Novel Design of MOCVD Reactor with Three Radial Inward Flows for Epitaxial Growth of GaN Thin Films

2011 ◽  
Vol 308-310 ◽  
pp. 1037-1040
Author(s):  
Liao Qiao Yang ◽  
Jian Zheng Hu ◽  
Zun Miao Chen ◽  
Jian Hua Zhang ◽  
Alan G. Li
Keyword(s):  
Gas Flow ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Operating Pressure ◽  
Axisymmetric Mode ◽  
Mocvd Reactor ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
D Model

In this paper, a novel super large metal organic chemical vapor deposition (MOCVD) reactor with three inlets located on the periphery of reactor was proposed and numerical evaluation of growth conditions for GaN thin film was characterized. In this design, the converging effects of gas flow in the radial direction could counterbalance the dissipation of metal organics source. CFD was used for the mathematical solution of the fluid flow, temperature and concentration fields. A 2-D model utilizing axisymmetric mode to simulate the gas flow in a MOCVD has been developed. The growth of GaN films using TMGa as a precursor, hydrogen as carrier gas was investigated. The effects of flow rates, mass fraction of various species, operating pressure, and gravity were analyzed and discussed, respectively. The numerical simulation results show all the fields distributions were in an acceptable range.

Metal Organic Chemical Vapor Deposition of Zinc Oxide

2005 ◽  
Vol 892 ◽  
Author(s):  
William E. Fenwick ◽  
Vincent T. Woods ◽  
Ming Pan ◽  
Nola Li ◽  
Matthew H. Kane ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Gas Flow ◽  
Growth Parameters ◽  
Chemical Vapor ◽  
Optimal Growth ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

AbstractThin films of ZnO were grown by metal organic chemical vapor deposition (MOCVD) in a vertical injection rotating disk reactor (RDR) system on sapphire substrates. Kinetics of ZnO growth by MOCVD were studied and an optimal growth window for a RDR tool was determined. Experimental growth conditions were chosen based on calculations of Reynolds Number (Re) and mixed convection parameter in order to select a growth window with stable gas flow and uniform heat transfer. Growth parameters were systemically varied within this window to determine the optimal growth conditions for this MOCVD tool and to study how these parameters affect film growth and quality. Properties of ZnNiO films grown by MOCVD were also studied to determine the effects of Ni incorporation on structural, optical, and magnetic properties.

Copper Films Prepared by Metal Organic Chemical Vapor Deposition (MOCVD) Process Using Copper (Acetylacetonate) and Water Vapor as Reactants: The Impact of Water Vapor

1992 ◽  
Vol 282 ◽  
Author(s):  
Yu-Neng Chang
Keyword(s):  
Water Vapor ◽  
Partial Pressure ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Gas Flow Rate ◽  
Cu Films ◽  
Metal Organic ◽  
Carrier Gas Flow ◽  
Organic Chemical Vapor Deposition

ABSTRACTBy using the strong reductive potential of copper acetylacetone (Cu(acac)2) when Cu(acac)2) was thermally decomposed, copper metal films were prepared by metal organic chemical vapor deposition (MOCVD) process using sublimed Cu(acac)2 vapor and water vapor as reactants, at one atmosphere pressure. According to thermodynamic calculations, Cu films could be prepared by MOCVD process with a high ratio of partial pressures for water vapor and Cu(acac)2 vapor (PH2O/Pcu(acac)2>30) In this paper, the impacts of MOCVD processing parameters such as watervapor partial pressure, total carrier gas flow rate, and precursor partial pressure on film composition and microstructure were investigated. Deposition temperature is the primary processing parameter affecting film stoichiometry. In a specific deposition temperature window, from 370°C to 400°C, polycrystalline Cu films with Cu [111] preferential orientation were deposited. ER and XRD results indicated that films deposited at temperature lower than 350°C contain copper oxide phase with poor crystal structure. By comparing the values of X-ray Auger Electron Spectroscopy (XAES) and Auger parameter (αAu) from photoelectrons of Cu films and standards from reference compounds, die principle oxidation state of copper in these films was determined as Cu(0). The deposition results indicated that a water vapor partial pressure above 10 torr is necessary to produce Cu films. As indicated by SEM, Increasing the carrier gas flow rate, above 600 sccm, can reduce the average temperature profile in the thermal boundary layer above the substrate surface, retard the gas phase reaction rate, presumably eliminate the homogeneous nucleation, and deposit smooth Cu films.

