Fabrication and Properties of Copper/Carbon Composites for Thermal Management Applications

2008 ◽  
Vol 59 ◽  
pp. 169-172 ◽  
Author(s):  
Thomas Schubert ◽  
T. Weißgärber ◽  
Bernd Kieback
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Carbon Composites ◽  
Powder Mixing ◽  
Heat Spreader ◽  
Interfacial Behaviour ◽  
The Ideal

The ideal thermal management material working as heat sink and heat spreader should have a high thermal conductivity combined with a reduced and tailorable thermal expansion. To meet these market demands copper composites reinforced with diamond particles were fabricated by a powder metallurgical method (powder mixing with subsequent pressure assisted consolidation). In order to design the interfacial behaviour between copper and the reinforcement different alloying elements, chromium or boron, were added to the copper matrix. The produced composites exhibit a thermal conductivity up to 700 W/mK combined with a coefficient of thermal expansion (CTE) of 7-8 x 10-6/K. The copper composites with good interfacial bonding show only small decrease in thermal conductivity and a relatively stable CTE after the thermal cycling test.

The Thermal Expansion Behaviors of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 237-240
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
Mohd Mustafa Al Bakri Abdullah
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Matrix ◽  
Experimental Results ◽  
High Thermal Conductivity ◽  
Coating Process ◽  
Electroless Coating

The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.

Thermophysical Properties of Molybdenum Copper Multilayer Composites for Thermal Management Applications

2015 ◽  
Vol 825-826 ◽  
pp. 297-304 ◽  
Author(s):  
Martin Seiss ◽  
Tobias Mrotzek ◽  
Norbert Dreer ◽  
Wolfram Knabl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Content ◽  
Coefficient Of Thermal Expansion ◽  
Strong Anisotropy ◽  
Multilayer Composites ◽  
Properties Of Materials ◽  
Materials Used

The key properties of materials used for thermal management in electronics are thermal conductivity and the coefficient of thermal expansion. These properties can be tailored by stacking molybdenum and copper layers. Here, molybdenum copper multilayer composites with varying copper content, from 63 to 88 wt%, have been investigated. It is demonstrated, that thermal conductivity and coefficient of thermal expansion, can be adjusted by the copper content. Two flash methods for measuring the thermal conductivity are compared and the validity of the results is discussed since measurements on thin materials with strong anisotropy require a certain setup of the measurement device. For the studied compositions the thermal conductivity was determined to be between 220 to 270 W/m/K and the coefficient of thermal expansion between 6.1 to 11.5 ppm/K.

The Influences of Cu-Coated SiCp on the Porosity and Thermal Expansion Behavior of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 241-244
Author(s):  
K. Azmi ◽  
M.I.M. Tajuddin ◽  
A. Azida
Keyword(s):  
Thermal Expansion ◽  
Thermal Management ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Electroless Coating ◽  
Expansion Behavior ◽  
Significant Difference ◽  
Powder Metallurgy Methods

The widespread use of metal matrix composites as the packaging materials is due to their tailorable thermal conductivity and coefficient of thermal expansion (CTE). For the same reason, silicon carbide reinforced copper matrix (Cu-SiCp) composites are highly rated as thermal management materials in the electronic packaging applications. However, the Cu-SiCp composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the presence of porosity in the interface of copper matrix and the SiCp reinforcement. In order to improve the bonding between the two constituents, the SiCp were coated with copper via electroless coating process. Based on the experimental results, the CTE values of the copper coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the composites tend to decrease as the porosity increases. The significant difference in the CTE values was related to the presence of sub-micron gap between the copper matrix and the SiCp reinforcement.

Evaluation of CeSZ Thermal Barrier Coatings for Diesels

2000 ◽  
Author(s):  
P.J. Huang ◽  
J.J. Swab ◽  
P.J. Patel ◽  
W.S. Chu
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Barrier Coatings ◽  
Coefficient Of Thermal Expansion ◽  
Fuel Efficiency ◽  
Atmospheric Plasma ◽  
Thermal Barrier ◽  
Mechanical And Thermal Properties ◽  
Barrier Coatings ◽  
Spray Process

Abstract The development of thermal barrier coatings (TBCs) for diesel engines has been driven by the potential improvements in engine power and fuel efficiency that TBCs represent. TBCs have been employed for many years to reduce corrosion of valves and pistons because of their high temperature durability and thermal insulative properties. There are research programs to improve TBCs wear resistance to allow for its use in tribologically intensive areas of the engine. This paper will present results from tribological tests of ceria stabilized zirconia (CeSZ). The CeSZ was applied by atmospheric plasma spray process. Various mechanical and thermal properties were measured including wear, coefficient of thermal expansion, thermal conductivity, and microhardness. The results show the potential use of CeSZ in wear sensitive applications in diesel applications. Keywords: Thermal Barrier Coating, Diesel Engine, Wear, Thermal Conductivity, and Thermal Expansion

