Zn diffusion technology for InP-InGaAs avalanche photodiodes

This paper presents a study of Zn diffusion process into InP and InGaAs/InP epitaxial heterostructures grown by molecular beam epitaxy. It was found that both diffusion systems: a resistively heated quartz reactor with a solid-state Zn vapor source placed inside and hydrogen or nitrogen as the carrier gas and MOCVD reactor with hydrogen as the carrier gas allow achieving similar dopant concentration above 2*10e18 cm-3. The depth of the diffusion front in the InP layer is located from 2 to 3.5 μm depending on the temperature and time of the diffusion process. The diffusion of Zn into InP through the intermediate InGaAs layer provides better surface quality comparing with direct zinc diffusion into InP surface.

Parameter study of the high temperature MOCVD numerical model for AlN growth using orthogonal test design

We investigated the process parameters of the high temperature MOCVD (HT-MOCVD) numerical model for the AlN growth based on CFD simulation using orthogonal test design. It is believed that high temperature growth condition is favorable for improving efficiency and crystallization quality for AlN film, while the flow field in the HT-MOCVD reactor is closely related to the process parameters, which will affect the uniformity of the film. An independently developed conceptual HT-MOCVD reactor was established for the AlN growth to carry out the CFD simulation. To evaluate the role of the parameters systematically and efficiently on the growth uniformity, the process parameters based on CFD simulation were analyzed using orthogonal test design. The advantages of the range, matrix and variance methods were considered and the results were analyzed comprehensively and the optimal process parameters were obtained as follows, susceptor rotational speed 400 rpm, operating pressure 40 Torr, gas flow rate 50 slm, substrate temperature 1550 K.

Parameter Study of the High Temperature MOCVD Numerical Model for AlN Growth Using Orthogonal Test Design

We investigated the process parameters of the high temperature MOCVD (HT-MOCVD) numerical model for the AlN growth based on CFD simulation using orthogonal test design. It is believed that high temperature growth condition is favorable for improving efficiency and crystallization quality for AlN film, while the flow field in the HT-MOCVD reactor is closely related to the process parameters, which will affect the uniformity of the film. An independently developed conceptual HT-MOCVD reactor was established for the AlN growth to carry out the CFD simulation. To evaluate the role of the parameters systematically and efficiently on the growth uniformity, the process parameters based on CFD simulation were analyzed using orthogonal test design. The advantages of the range, matrix and variance methods were considered and the results were analyzed comprehensively and the optimal process parameters were obtained as follows, susceptor rotational speed 400 rpm, operating pressure 40 Torr, gas flow rate 50 slm, substrate temperature 1550 K.

ZrO2-Sm2O3 Layer Growth Using the MOCVD Method at Low Temperatures and Under Reduced Pressure

This work presents the results of structure, microstructure, and chemical composition investigations performed on ZrO2-Sm2O3 layers synthesized by MOCVD (metal-organic chemical vapor deposition) using Zr(tmhd)4 and Sm(tmhd)3 as reactants on quartz glass substrate. The molar percentage of Sm(tmhd)3 used to obtain the layers at both 500 and 550 °C was 14% and 22.75%, respectively. Synthesis parameters were selected so that the value of the extended criterion Grx/Rex2 (Gr—Grashof number, Re—Reynolds number, x—the distance from the gas inflow point to the CVD (MOCVD) reactor) could be maintained below 0.01. It was determined from XRD (X-ray diffraction) analyses that the layers deposited at 500 °C contained small amounts of a crystalline phase and the layers obtained at 550 °C contained greater amounts of the crystalline phase (solid solution). SEM (scanning electron microscope) observations have also shown that the crystalline phase is present in the layers synthesized at 500 °C, as well as at 550 °C. EDS (energy dispersive spectroscopy) studies have indicated that molar content of Sm2O3 in the crystalline phase is lower in comparison to the amount present in the respective amorphous phase. The larger the Sm2O3 content in the layer, the higher the growth rate.

A systematic study of MOCVD reactor conditions and Ga memory effect on properties of thick InAl(Ga)N layers: a complete depth-resolved investigation

Thick InAlN layers (In-molar fraction >0.37) on GaN buffer layers were prepared using a close-coupled showerhead metalorganic chemical vapor deposition (MOCVD) reactor.