Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules

This paper introduces a module using the RGB-based LED design to improve the thermal management of a mixied white light LED and describes a system for heat dissipation in illuminated, high-power LED arrays. Mixed light LEDs can be produced by combining appropriate amounts of light from the red, green and blue LEDs in an array. A LED cooling system, using a micro- tube water-cooling device, was fabricated. Recycling water in the system, gave more efficient convection and the heat created by the LEDs was easily removed, in the experiments. It was shown that micro-tube water-cooling systems rendered an improvement in thermal management that effectively decreases the thermal resistance and provides very good thermal dissipation. Furthermore, the results of experiment and simulation demonstrated that a micro-tube water-cooling system is very effective in heat dissipation in LEDs and the fabrication of practical micro-water tube cooling devices for mixing light LEDs was feasible and useful

Download Full-text

Thermal Performance of Domestic Replacement A19 LED Lighting Products

Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis ◽

10.1115/imece2016-67974 ◽

2016 ◽

Cited By ~ 2

Author(s):

Thomas Storey ◽

Robin Rackerby ◽

Heather Dillon ◽

Lydia Gingerich

Keyword(s):

Heat Exchanger ◽

Thermal Performance ◽

Heat Dissipation ◽

Cooling System ◽

Light Emitting Diode ◽

Research Process ◽

Light Emitting ◽

Led Lighting ◽

Proper Design ◽

The Cost

In an effort to create a Light Emitting Diode (LED) lighting system that is as efficient as possible, the heat dissipation system must be accurately measured for proper design and operation. Because LED lighting technology is new, little optimization has been performed on typical cooling system required for most A19 replacement products. This paper describes the research process for evaluating the thermal performance of over 15 LED lighting products and compares their performance to traditional lighting sources, namely incandescent and compact fluorescent (CFL). This process uses radiation and convection to model typical cooling mechanisms for domestic A19 type replacement LED products. The A19 products selected for this investigation had input wattages ranging between 7 to 60 Watts, with outputs ranging from 450 to 1100 lumens. The average LED tested dissipated 43% (± 5%) of the total heat generated in the lighting product through the heat exchanger. The best thermal performance was observed in an LED product that dissipated approximately 58% of the total product heat through the heat exchanger. Results indicate that significant improvements to the current LED heat exchanger designs are possible, which will help lower the cost of future LED products, improve performance, and reduce the environmental footprint of the products.

Download Full-text

High Power 325 Light Emitting Diode Arrays by Flip-Chip Packaging

MRS Proceedings ◽

10.1557/proc-743-l7.7 ◽

2002 ◽

Vol 743 ◽

Author(s):

Ashay Chitnis ◽

Maxim Shatalov ◽

Vinod Adivarahan ◽

Jian Ping Zhang ◽

Shuai Wu ◽

...

Keyword(s):

Thermal Management ◽

Flip Chip ◽

Heat Dissipation ◽

Light Emitting Diodes ◽

Light Emitting Diode ◽

Light Emitting ◽

Flip Chip Packaging ◽

Ultraviolet Light Emitting Diodes ◽

Emission Light

ABSTRACTWe report flip-chip 325 nm emission light emitting diodes over sapphire with dc powers as high as 0.84 mW at 180mA and pulse powers as high as 6.68 mW at 1A. These values to date are the highest reported powers for such short wavelength emitters. Our data shows the device output power under dc operation to be limited by the package heat dissipation. A study is presented to determine the role of thermal management in controlling the power output for the reported 325 nm ultraviolet light emitting diodes.

Download Full-text

Thermal Management for High Power Light-Emitting Diode Street Lamp

Volume 4: Electronics and Photonics ◽

10.1115/imece2010-38557 ◽

2010 ◽

Author(s):

M. Ying ◽

S. M. L. Nai ◽

P. Shi ◽

J. Wei ◽

C. K. Cheng ◽

...

Keyword(s):

Thermal Management ◽

Thermal Performance ◽

High Power ◽

Heat Dissipation ◽

Light Emitting Diode ◽

System Level ◽

Light Emitting ◽

High Power Led ◽

Street Lamp ◽

Lamp System

Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the LED chip temperature strongly affects the optical extraction and the reliability of the LED lamps, LED street lamp performance is heavily relied on a successful thermal management, especially when applications require LED street lamp to operate at high power and hash environment to obtain the desired brightness. As such, a well-designed thermal management, which can lower the LED chip operation temperature, becomes one of the necessities when developing LED street lamp system. The current study developed an effective heat dissipation method for the high power LED street lamp with the consideration of design for manufacturability. Different manufacturable structure designs were proposed for the high power street lamp. The thermal contact conductance between aluminum interfaces was measured in order to provide the system assembly guidelines. The module level thermal performance was also investigated with thermocouples. In addition, finite element (FE) models were established for the temperature simulation of both the module and lamp system. The coefficient of natural convection of the heat sink surface was determined by the correlation of the measurement and simulation results. The system level FE model was employed to optimize and verify the heat dissipation concepts numerically. An optimized structure design and prototype has shown that the high power LED street lamp system can meet the thermal performance requirements.

Download Full-text

A three-dimensional thermal analysis for cooling a square Light Emitting Diode by Multiwalled Carbon Nanotube-nanofluid-filled in a rectangular microchannel

Advances in Mechanical Engineering ◽

10.1177/16878140211059946 ◽

2021 ◽

Vol 13 (11) ◽

pp. 168781402110599

Author(s):

Mohamed Bechir Ben Hamida ◽

Mohammed A. Almeshaal ◽

Khalil Hajlaoui

Keyword(s):

Heat Sink ◽

Heat Dissipation ◽

Cooling System ◽

Light Emitting Diode ◽

Three Dimensional ◽

Junction Temperature ◽

Engine Oil ◽

Inlet Temperature ◽

Rectangular Microchannel ◽

Light Emitting

The aim of this paper is to ensure proper thermal management in order to remove and dissipate the heat produced by a square Light Emitting Diode (LED), as well as to ensure stable and safe operation by reducing the junction temperature. For this, we developed a three-dimensional code, time-dependent that solves the systems of equations for the mass, momentum, and energy using Comsol Multiphysics. After validation of this numerical 3D code, the thermal performance of a LED cooling system with three nanofluids such as MWCNT-Water, MWCNT-Ethylene Glycol, and MWCNT-Engine oil is studied numerically into account of aggregation effect. Several parameters such as: the power of the LED lamp, the inlet temperature and velocity of nanofluid, the length of the heat sink, and the length of the microchannel have been varied in order to find an optimal condition allowing a good heat dissipation from the LED chip to the heat sink. It was concluded that the use of MWCNT-Water in the microchannel is the best nanofluid that can cool the heat sink. In addition, the increase of velocity inlet of the coolant in the microchannel, the length of the heat sink, and the microchannel length while the decrease of the inlet temperature of nanofluid in the microchannel are an important factors allowing the decrease of the junction temperature of the square LED lamp.

Download Full-text