Adaptive Thermal Conductivity Metamaterials: Enabling Active and Passive Thermal Control

2018 ◽  
Vol 10 (5) ◽  
Author(s):  
Austin A. Phoenix ◽  
Evan Wilson
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Passive Control ◽  
Coefficient Of Thermal Expansion ◽  
Thermal Strain ◽  
Thermal Control ◽  
Variable Thermal Conductivity ◽  
Highly Nonlinear ◽  
Wide Range ◽  
Nonlinear Thermal Conductivity

The novel adaptive thermal metamaterial developed in this paper provides a unique thermal management capability that can address the needs of future spacecraft. While advances in metamaterials have provided the ability to generate materials with a broad range of material properties, relatively little advancement has been made in the development of adaptive metamaterials. This metamaterial concept enables the development of materials with a highly nonlinear thermal conductivity as a function of temperature. Through enabling active or passive control of the metamaterials bulk effective thermal conductivity, this metamaterial that can improve the spacecraft's thermal management systems performance. This variable thermal conductivity is achieved through induced contact that results in changes in the F path length and the conductive path area. The contact can be generated internally using thermal strain from shape memory alloys, bimetal springs, and mismatches in coefficient of thermal expansion (CTE) or it can be generated externally using applied mechanical loading. The metamaterial can actively control the temperature of an interface by dynamically changing the bulk thermal conductivity controlling the instantaneous heat flux through the metamaterial. The design of thermal stability regions (regions of constant thermal conductivity versus temperature) into the nonlinear thermal conductivity as a function of temperature can provide passive thermal control. While this concept can be used in a wide range of applications, this paper focuses on the development of a metamaterial that achieves highly nonlinear thermal conductivity as a function of temperature to enable passive thermal control of spacecraft systems on orbit.

Mechanical Properties of Microscale Graphitic Carbon Foam Ligaments and Nodes

2009 ◽  
Author(s):  
S. Ganguli ◽  
A. K. Roy ◽  
R. Wheeler
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Thermal Protection ◽  
Solid Phase ◽  
Coefficient Of Thermal Expansion ◽  
Carbon Foam ◽  
High Thermal Conductivity ◽  
Uniform Size ◽  
Open Cell ◽  
Carbon Foams

Carbon foam is recognized as having the greatest potential to replacement for metal fins in thermal management systems such as heat exchangers, space radiators, and thermal protection systems [1–5]. Carbon foam refers to a broad class of materials that include reticulated glassy, carbon and graphitic foams that are generally open-cell or mostly open-cell. They can be tailored to have low or high thermal conductivity with a low coefficient of thermal expansion and density. These foams have high modulus but low compression and tensile strength. Among the carbon foams, the graphitic foam offers superior thermal management properties such as high thermal conductivity. Graphitic foams are made of a network of spheroidal shell segments. Each cell has thin, stretched ligaments in the walls that are joined at the nodes or junctions. The parallel arrangement of graphene planes in the ligaments confers highly anisotropic properties to the walls of the graphitic foams. The graphene planes tend to be oriented with the plane of the ligaments but become disrupted at the junctions (nodes) of the walls. Since conduction is highest along parallel graphene planes, the thermal conductivity is highest in the plane of the ligaments or struts, and much lower in the direction transverse to the plane of these ligaments. In a previous study [6] extensive mechanical and thermal property characterization of carbon foams from Kopper Inc. (L1) and POCO Graphite, Inc. (P1) were reported. These foams were graphitic ones that are expected to have high thermal conductivity. Figure 1 shows sections of light microscopy images of the three foams of four foams. The most important thing to notice is that the images were not at the same magnification. The large cells in the GrafTech foam have an average diameter of only ∼100 μm but have a bimodal distribution cells with many small closed-cells few micrometers in diameter. Changes in density in the GrafTech foam was accompanied by a change in the large cells’ diameter — larger diameter giving greater porosity and lower density without changing the smaller cells’ sizes that filled the solid phase between the larger bubbles. The POCO foam has a fairly uniform size cell distribution of a few hundred micrometers. The Koppers’ foams show larger cells yet with the left (“L” precursor) having a uniform size while the right-hand (“D” precursor) is a less uniform and lower porosity.

