Soldering and Brazing Metals to Ceramics at Room Temperature Using a Novel Nanotechnology

2006 ◽  
Vol 45 ◽  
pp. 1578-1587 ◽  
Author(s):  
A. Duckham ◽  
J. Levin ◽  
T.P. Weihs
Keyword(s):  
Low Temperature ◽  
Room Temperature ◽  
Thermal Stresses ◽  
Local Heat ◽  
Bonding Process ◽  
Free Standing ◽  
Multilayer Foils ◽  
Heats Of Mixing ◽  
Reactive Foils ◽  
Low Temperature Process

This paper reviews a new, low-temperature process for soldering and brazing ceramics to metals that is based on the use of reactive multilayer foils as a local heat source. The reactive foils range in thickness from 40μm to 100μm and contain many nanoscale layers that alternate between materials with large heats of mixing, such as Al and Ni. By inserting a free-standing foil between two solder (or braze) layers and two components, heat generated by the reaction of the foil melts the solder (or braze) and consequently bonds the components. The use of reactive foils eliminates the need for a furnace, and dramatically reduces the heating of the components being bonded. Thus ceramics and metals can be joined over large areas without the damaging thermal stresses that are typically encountered when cooling in furnace soldering or brazing operations. This paper draws on earlier work to review the bonding process and its application to a variety of ceramic-metal systems. Predictions of thermal profiles during bonding and the resulting residual stresses are described and compared with results for conventional soldering or brazing processes. The microstructure, uniformity, and physical properties of the reactive foil bonds are reviewed as well, using several different ceramic-metal systems as examples.

NanoBond® Assembly – A Rapid, Room Temperature Soldering Process

2011 ◽  
Vol 2011 (1) ◽  
pp. 000521-000526
Author(s):  
Jacques Matteau
Keyword(s):  
Room Temperature ◽  
New Technology ◽  
Local Heat ◽  
Temperature Sensitive ◽  
Ignition Process ◽  
Light Emitting ◽  
Exothermic Reactions ◽  
Soldering Process ◽  
Order Of Magnitude ◽  
Reactive Foils

Indium Corporation of America has commercialized a new technology that will revolutionize how manufacturers join components using solder materials. (See Figure 1) The joining process is based on the use of reactive multilayer foils as local heat sources. The foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be ignited at room temperature through an ignition process. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds are completed at room temperature in air, argon or vacuum in approximately one second. The resulting metallic joints exhibit thermal conductivities two orders of magnitude higher, and thermal resistivity’s an order of magnitude lower, than current commercial TIMs. The use of reactive foils as a local heat source eliminates the need for torches, furnaces, or lasers, speeds the soldering processes, and dramatically reduces the total heat that is needed. Thus, temperature-sensitive or small components can be joined without thermal damage or excessive heating. In addition, mismatches in thermal contraction on cooling can be avoided because components see very small increases in temperature. This is particularly beneficial for joining metals to ceramics. The fabrication and characterization of the reactive foils is described, and the value proposition for NanoBonding is presented. This presentation also shows the applicability of this platform technology to many areas of packaging including Thermal Interface Materials, microelectronics, optoelectronics, and Light Emitting Diodes (LEDs)

Modeling Self-Propagating Exothermic Reactions in Multilayer Systems

1997 ◽  
Vol 481 ◽  
Author(s):  
S. Jayaraman ◽  
A. B. Mann ◽  
O. M. Knio ◽  
D. Van Heerden ◽  
G. Bao ◽  
...  
Keyword(s):  
Critical Thickness ◽  
Temperature Profiles ◽  
Bilayer Thickness ◽  
Free Standing ◽  
Multilayer Systems ◽  
Exothermic Reactions ◽  
Multilayer Foils ◽  
Reaction Characteristics ◽  
Reactive Foils ◽  
Experimental Values

ABSTRACTSelf-propagating reactions in free-standing multilayer foils provide a unique opportunity to study very rapid, diffusion-based transformations in non-equilibrium material systems. To fully understand the coupling between mass and thermal diffusion controlling these reactions and to optimize the commercial use of reactive foils, we have undertaken analytical and numerical modeling. Our analytical model predicts an increase in the reaction velocities with decreasing bilayer thickness down to a critical bilayer thickness and a reversal in this trend below the critical thickness. Predicting reaction characteristics such as the flame thermal width, the reaction zone width and the effect of variations in material properties with temperature has proven analytically intractable. To overcome these limitations, we have also used numerical methods to determine the composition and temperature profiles ahead of the reaction front for different multilayer periods and premixing. The results are compared with experimental values where possible.

A low-temperature technique for measuring enthalpies of formation

1996 ◽  
Vol 11 (6) ◽  
pp. 1403-1409 ◽  
Author(s):  
T. P. Weihs ◽  
T. W. Barbee ◽  
M. A. Wall
Keyword(s):  
Low Temperature ◽  
Enthalpy Of Formation ◽  
Enthalpies Of Formation ◽  
Scanning Calorimetry ◽  
Free Standing ◽  
Metal Compounds ◽  
Si Substrates ◽  
Multilayer Foils ◽  
Formation Enthalpies ◽  
The Enthalpy Of Formation

A technique to accurately measure the formation enthalpies of transition metal compounds at relatively low temperatures using thick multilayer foils and differential scanning calorimetry is demonstrated. The enthalpy of formation of Cu51Zr14 was measured using 25 μm thick, free-standing Cu–Zr multilayer foils. The multilayers were deposited onto Si substrates using a planetary, magnetron source sputtering system. They were removed from their substrates, cut into 6 mm diameter specimens, and scanned in temperature from 50 °C to 725 °C in a differential scanning calorimeter. Three distinct exothermic reactions were systematically observed. The heats from the first two reactions were summed and then analyzed using a simple model that accounts for interfacial reactions and heat losses during deposition. The enthalpy of formation for Cu51Zr14 was measured to be 14.3 ± 0.3 kJ/mol. This quantity agrees with the single value of ΔHf = 14.07 ± 1.07 kJ/mol reported in the literature for this Cu–Zr compound. The advantages of measuring formation enthalpies using thick multilayer foils and low temperature calorimetry are discussed.

