Mechanical Analysis of the Energy Cycling Control for Further Smart Grid

2013 ◽  
Vol 804 ◽  
pp. 378-382
Author(s):  
Bing Qi ◽  
Hong Wei Xie ◽  
Li Kun Zhang ◽  
Li Li Wang ◽  
Song Song Chen
Keyword(s):  
Power Distribution ◽  
Heat Dissipation ◽  
Cooling System ◽  
Electronic Devices ◽  
Mechanical Analysis ◽  
Device Performance ◽  
Distribution Analysis ◽  
Power Electronic ◽  
Energy Cycle ◽  
Full Utilization

Power electronic devices always consume a lot of energy, and this energy is then converted into heat, so that the device temperature rises. It will not only affect the device performance in full cycling, but also may result in damage, if the problem of heat dissipation can not be solved. In this paper, we propose an energy cycle approach that can provide a full utilization of the reused energy from the expansion tank to distributed pump. The Power distribution analysis of the controlling cabinet is presented together with the component in power cabinet. With the capacity of power electronic devices and power levels increasing rapidly, the thermal performance of the cooling system can be improved and higher requirements can be obtained.

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

2003 ◽  
Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Thermal Conditions ◽  
Simulation Software ◽  
Operating Conditions ◽  
Power Electronic ◽  
Stress Concentrations ◽  
Multiphysics Simulation ◽  
Multiphysics Simulations

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.

Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

2020 ◽  
Vol 142 (2) ◽  
Author(s):  
Patrick Gaiser ◽  
Markus Klingler ◽  
Jürgen Wilde
Keyword(s):  
Fatigue Fracture ◽  
Crack Detection ◽  
Experimental Validation ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Power Device ◽  
Power Electronic ◽  
Fem Simulations ◽  
Detection Techniques ◽  
Lifetime Model

Abstract Direct bonded copper (DBC) alumina (Al2O3) substrates are used in power electronic devices in order to transfer the heat from semiconductor devices to the heat sink and to carry high electric currents. Fatigue-induced cracks in the ceramic result in a diminished heat dissipation, leading to failure of a power device. Hence, a lifetime model concerning this failure mode is necessary. In this paper, a new lifetime model including crack initiation as well as crack propagation for the fatigue fracture of Al2O3-based DBC substrates is presented. It is based on experimental crack detection techniques and finite element method (FEM) simulations including fracture mechanics. For the validation of the lifetime model, experiments are presented which show that by appropriate design of the copper edge, the lifetime of the substrates is increased substantially.

scholarly journals A multi-channel cooling system for multiple heat source

2016 ◽  
Vol 20 (6) ◽  
pp. 1991-2000 ◽  
Author(s):  
Shanglong Xu ◽  
Weijie Wang ◽  
Zongkun Guo ◽  
Xinglong Hu ◽  
Wei Guo
Keyword(s):  
Heat Sink ◽  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Heat Removal ◽  
Heat Sources ◽  
Power Electronic ◽  
Require Temperature ◽  
Computer Controlled ◽  
Temperature And Pressure

High-power electronic devices with multiple heating elements often require temperature uniformity and operating within their functional temperature range for optimal performance. A multi-channel cooling experiment apparatus is developed for studying heat removal inside an electronic device with multiple heat sources. It mainly consists of a computer-controlled pump, a multi-channel heat sink for multi-zone cooling and the apparatus for measuring the temperature and pressure drop. The experimental results show the system and the designed multi-channel heat sink structure can control temperature distribution of electronic device with multiple heat sources by altering coolant flow rate.

Research on Performance Contrast between SiC MOSFET and Si IGBT Based on the Converter of Urban Rail Vehicles

2019 ◽  
Vol 954 ◽  
pp. 188-193
Author(s):  
Wei Jie Li ◽  
Dong Yi Meng ◽  
Yu Jie Chang ◽  
Chun Yang ◽  
Yi Lv ◽  
...  
Keyword(s):  
Power Density ◽  
Power Converters ◽  
Electronic Devices ◽  
Switching Frequency ◽  
Device Performance ◽  
Power Electronic ◽  
Rail Vehicles ◽  
Urban Rail ◽  
Frequency Power

Power electronic devices are the basis of power converters, and excellent device performance improves that of power converters directly. In this paper we take SiC MOSFET CAS120M12BM2 (1200V/ 120A) and Si IGBT FF150R12KE3G (1200V/150A) as examples, which have the same voltage rating, to apply to the converters of urban rail vehicles, whose switching frequency, power density and efficiency are analyzed and contrasted. The results show that the switching frequency of the SiC MOSFET converter can be increased to 50kHz, at the same time its power density and efficiency are significantly higher than that of the Si IGBT converter.