scholarly journals The Optimization of Interfaces in InAsSb/InGaAs Strained-Layer Superlattices grown by Metal-Organic Chemical Vapor Deposition

1994 ◽  
Vol 340 ◽  
Author(s):  
R. M. Biefeld ◽  
K. C. Baucom ◽  
S. R. Kurtz
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Interface Layer ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Strained Layer ◽  
Strained Layer Superlattice ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

ABSTRACTWe have prepared InAsSb/InGaAs strained-layer superlattice (SLS) semiconductors by metal-organic chemical vapor deposition (MOCVD) using a variety of growth conditions. The presence of an InGaAsSb interface layer is indicated by the x-ray diffraction patterns. The optimized growth conditions involved the use of low pressure, short purge times between the growth of the layers, and no reactant flow during the purges. We used MOCVD to prepare an optically pumped, single heterostructure InAsSb/InGaAs SLS / InPSb laser which emitted at 3.9 μm with a maximum operating temperature of approximately 100 K.

RuO2 films by metal-organic chemical vapor deposition

1993 ◽  
Vol 8 (10) ◽  
pp. 2644-2648 ◽  
Author(s):  
Jie Si ◽  
Seshu B. Desu
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Film Structure ◽  
Organic Chemical ◽  
Dilute Gas ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Pure and conducting RuO2 thin films were successfully deposited on Si, SiO2/Si, and quartz substrates at temperatures as low as 550 °C by a hot wall metal-organic chemical vapor deposition (MOCVD). Bis(cyclopentadienyl)ruthenium, Ru(C5H5)2, was used as the precursor. An optimized MOCVD process for conducting RuO2 thin films was established. Film structure was dependent on MOCVD process parameters such as bubbler temperature, dilute gas flow rates, deposition temperature, and total pressure. Either pure RuO2, pure Ru, or a RuO2 + Ru mixture was obtained under different deposition conditions. As-deposited pure RuO2 films were specular, crack-free, and well adhered on the substrates. The Auger electron spectroscopy depth profile showed good composition uniformity across the bulk of the films. The MOCVD RuO2 thin films exhibited a resistivity as low as 60 μω-cm. In addition, the reflectance of RuO2 in the NIR region had a metallic character.

Thin films for superconducting electronics: Precursor performance issues, deposition mechanisms, and superconducting phase formation-processing strategies in the growth of Tl2Ba2CaCu2O8 films by metal-organic chemical vapor deposition

1997 ◽  
Vol 12 (5) ◽  
pp. 1214-1236 ◽  
Author(s):  
Bruce J. Hinds ◽  
Richard J. McNeely ◽  
Daniel B. Studebaker ◽  
Tobin J. Marks ◽  
Timothy P. Hogan ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Pressure ◽  
Vapor Deposition ◽  
Film Growth ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition

