatase titania was observed in the DR UV-vis spectra. TAM still exhibited hexagonal p6m pore architectures, large specific surface area and narrow pore distribution. Catalytic activity of TAM for polystyrene (PS) pyrolysis has been investigated. The results showed that TAM exhibited high activity for the PS pyrolysis and good selectivity to liquid hydrocarbons of C5-C12 hydrocarbons.


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