Research of Sapphire Wafer Scribing by Using UV Laser

The Processing advantages of UV laser were discussed in this paper. A series of experiments were carried out, some good results was achieved, which proved UV laser is fit for sapphire wafer processing. Then how processing parameters affects machining quality was discussed, which provides guidance to machining practice. The formation of grooves with good surface quality can be achieved by selecting appropriate laser parameters.

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Study on Semi-Fixed Abrasive Lapping of Ultra-Thin Silver Electrode Layer

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.69-70.225 ◽

2009 ◽

Vol 69-70 ◽

pp. 225-228

Author(s):

Xun Lv ◽

Ju Long Yuan

Keyword(s):

Surface Roughness ◽

Surface Quality ◽

High Efficiency ◽

Processing Parameters ◽

Silver Electrode ◽

Processing Load ◽

Electrode Layer ◽

Good Surface ◽

Good Surface Quality ◽

Ultra Precision

Silver electrode layer of piezoelectric ceramic transducer requires good surface quality and high efficiency. Efficiency of traditional lapping and polishing is very low. Ultra-precision grinding technology is also unsuitable for the thickness of workpiece is extremely thin. Semi bonded abrasive lapping is a new ultra-precision processing method. The new ultra-precise method can achieve good surface quality in short time, and removal stock of workpiece is small. In order to research the optimal technology of semi bonded abrasive lapping about silver electrode layer, this paper research several major processing parameters by experiments. The results show that appropriate processing load can obtain better surface roughness of silver electrode layer，and surface roughness of silver electrode layer has little change with different processing speed. By using ultra-fine semi bonded abrasive plate, 94.08KPa processing load and 40 rpm polishing speed, after 30 minutes, surface roughness of silver electrode layer is 11nm, and removal stock is 11.5μm.

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Lapping and Polishing of Sapphire Wafer with Fixed Abrasive Pad

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.1027.68 ◽

2014 ◽

Vol 1027 ◽

pp. 68-71 ◽

Cited By ~ 2

Author(s):

Jian Bin Wang ◽

Yong Wei Zhu ◽

Jun Xu ◽

Zhan Kui Wang ◽

Ji Hua Miao

Keyword(s):

Surface Roughness ◽

Surface Quality ◽

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Sapphire Wafer ◽

Good Surface ◽

Good Surface Quality ◽

Fixed Abrasive Pad ◽

Fixed Abrasive

The processing technology of sapphire with a high material removal rate a good surface quality is critical for its applications. The experiment of sapphire lapping and polishing was carried out by using three different fixed abrasive pad (FAP). Their material removal rate (MRR) and surface roughness (Ra) were measured and analyzed. Results indicate that a MRR of 5.6μm/min reaches in rough lapping and a MRR of 0.4μm/min in fine lapping. The average surface roughness Ra of rough lapping and fine lapping is 142nm and 1.2nm respectively. The processing efficiency of sapphire wafer is effectively improved and a good surface quality is obtained when FAP adopted.

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Thin Floor Milling Using Moving Support

10.21203/rs.3.rs-893942/v1 ◽

2021 ◽

Author(s):

Jixiong Fei ◽

Bin Lin ◽

Tian Huang ◽

Juliang Xiao

Keyword(s):

Surface Quality ◽

High Accuracy ◽

Experimental Results ◽

Back Surface ◽

Depth Of Cut ◽

Experimental Platform ◽

Good Surface ◽

Good Surface Quality ◽

Novel Approach ◽

Monolithic Structure

Abstract During milling the thin floor of a pocket which locates on a monolithic structure, it is very difficult to achieve high accuracy and good surface quality due to its low rigidity. In this paper, a novel approach is proposed to overcome the difficulties that encountered during milling of the thin floor. The method is realized by using small axial depth of cut but placing a moving support at the back surface of the thin floor during machining, in which the support will move with the cutter at the same velocity. An experimental platform is built to demonstrate the validation of the proposed method. The experimental results show that the proposed method can effectively improve the accuracy and surface quality during milling the thin floor of a pocket of the monolithic structure.

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Evaluation and improvement of material removal rate with good surface quality in TC4 blisk blade polishing process

Journal of Advanced Mechanical Design Systems and Manufacturing ◽

10.1299/jamdsm.2018jamdsm0083 ◽

2018 ◽

Vol 12 (4) ◽

pp. JAMDSM0083-JAMDSM0083 ◽

Cited By ~ 2

Author(s):

Zhen CHEN ◽

Yaoyao SHI ◽

Xiaojun LIN

Keyword(s):

Surface Quality ◽

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Polishing Process ◽

Good Surface ◽

Good Surface Quality ◽

Blisk Blade

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Multiobjective Optimization of Turning Cutting Parameters for J-Steel Material

Advances in Materials Science and Engineering ◽

10.1155/2016/6429160 ◽

2016 ◽

Vol 2016 ◽

pp. 1-8 ◽

Cited By ~ 9

Author(s):

Adel T. Abbas ◽

Karim Hamza ◽

Mohamed F. Aly ◽

Essam A. Al-Bahkali

Keyword(s):

Multiobjective Optimization ◽

Surface Quality ◽

Material Removal Rate ◽

Material Removal ◽

Removal Rate ◽

Cutting Parameters ◽

Trade Off ◽

Good Surface ◽

Good Surface Quality ◽

Steel Material

This paper presents a multiobjective optimization study of cutting parameters in turning operation for a heat-treated alloy steel material (J-Steel) with Vickers hardness in the range of HV 365–395 using uncoated, unlubricated Tungsten-Carbide tools. The primary aim is to identify proper settings of the cutting parameters (cutting speed, feed rate, and depth of cut) that lead to reasonable compromises between good surface quality and high material removal rate. Thorough exploration of the range of cutting parameters was conducted via a five-level full-factorial experimental matrix of samples and the Pareto trade-off frontier is identified. The trade-off among the objectives was observed to have a “knee” shape, in which certain settings for the cutting parameters can achieve both good surface quality and high material removal rate within certain limits. However, improving one of the objectives beyond these limits can only happen at the expense of a large compromise in the other objective. An alternative approach for identifying the trade-off frontier was also tested via multiobjective implementation of the Efficient Global Optimization (m-EGO) algorithm. The m-EGO algorithm was successful in identifying two points within the good range of the trade-off frontier with 36% fewer experimental samples.

