Thermophysical Properties of Molybdenum Copper Multilayer Composites for Thermal Management Applications
The key properties of materials used for thermal management in electronics are thermal conductivity and the coefficient of thermal expansion. These properties can be tailored by stacking molybdenum and copper layers. Here, molybdenum copper multilayer composites with varying copper content, from 63 to 88 wt%, have been investigated. It is demonstrated, that thermal conductivity and coefficient of thermal expansion, can be adjusted by the copper content. Two flash methods for measuring the thermal conductivity are compared and the validity of the results is discussed since measurements on thin materials with strong anisotropy require a certain setup of the measurement device. For the studied compositions the thermal conductivity was determined to be between 220 to 270 W/m/K and the coefficient of thermal expansion between 6.1 to 11.5 ppm/K.