Localized Parylene-C Bonding for Micro Packaging and Cell Encapsulation using Reactive Multilayer Foils

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 000925-000940
Author(s):  
Xiaotun Qiu ◽  
David Welch ◽  
Jennifer Blain Christen ◽  
Rui Tang ◽  
Jie Zhu ◽  
...  
Keyword(s):  
Room Temperature ◽  
Cell Encapsulation ◽  
Mouse Fibroblast ◽  
Bonding Process ◽  
Parylene C ◽  
Mems Packaging ◽  
Multilayer Foils ◽  
Localized Heating ◽  
Nih 3T3 ◽  
Bonding Technique

This abstract described a novel physiologically compatible wafer bonding technique for bio-microelectromechnical systems (bio-MEMS) packaging. Room temperature bonding was performed between Parylene-C and silicon wafers with a thin Parylene-C coating using reactive Ni/Al multilayer foils as localized heaters. Live NIH 3T3 mouse fibroblast cells were encapsulated in the package and they survived the bonding process owing to the localization of heating. A numerical model was developed to predict the temperature evolutions in the parylene layers, silicon wafer and the encapsulated liquid during the bonding process. The simulation results were in agreement with the cell encapsulation experiment revealing that localized heating occurred in this bonding approach. This study proved the feasibility of reactive multilayer foil bonding technique for broad applications in packaging bio-MEMS and microfluidic systems.

Low Temperature UV Photodeposition of Aluminum from TMA: Characterization and Control of Deposit Composition

1987 ◽  
Vol 101 ◽  
Author(s):  
T.E. Orlowski ◽  
D.A. Mantell
Keyword(s):  
Low Temperature ◽  
Photoelectron Spectroscopy ◽  
Laser Processing ◽  
Room Temperature ◽  
Sample Surface ◽  
High Deposition Rate ◽  
X Ray ◽  
Laser Pulse Intensity ◽  
And Control ◽  
Low Temperature Process

ABSTRACTLaser processing conditions have been discovered which provide high-quality aluminum deposits from the photodecomposition of TMA (trimethylaluminum). Using an ArF excimer laser, AI can be deposited on Si and glass in well defined patterns at high rates (600 A/min) at low TMA pressure (≤ 30 mtorr) if substrate temperature is kept low (≤ 25C). Deposit composition is characterized by x-ray photoelectron spectroscopy (XPS) which shows that deposit carbon content depends upon laser pulse intensity varying nearly quadratically from < 1% at 8 mJ/cm2 to nearly 25% at 80 mJ/cm2. Mass spectroscopie analysis during laser processing identifies methane, ethylene and ethane as primary hydrocarbon photoproducts. Thermal desorption measurements indicate that many adlayers of adsorbed TMA leave the sample surface with only slight heating (35C) providing an explanation for observing higher growth rates at room temperature. Because of the high deposition rate and deposit quality observed, this low temperature process provides an attractive processing alternative for interconnect repair on Si and glass.

Survival of mouse blastocysts after low-temperature preservation under high pressure

2004 ◽  
Vol 52 (4) ◽  
pp. 479-487 ◽  
Author(s):  
Cs. Pribenszky ◽  
M. Molnár ◽  
S. Cseh ◽  
L. Solti
Keyword(s):  
Phase Transition ◽  
Hydrostatic Pressure ◽  
Low Temperature ◽  
High Hydrostatic Pressure ◽  
Room Temperature ◽  
Freezing Point ◽  
Significant Loss ◽  
Embryo Cryopreservation ◽  
Subzero Temperatures ◽  
Survival Capacity

Cryoinjuries are almost inevitable during the freezing of embryos. The present study examines the possibility of using high hydrostatic pressure to reduce substantially the freezing point of the embryo-holding solution, in order to preserve embryos at subzero temperatures, thus avoiding all the disadvantages of freezing. The pressure of 210 MPa lowers the phase transition temperature of water to -21°C. According to the results of this study, embryos can survive in high hydrostatic pressure environment at room temperature; the time embryos spend under pressure without significant loss in their survival could be lengthened by gradual decompression. Pressurisation at 0°C significantly reduced the survival capacity of the embryos; gradual decompression had no beneficial effect on survival at that stage. Based on the findings, the use of the phenomena is not applicable in this form, since pressure and low temperature together proved to be lethal to the embryos in these experiments. The application of hydrostatic pressure in embryo cryopreservation requires more detailed research, although the experience gained in this study can be applied usefully in different circumstances.

Integrated low-temperature process for the fabrication of amorphous Si nanoparticles embedded in Al2 O3 for non-volatile memory application

2016 ◽  
Vol 213 (9) ◽  
pp. 2446-2451 ◽  
Author(s):  
Klemens Ilse ◽  
Thomas Schneider ◽  
Johannes Ziegler ◽  
Alexander Sprafke ◽  
Ralf B. Wehrspohn
Keyword(s):  
Low Temperature ◽  
Si Nanoparticles ◽  
Non Volatile Memory ◽  
Amorphous Si ◽  
Volatile Memory ◽  
Low Temperature Process
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