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Modeling of Force on Axial Power Ultrasonic Honing

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.690-693.2470 ◽

2013 ◽

Vol 690-693 ◽

pp. 2470-2474

Author(s):

Zhen Liu ◽

Xi Jing Zhu ◽

Jin Qing Wang ◽

Yun Peng Shao

Keyword(s):

Surface Quality ◽

Material Removal ◽

Cylinder Liner ◽

Processing Parameters ◽

Force Model ◽

Physical Change ◽

Hard Materials ◽

Good Surface ◽

Engine Cylinder ◽

Power Ultrasonic

Ultrasonic vibration machining is a kind of effective method for precision processing of brittle-hard materials, especially it can obtain good surface quality in engine cylinder liner precision processing with the power ultrasonic honing. Based on the material removal mechanism of ultrasonic honing, a new ultrasonic honing force model was established, which included material chip deformation and friction situation between grains and workpiece. Therefore the effect to honing force can be known clearly with processing parameters and material physical change, which provided theory foundation to further study in ultrasonic mechanism and real time surface quality protection in honing process.

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The Experiment Research of Precision Grinding of Li-Ti Ferrite with Graphite Grinding Wheel

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.431-432.322 ◽

2010 ◽

Vol 431-432 ◽

pp. 322-325

Author(s):

Bei Zhang ◽

Hong Hua Su ◽

Hong Jun Xu ◽

Yu Can Fu

Keyword(s):

Surface Quality ◽

Material Removal ◽

Removal Rate ◽

High Surface ◽

Ground Surface ◽

Grinding Wheel ◽

Precision Grinding ◽

High Surface Quality ◽

Good Surface ◽

Good Surface Quality

Li-Ti ferrite used in aviation occasions needs good surface quality. In conventional grinding it is difficult to meet the surface demand. Accordingly, this paper proposed a new grinding process to change the situation. The process employed graphite grinding wheel which is always used in ultra-precision grinding of steel piece. The process can obtain good surface quality and ensure certain material removal rate. The ground surface appearance is nearly mirror-like. The lowest surface roughness of Ra value of the ground surface is 0.05μm in the experiment. The ground surface morphology is made up of spread glazed area and dispersed minute pits. The ductile regime dominates the material removal mechanism and no surface damage is induced in the process. In consideration of the results in the experiment it can be seen that grinding with graphite grinding wheel is a good finishing procedure in ferrite machining because of its obtained high surface quality.

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Nanofabrication of High-resolution and Nanofocusing X-ray Optics Based on Silicon and Diamond: Obstacles and Progress

MRS Proceedings ◽

10.1557/proc-1145-mm04-39 ◽

2008 ◽

Vol 1145 ◽

Cited By ~ 1

Author(s):

Abdel F. Isakovic ◽

K. Evans-Lutterodt ◽

A. Stein ◽

J. B. Warren ◽

S. Narayanan ◽

...

Keyword(s):

High Resolution ◽

Surface Quality ◽

Group Iv ◽

Ray Optics ◽

X Ray ◽

Good Surface ◽

Good Surface Quality ◽

Etching Parameters

AbstractNanofocusing, high-resolution X-ray optics demand good surface quality, the absence of tapered sidewalls, and a depth reaching into tens, sometimes hundreds of microns, all requirements that must be satisfied over large areas. In this report, we discuss our motivation for choosing group IV materials (predominantly Si, and C in its diamond form) for nanofocusing and high resolution in the hard X-ray portion of the spectrum. We elaborate on the design and nanofabrication procedures, and detail the etching parameters that offer a path for overcoming obstacles in making better optics. We briefly review tests for the assessing the quality of the optics.

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Experimental Study of Low-Pressure Water Jet Assisted Laser Processing of Al2O3 Ceramic

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.652-654.2363 ◽

2013 ◽

Vol 652-654 ◽

pp. 2363-2368

Author(s):

Jin Hua Wang ◽

Gen Fu Yuan

Keyword(s):

Surface Quality ◽

Laser Processing ◽

Thermal Deformation ◽

Low Pressure ◽

Processing Parameters ◽

Water Jet ◽

Good Surface ◽

Hard And Brittle Material ◽

Pressure Water

Recast layer, micro cracks and thermal deformation limited the improvement of the surface quality of laser processing in precision machining of hard and brittle material. This paper presents a new method which combines low-pressure water jet with laser processing. A comprehensive study on the influence of laser processing parameters on surface quality of an Al2O3 ceramic sheet is presented. The experiment was conducted using ND: YAG laser machine and low-pressure water jet was used as assist. The surface quality of normal laser processing and low-pressure water jet assisted laser processing was comparative analyzed using a 3-D microscopy. Experiment proves that the composite processing of low-pressure water jet assisted laser processing can obtain good surface quality, slight moltenslag and thermal deformation, compared with the normal laser processing.

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