Epitaxial Tl2Ba2CaCu2O8 thin films with excellent electrical transport characteristics are grown in a two-step process involving metal-organic chemical vapor deposition (MOCVD) of a BaCaCuO(F) thin film followed by a postanneal in the presence of Tl2O vapor. Vapor pressure characteristics of the recently developed liquid metal-organic precursors Ba(hfa)2 • mep (hfa = hexafluoroacetylacetonate, mep = methylethylpentaglyme), Ca(hfa)2 • tet (tet = tetraglyme), and the solid precursor Cu(dpm)2 (dpm = dipivaloylmethanate) are characterized by low pressure thermogravimetric analysis. Under typical film growth conditions, transport is shown to be diffusion limited. The transport rate of Ba(hfa)2 • mep is demonstrated to be stable for over 85 h at typical MOCVD temperatures (120 °C). In contrast, the vapor pressure stability of the commonly used Ba precursor, Ba(dpm)2, deteriorates rapidly at typical growth temperatures, and the decrease in vapor pressure is approximately exponential with a half-life of ∼9.4 h. These precursors are employed in a low pressure (5 Torr) horizontal, hot-wall, film growth reactor for growth of BaCaCuO(F) thin films on (110) LaAlO3 substrates. From the dependence of film deposition rate on substrate temperature and precursor partial pressure, the kinetics of deposition are shown to be mass-transport limited over the temperature range 350–650 °C at a 20 nm/min deposition rate. A ligand exchange process which yields volatile Cu(hfa)2 and Cu(hfa) (dpm) is also observed under film growth conditions. The MOCVD-derived BaCaCuO(F) films are postannealed in the presence of bulk Tl2Ba2CaCu2O8 at temperatures of 720–890 °C in flowing atmospheres ranging from 0–100% O2. The resulting Tl2Ba2CaCu2O8 films are shown to be epitaxial by x-ray diffraction and transmission electron microscopic (TEM) analysis with the c-axis normal to the substrate surface, with in-plane alignment, and with abrupt film-substrate interfaces. The best films exhibit a Tc = 105 K, transport-measured Jc= 1.2 × 105 A/cm2 at 77 K, and surface resistances as low as 0.4 mΩ (40 K, 10 GHz).

scholarly journals Highly Conductive n-Al0.65Ga0.35N Grown by MOCVD Using Low V/III Ratio

Crystals ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1006
Author(s):  
Christian J. Zollner ◽  
Yifan Yao ◽  
Michael Wang ◽  
Feng Wu ◽  
Michael Iza ◽  
...  
Keyword(s):  
Electron Concentration ◽  
Ohmic Contacts ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Operating Voltage ◽  
Metal Organic ◽  
Silicon Doped ◽  
Uv Leds ◽  
Organic Chemical Vapor Deposition

Highly conductive silicon-doped AlGaN and ohmic contacts are needed for deep-UV LEDs and ultrawide bandgap electronics. We demonstrate improved n-Al0.65Ga0.35N films grown by metal–organic chemical vapor deposition (MOCVD) on sapphire substrates using a low V/III ratio (V/III = 10). A reduced V/III ratio improves repeatability and uniformity by allowing a wider range of silicon precursor flow conditions. AlxGa1−xN:Si with x > 0.5 typically has an electron concentration vs. silicon concentration trend that peaks at a particular “knee” value before dropping sharply as [Si] continues to increase (self-compensation). The Al0.65Ga0.35N:Si grown under the lowest V/III conditions in this study does not show the typical knee behavior, and instead, it has a flat electron concentration trend for [Si] > 3 × 1019 cm−3. Resistivities as low as 4 mΩ-cm were achieved, with corresponding electron mobility of 40 cm2/Vs. AFM and TEM confirm that surface morphology and dislocation density are not degraded by these growth conditions. Furthermore, we report vanadium-based ohmic contacts with a resistivity of 7 × 10−5 Ω-cm2 to AlGaN films grown using a low V/III ratio. Lastly, we use these highly conductive silicon-doped layers to demonstrate a 284 nm UV LED with an operating voltage of 7.99 V at 20 A/cm2, with peak EQE and WPE of 3.5% and 2.7%, respectively.

MOCVD Growth of Ga(Al)N/InGaN/Ga(Al)N-Heterostructures: Influence of the Buffer Layer Al-Concentration and Growth Duration on the In-Incorporation in InGaN

2001 ◽  
Vol 680 ◽  
Author(s):  
Marco Schowalter ◽  
Brigitte Neubauer ◽  
Andreas Rosenauer ◽  
Dagmar Gerthsen ◽  
Oliver Schön ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Growth Conditions ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Growth Duration ◽  
Mocvd Growth ◽  
Transmission Electron ◽  
Metal Organic ◽  
Composition Fluctuations ◽  
Organic Chemical Vapor Deposition