scholarly journals A Comprehensive Review on Theoretical Aspects of Nanofluids: Exact Solutions and Analysis

Symmetry ◽  
2020 ◽  
Vol 12 (5) ◽  
pp. 725 ◽  
Author(s):  
Nadeem Ahmad Sheikh ◽  
Dennis Ling Chuan Ching ◽  
Ilyas Khan
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Exact Solutions ◽  
Transfer Rate ◽  
Coefficient Of Thermal Expansion ◽  
Literature Survey ◽  
Heat Transfer Characteristics ◽  
Hybrid Nanofluids ◽  
Mass Expansion

In the present era, nanofluids are one of the most important and hot issue for scientists, physicists, and mathematicians. Nanofluids have many important and updated characteristics compared to conventional fluids. The thermal conductivity, thermal expansion, and the heat transfer rate of conventional fluids are not up to the mark for industrial and experimental uses. To overcome these deficiencies, nanoparticles have been dispersed into base fluids to make them more efficient. The heat transfer characteristics through symmetry trapezoidal-corrugated channels can be enhanced using nanofluids. In the present article, a literature survey has been presented for different models of nanofluids and their solutions—particularly, exact solutions. The models for hybrid nanofluids were also mentioned in the present study. Furthermore, some important and most used models for the viscosity, density, coefficient of thermal expansion, coefficient of mass expansion, heat capacitance, electrical conductivity, and thermal conductivity are also presented in tabular form. Moreover, some future suggestions are also provided in this article.

Diamond/Al metal matrix composites formed by the pressureless metal infiltration process

1993 ◽  
Vol 8 (5) ◽  
pp. 1169-1173 ◽  
Author(s):  
William B. Johnson ◽  
B. Sonuparlak
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Metal Matrix Composites ◽  
Metal Matrix ◽  
Coefficient Of Thermal Expansion ◽  
Matrix Composites ◽  
Infiltration Process ◽  
Point Bend ◽  
Aluminum Metal Matrix Composites ◽  
Metal Infiltration

Diamond particles are unique fillers for metal matrix composites because of their extremely high modulus, high thermal conductivity, and low coefficient of thermal expansion. Diamond reinforced aluminum metal matrix composites were prepared using a pressureless metal infiltration process. The diamond particulates are coated with SiC prior to infiltration to prevent the formation of Al4C3, which is a product of the reaction between aluminum and diamond. The measured thermal conductivity of these initial diamond/Al metal matrix composites is as high as 259 W/m-K. The effects of coating thickness on the physical properties of the diamond/Al metal matrix composite, including Young's modulus, 4-point bend strength, coefficient of thermal expansion, and thermal conductivity, are presented.

Friction and Wearing Behaviour of Sintered Composites Made from Copper Mixed with Carbon Fibers

2015 ◽  
Vol 660 ◽  
pp. 81-85 ◽  
Author(s):  
Radu Caliman
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Composite Materials ◽  
Friction Coefficient ◽  
Carbon Fiber ◽  
Carbon Fibers ◽  
Coefficient Of Thermal Expansion ◽  
Density Ratio ◽  
Point Of View ◽  
Short Carbon

This paper presents a study regarding friction and wear comportment of sintered composite materials obtained by mixture of copper with short carbon fibers. Sintered composites are gaining importance because the reinforcement serves to reduce the coefficient of thermal expansion and increase the strength and modulus. In case of composites form by carbon fiber and copper, the thermal conductivity can also be enhanced. The combination of low thermal expansion and high thermal conductivity makes them very attractive for electronic packaging. Besides good thermal properties, their low density makes them particularly desirable for aerospace electronics and orbiting space structures. Compared to the metal itself, a carbon fiber-copper composite is characterized by a higher strength-to-density ratio, a higher modulus-to-density ratio, better fatigue resistance, better high-temperature mechanical properties and better wear resistance. Varying the percentage of short carbon fibers from 7,8% to 2,4%, and the percentage of copper from 92,2% to 97,6%, five dissimilar composite materials have been made and tested from the wear point of view. Friction tests are carried out, at room temperature, in dry conditions, on a pin-on-disc machine. The friction coefficient was measured using abrasive discs made from steel 4340 having the average hardness of 40 HRC, and sliding velocity of 0,6 m/sec. The primary goal of this study work it was to distinguish a mixture of materials with enhanced friction and wearing behaviour. The load applied on the specimen during the tests, is playing a very important role regarding friction coefficient and also the wearing speed.

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