scholarly journals Research on Improved Droop Control Strategy of Microsource Inverter Based on Internet of Things

2021 ◽  
Vol 2021 ◽  
pp. 1-8
Author(s):  
Di Bai ◽  
Tieyan Zhang ◽  
Zheng Yang
Keyword(s):  
Control Strategy ◽  
Power Supply ◽  
Power Distribution ◽  
Reactive Power ◽  
Control Method ◽  
Electronic Devices ◽  
Stable Operation ◽  
Power Electronic ◽  
Distributed Power ◽  
Virtual Impedance

Microgrid connects the distributed power supply with the assistance of power electronic devices. Power electronic devices, especially in the inversion link, play a crucial role in the access of distributed power to microgrid. Whether in grid-connected mode or island mode, the control method of inverters is related to the stable operation of distributed power supply and plays an important role in the control strategy of microgrid. In this paper, by adding the drop control of controllable virtual impedance, the power coupling problem caused by resistive line impedance is reduced, and virtual impedance key points such as voltage feedback and frequency compensation are added. By optimizing the power reference value, the parallel operation stability of the control strategy is improved. The experimental results show that the proposed method improves not only the stability of the system and the power quality but also the accuracy of reactive power distribution.

Fast Transient and Intensified Heat Dissipation Applicable to High Heat Flux Density

2011 ◽  
Author(s):  
Jing Li ◽  
Shuanshi Fan ◽  
Zemin Yao ◽  
Jing Li ◽  
Xinli Wei
Keyword(s):  
Heat Flux ◽  
Flux Density ◽  
Heat Flux Density ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Spray Cooling ◽  
High Heat ◽  
High Heat Flux ◽  
Power Electronic ◽  
Fast Transient

In this paper, in order to solve the problem of intensified heat dissipation in high power electronic devices, a fast transient and intensified heat dissipation technology was put forward by comparing many heat transfer modes based on the analytical study on the existing technologies about heat dissipation at high heat flux density and about fast heat transport. This technology combined spray cooling technology with fast endothermic chemical reaction processes; we summarized the characteristics of media applicable to an environment with transient high heat flux density by comparing various parameters of many sprayed media in the spray cooling process. According to the energy balance of endothermic chemical reactions of relevant media, we determined the media (mainly carbon dioxide hydrate) applicable to the fast transient and intensified heat dissipation technology and presented the conditions for the chemical reactions. We analyzed the methods controlling the instantaneous chemical reaction rate and proposed the structural characteristics of the chemical reactor so as to ensure that the time for heat removal will be control to around 0.01 second. Thus, the problem of fast transient heat dissipation in high power electronic devices, etc. would be radically solved.

scholarly journals Central Processing Unit Binary Cooling System using Tetrafluoroethane as Refrigerant

2019 ◽  
Vol 9 (2) ◽  
pp. 1607-1612
Keyword(s):  
Performance Index ◽  
Heat Dissipation ◽  
Cooling System ◽  
Electronic Devices ◽  
Processing Unit ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Desktop Computer ◽  
Central Processing ◽  
Vapor Compression Refrigeration

Electronic devices and instruments generate heat that can cause serious damage and low efficiency towards its components. The heat that the different electronic elements and components emit can decrease both efficiency and life capacity of the device. And with the increase of use of electronic devices in industries and processes, heat dissipation in electronic devices should be taken into strict consideration. This study aims to develop a cooling system under vapor compression refrigeration system. The prototype fabricated was designed for the cooling system of two Central Processing Units of desktop computer which can be as good equivalent for the electronic devices in industries. Though ventilation was present in the processing units, certain condition such as condition in surroundings can be of great help to improve the device efficiency. This study also aims to analyze the CPU’s efficiency in relation to lowering ventilation temperatures. The vapor compression refrigeration system will be the main device used for lowering and maintaining a suitable temperature inside the CPU casing. The system works like a centralized air-conditioning system wherein the air from the surroundings will be cooled down by the evaporator in the vapor compression refrigeration system. The cooled air will then be delivered to the CPU through the installed air ducting connections. The recording of CPU’s efficiency is provided by the installed software. It also measures the air conditioned parameters and computation of the CPU power consumption. The results from the test and the analysis of the gathered data showed that 165 watts of heat dissipated was removed by the cooling system and the CPU performance index rose up from 424 to 446 with a discharge air temperature of 29.67 oC. Based from the result, the fabricated binary cooling system is efficient enough to increase the performance index of the CPU and absorbing heat dissipated by the device

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