ABSTRACTTransmission electron microscopy (TEM) has been applied to analyze the thickness and the In-concentration of InGaN layers in GaN/InGaN/GaN- and AlGaN/InGaN/AlGaN-quantum well (QW) structures. Two series of samples were grown by metal organic chemical vapor deposition varying either only the growth duration for the InGaN QW or by changing the Al- concentration in the buffer layers at unaltered InGaN growth conditions. A rising average In- concentration from 6.5 to 15.4 % and a decreasing growth rate are observed with increasing growth duration. The increase of the Al-concentration in the buffer layers from 0 to 36 % strongly affects the In-incorporation during the InGaN growth, which decreases from 17.5 to 2.5 %. All samples are characterized by an inhomogeneous In-distribution containing In-rich agglomerates with a size of only a few nanometers and less pronounced composition fluctuations on a scale of 100 nm.

Numerical Analysis on the Development of the Large-Scale Showerhead for Depositing AlGaInN Films

2013 ◽  
Author(s):  
Chulsoo Byun ◽  
Dae Hyeon Kim ◽  
Kang Woo Joo ◽  
Kwang-Sun Kim
Keyword(s):  
Large Scale ◽  
High Reliability ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Cfd Analysis ◽  
Mocvd Reactor ◽  
Process Gas ◽  
Metal Organic ◽  
Process Gases ◽  
Organic Chemical Vapor Deposition

The metal organic chemical vapor deposition (MOCVD) process is widely used to form a multi-layered structure with thin films for diverse semiconductor materials. The MOCVD process is the most promising method for manufacturing chips that are based on the compound semiconductor, but its technology is partly still insufficient. If a device, for example, lacks a non-uniformity related to the composition and thickness of the film, it decreases the reliability of the final product and affects the economics. To ensure that the equipment is competitive in the worldwide markets, a high reliability including the controllability of compositions is required for the equipment. In this study the CFD analysis was used to investigate the behavior of the process gas in a MOCVD reactor where the process gases including the component of the GaN films are injected as separated through a multi-module showerhead for eventually targeting multi-component films such as AlGaInN materials. After applying of Porous Media, a stabilization of process gas was confirmed from the results of pressure distribution.

Dependence on MOCVD Growth Temperature of The Photoluminescence Properties of ZnSe, ZnTe, and ZnSe(1-x)Te(x) Alloys and ZnSe/ZnTe Superlattices

1992 ◽  
Vol 263 ◽  
Author(s):  
B.E. Ponga ◽  
J. Calas ◽  
M. Averous ◽  
T. Cloitre ◽  
O. Briot ◽  
...  
Keyword(s):  
Low Temperature ◽  
Chemical Vapor ◽  
Growth Conditions ◽  
Organic Chemical ◽  
Physical Situation ◽  
Temperature Growth ◽  
Mocvd Growth ◽  
Metal Organic ◽  
Organic Chemical Vapor Deposition ◽  
Ethyl Amine

ABSTRACTIt has been recently shown that high quality ZnSe and ZnTc filns can be grown on GaAs using low temperature growth techniques such as Metal-Organic Chemical Vapor Deposition ( MOCVD). All samples: ZnSe, ZnTe, ZnSc(l−x)Tc(x) epilayers and ZnSe/ZnTc superlattices were grown using a novel zinc precursor, the Tri-Ethyl-Amine Di-Methyl-Zinc, while we used the classical precursors H2Se and Di-Isopropyl-Tellurium for selenium and tellurium. Investigation of the photoluminescence (PL) properties of ZnSc and ZnTe single layers enabled us to optimize the growth conditions of these compounds. The crystal growth conditions for mixed alloys and superlattices were determined by direct comparison to the aspect of low-temperature PL features. Strong PL spectra were obtained from these materials, suggesting us that tellurium has the ability to behave like an iso-clectronic center. At low concentration of tellurium in ZnSe, an interesting physical situation is observed, which we have interpreted in terms of extrinsic exciton “self-trapping” mechanism.

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